Abstract: A semiconductor package including a core structure, in which a first and second semiconductor chips and passive components are embedded, a connection structure disposed on a first side of the core structure, and including a redistribution layer electrically connected to the first and second semiconductor chips and the passive components, and a metal pattern layer and a backside wiring layer disposed on a second side of the core structure opposing the first side, and spaced apart from each other. The core structure includes a first metal layer surrounding the first semiconductor chip, a second metal layer surrounding the first semiconductor chip, and the first metal layer, a third metal layer surrounding the second semiconductor chip, and a fourth metal layer surrounding the second semiconductor chip, the passive components, and the third metal layer, and each of the first to fourth metal layers is electrically connected to the metal pattern layer.

Abstract: A system and a method for controlling a vehicle fuel cell includes: a gradient identification unit configured to identify a gradient range of an expected traveling route of a vehicle; and a control unit configured to control charging and discharging of a vehicle battery and a degree of power generation by a fuel cell of the vehicle in advance, before the vehicle enters the gradient range, according to whether the gradient range of the expected traveling route identified by the gradient identification unit is uphill or downhill.

Abstract: A fan-out semiconductor package including a first redistribution layer; a first semiconductor chip on the first redistribution layer; an interconnector on the first redistribution layer and spaced apart from the first semiconductor chip; a molded layer covering the interconnector and side surfaces of the first semiconductor chip; and a second redistribution layer on the molded layer, wherein the interconnector includes a metal ball and is electrically connected to the first redistribution layer, the second redistribution layer includes a first line wiring, and a first via electrically connected to the first line wiring, the first via is connected to the interconnector, and a part of the first via is in the molded layer.

Abstract: A semiconductor package including a core structure, in which a first and second semiconductor chips and passive components are embedded, a connection structure disposed on a first side of the core structure, and including a redistribution layer electrically connected to the first and second semiconductor chips and the passive components, and a metal pattern layer and a backside wiring layer disposed on a second side of the core structure opposing the first side, and spaced apart from each other. The core structure includes a first metal layer surrounding the first semiconductor chip, a second metal layer surrounding the first semiconductor chip, and the first metal layer, a third metal layer surrounding the second semiconductor chip, and a fourth metal layer surrounding the second semiconductor chip, the passive components, and the third metal layer, and each of the first to fourth metal layers is electrically connected to the metal pattern layer.

Abstract: A method including forming a frame having an opening, forming a first metal layer, forming a first encapsulant, forming an insulation layer on the first metal layer, forming a first through-hole and a second through-hole penetrating the insulation layer and the first encapsulant, forming a second metal layer and a third metal layer, forming a second encapsulant, forming a first metal via and a second metal via penetrating the second encapsulant and a metal pattern layer on the second encapsulant, and forming a connection structure. The first metal layer and the second metal layer respectively are formed to extend to a surface of each of the first encapsulant and the frame, facing the metal pattern layer, and the first metal layer and the second metal layer are connected to the metal pattern layer through the first metal via and the second metal via having heights different from each other.

Abstract: A side mirror system for a vehicle is provided. The side mirror system includes a camera disposed outside a vehicle and capturing a peripheral area of the vehicle, an electronic side mirror including a mirror panel and a display panel, a moving device moving the electronic side mirror to an inside or an outside of the vehicle, and at least one control circuit electrically connected to the camera, the electronic side mirror, and the moving device, wherein the at least one control circuit controls the electronic side mirror such that the electronic side mirror outputs an image obtained by the camera through the display panel or the peripheral area of the vehicle is reflected by the mirror panel and controls the moving device such that the electronic side mirror moves from the outside of the vehicle to the inside of the vehicle, when a specified condition is satisfied.

Abstract: A fan-out semiconductor package including a first redistribution layer; a first semiconductor chip on the first redistribution layer; an interconnector on the first redistribution layer and spaced apart from the first semiconductor chip; a molded layer covering the interconnector and side surfaces of the first semiconductor chip; and a second redistribution layer on the molded layer, wherein the interconnector includes a metal ball and is electrically connected to the first redistribution layer, the second redistribution layer includes a first line wiring, and a first via electrically connected to the first line wiring, the first via is connected to the interconnector, and a part of the first via is in the molded layer.

Abstract: A ball-shaped light heat generating fiber aggregate and a method for producing the same include a light heat generating material that is sprayed and applied to any one filament or a mixture of two or more filaments selected from the group consisting of a polyamide-based filament, a polyester-based filament, and a polypropylene-based filament, opening and mixing the same to separate the filaments, and producing a ball-shaped fiber aggregate.

Abstract: A method including forming a frame having an opening, forming a first metal layer, forming a first encapsulant, forming an insulation layer on the first metal layer, forming a first through-hole and a second through-hole penetrating the insulation layer and the first encapsulant, forming a second metal layer and a third metal layer, forming a second encapsulant, forming a first metal via and a second metal via penetrating the second encapsulant and a metal pattern layer on the second encapsulant, and forming a connection structure. The first metal layer and the second metal layer respectively are formed to extend to a surface of each of the first encapsulant and the frame, facing the metal pattern layer, and the first metal layer and the second metal layer are connected to the metal pattern layer through the first metal via and the second metal via having heights different from each other.

Abstract: A semiconductor package includes a core structure having a first through-hole and including a frame having an opening, a passive component disposed in the opening, a first encapsulant covering the frame and the passive component, a first metal layer disposed on an inner surface of the first through-hole, and a second metal layer disposed on an inner surface of the opening; a first semiconductor chip disposed in the first through-hole and having a first connection pad; a second encapsulant covering the core structure and the first semiconductor chip; a connection structure disposed on the core structure and the first semiconductor chip and including a redistribution layer; and a metal pattern layer disposed on the second encapsulant. The first and second metal layers are connected to the metal pattern layer through first and second metal vias having heights different from each other.

Abstract: A semiconductor package includes a frame having first and second through-portions, first and second semiconductor chips, respectively in the first and second through-portions, each having a first surface, on which a connection pad is disposed, a first encapsulant covering at least a portion of the first and second semiconductor chips, a first connection member on the first and second semiconductor chips including a first redistribution layer electrically connected to the connection pads of the first and second semiconductor chips and a heat dissipation pattern layer, at least one passive component above the first semiconductor chip on the first connection member, and at least one heat dissipation structure above the second semiconductor chip on the first connection member and connected to the heat dissipation pattern layer.

Abstract: A semiconductor package includes a frame having first and second through-portions, first and second semiconductor chips, respectively in the first and second through-portions, each having a first surface, on which a connection pad is disposed, a first encapsulant covering at least a portion of the first and second semiconductor chips, a first connection member on the first and second semiconductor chips including a first redistribution layer electrically connected to the connection pads of the first and second semiconductor chips and a heat dissipation pattern layer, at least one passive component above the first semiconductor chip on the first connection member, and at least one heat dissipation structure above the second semiconductor chip on the first connection member and connected to the heat dissipation pattern layer.

Abstract: A semiconductor package includes a core structure having a first through-hole and including a frame having an opening, a passive component disposed in the opening, a first encapsulant covering the frame and the passive component, a first metal layer disposed on an inner surface of the first through-hole, and a second metal layer disposed on an inner surface of the opening; a first semiconductor chip disposed in the first through-hole and having a first connection pad; a second encapsulant covering the core structure and the first semiconductor chip; a connection structure disposed on the core structure and the first semiconductor chip and including a redistribution layer; and a metal pattern layer disposed on the second encapsulant. The first and second metal layers are connected to the metal pattern layer through first and second metal vias having heights different from each other.

Abstract: Disclosed herein is a pump of an integrated brake system. The pump includes a motor, a gear unit which converts a rotating force of the motor into linear reciprocating movement, a piston assembly which is connected to the gear unit and reciprocates based on power conversion of the gear unit, a piston housing which accommodates the piston assembly, and a fixed rod fixedly disposed in the piston housing in a longitudinal direction. Here, the piston assembly includes a coupling groove formed therein, into which the fixed rod is inserted.

Abstract: An electronic apparatus includes: a connector which is configured to enable one of measurement devices for measuring different types of bio signals to be selectively attached thereto or detached therefrom; a communication device configured to communicate with an external apparatus; and a processor configured to, in response to the measurement device being attached to the connector, obtain identification information of the attached measurement device and transmit the identification information to the external apparatus, and control the attached measurement device based on a control command received from the external apparatus.

Abstract: A side mirror system for a vehicle is provided. The side mirror system includes a camera disposed outside a vehicle and capturing a peripheral area of the vehicle, an electronic side mirror including a mirror panel and a display panel, a moving device moving the electronic side mirror to an inside or an outside of the vehicle, and at least one control circuit electrically connected to the camera, the electronic side mirror, and the moving device, wherein the at least one control circuit controls the electronic side mirror such that the electronic side mirror outputs an image obtained by the camera through the display panel or the peripheral area of the vehicle is reflected by the mirror panel and controls the moving device such that the electronic side mirror moves from the outside of the vehicle to the inside of the vehicle, when a specified condition is satisfied.

Abstract: An electric brake system is disclosed.

Abstract: An electric brake system includes a hydraulic pressure supply device including a first pressure chamber provided at one side of a piston movably accommodated inside a cylinder block, and a second pressure chamber provided at other side of the piston, a first hydraulic flow path communicating with the first pressure chamber, second and third hydraulic flow paths branching from the first hydraulic flow path, a fourth hydraulic flow path communicating with the second pressure chamber, a fifth hydraulic flow path branching from the fourth hydraulic flow path and connected to the second hydraulic flow path, a sixth hydraulic flow path branching from the fourth hydraulic flow path and connected to the third hydraulic flow path, and first and second hydraulic circuit including flow paths branching from the second or third hydraulic flow path and connected to wheel cylinders.

Abstract: An electric brake system is disclosed.

Abstract: An electric brake system includes a hydraulic pressure supply device configured to generate hydraulic pressure using a piston which is operated by an electrical signal that is output corresponding to a displacement of a brake pedal, and including a first pressure chamber and a second pressure chamber, a first hydraulic flow path configured to communicate with the first pressure chamber, a second hydraulic flow path configured to communicate with the first pressure chamber, a third hydraulic flow path configured to communicate with the second pressure chamber, a fourth hydraulic flow path branching from the third hydraulic flow path and connected to the first hydraulic flow path, a fifth hydraulic flow path branching from the third hydraulic flow path and connected to the second hydraulic flow path.