Abstract: Disclosed are an epoxy coating composition for protection of electronic circuit boards and a preparation method thereof to improve the reliability and durability of the electronic circuit board. The epoxy coating composition includes an amount of about 35 to 70 wt % of a modified epoxy resin including a fatty acid-acrylic epoxy resin, an amount of about 30 to 65 wt % of a first solvent, an amount of about 0.1 to 1.2 wt % of a metal catalyst, an amount of about 0.05 to 0.45 wt % of a defoamer, and an amount of about 0.1 to 0.5 wt % of a surface conditioner, based on the total weight of the epoxy coating composition. The fatty acid-acrylic epoxy resin is prepared by polymerizing a reactant that is obtained by a reaction between an epoxy resin mixture and an unsaturated fatty acid with an acrylic resin using a polymerization catalyst.