Abstract: A method for predicting a reactant molecule including performing feature extraction on a product molecule to obtain a feature of the product molecule, predicting, based on the feature of the product molecule, a conversion path between the product molecule and a plurality of reactant molecules using a reverse reaction prediction model, editing an edited object indicated by each editing action based on an edited state indicated by each editing action in the editing sequence to obtain a plurality of synthons corresponding to the product molecule, and adding, for each synthon, a motif indicated by each synthon completion action based on at least one synthon completion action corresponding to each synthon in the synthon completion sequence and an interface atom indicated by each synthon completion action in the at least one synthon completion action to obtain a plurality of reactant molecules corresponding to the plurality of synthons.

Abstract: A method for predicting retrosynthesis of a compound molecule and a related apparatus. The method includes: obtaining a target molecule and determining the target molecule as a root node in a tree structure, then, expanding the first leaf node through a target retrosynthesis model to obtain a plurality of second leaf nodes, further, recursively processing the predicted molecule set corresponding to the second leaf nodes and determining a terminal node that satisfies a preset condition; and then, traversing path information corresponding to the terminal node to determine a retrosynthetic path of the target molecule. In this way, a retrosynthesis prediction process of a multi-step reaction is realized. Leaf nodes are gradually recursively expanded and screened, to ensure the reliability of reactants determined by the retrosynthesis prediction process of the multi-step reaction, thereby improving the accuracy of prediction of retrosynthesis of compound molecules.

Abstract: A retaining ring for CMP is disclosed. The retaining ring has a plurality of grooves. The grooves have rounded sidewalls. Because the sidewalls of the grooves of the retaining ring are rounded, the slurry is not apt to accumulate around them and the pad is less scratched. Accordingly, the micro-scratches on the wafer surface are reduced and the yield of the CMP step is increased. Its operational method and application system are also disclosed in this invention.

Abstract: A method of removing an insulating layer on a substrate is described, including a first CMP process and a second CMP process performed in sequence, wherein the polishing slurry used in the first CMP process and that used in the second CMP process have substantially the same pH value that exceeds 7.0. A cleaning step is conducted between the first and the second CMP processes to remove a specific substance which would otherwise cause undesired particles to form in the second CMP process.

Abstract: A solution for fixed abrasive chemical mechanical polishing process including a protection constituent, a hydrolysis constituent and water is described. The protection constituent is used to protect a silicon nitride and its concentration is between 0.001 wt % and 10 wt %. The hydrolysis constituent is used to hydrolyze a silicon oxide and its concentration is between 0.001 wt % and 10 wt %. The concentration ofthe water is between 80 wt % and 99.998 wt %.