Patents by Inventor Chan-Li Lin

Chan-Li Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic Substrate and Method for Reducing Surface Roughness of Metal Filled Via Holes Thereon
    Publication number: 20140041909
    Abstract: A method for reducing roughens of the metals on a ceramic substrate having metal filled via holes, comprising forming via holes, a seed layer, and through film coating, exposure and development process followed by multiple steps of DC electroplating to achieve copper circuit with desired surface roughness.
    Type: Application
    Filed: July 17, 2013
    Publication date: February 13, 2014
    Inventors: Hsiang-Wei TSENG, Kuan-Chou Chen, Han-Chung Chang, Cheng-Feng Chou, Chan-Li Lin, Yuan-Chen Hsu