Patents by Inventor Chan Meng

Chan Meng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080023806
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Application
    Filed: October 5, 2007
    Publication date: January 31, 2008
    Applicant: Carsem (M) Sdn. Bhd.
    Inventors: Lee Huat, Chan Meng, Cheong Tuck, Lee Sin, Phuah Keung, Araventhan Eturajulu, Liow Keng, Thum Kong, Chen Hing
  • Publication number: 20060093017
    Abstract: A drive circuit for activating a switch in a switching converter, which has output terminals (K3, K4) for providing an output voltage (Vout), and in which a feedback signal (FB) that varies with the output voltage (Vout) is available.
    Type: Application
    Filed: October 13, 2005
    Publication date: May 4, 2006
    Applicant: Infineon Technologies AG
    Inventors: Xiao-Wu Gong, Huang Cheong, Chan Meng
  • Publication number: 20050104169
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Application
    Filed: December 23, 2004
    Publication date: May 19, 2005
    Applicant: Carsem Semiconductor Sdn. Bhd.
    Inventors: Lee Huat, Chan Meng, Cheong Tuck, Lee Sin, Phuah Keung, Araventhan Eturajulu, Liow Keng, Thum Kong, Chen Hing
  • Publication number: 20040166234
    Abstract: The present invention provides a method and apparatus for coating a light source to provide a modified output spectrum. Liquid adhesive is applied to the light source to form an adhesive layer. Luminescent material is fluidized and at least a portion of the adhesive layer immersed in the fluidized luminescent material to form a coated light source. The luminescent material can be a mixture of a phosphor compound and a fluidization enhancement substance, such as fumed silica.
    Type: Application
    Filed: February 26, 2003
    Publication date: August 26, 2004
    Inventors: Bee Yin Janet Chua, Boon Chun Tan, Chan Meng Leong