Patents by Inventor Chan M. Han

Chan M. Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-frequency, high-density semiconductor chip package with screening bonding wires
    Patent number: 5606196
    Abstract: A semiconductor device package including a semiconductor chip formed with a plurality of bonding pads including at least two multiple-bonding pads to which identical signals are transmitted; a substrate provided with a chip-support and a plurality of conductors for electrically connecting the chip to external devices; a plurality of bonding wires for electrically connecting said bonding pads to the conductors including multiple-bonding wires for electrically connecting the multiple-bonding pads to corresponding conductors; and a current looper for screening magnetic fields generated from the bonding wires so that the magnetic fields cannot interfere each other, the current looper being located between the multiple-bonding wires and bonded to the substrate at both ends.
    Type: Grant
    Filed: December 29, 1995
    Date of Patent: February 25, 1997
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hai Y. Lee, Kyung S. Lee, Chan M. Han