Abstract: A semiconductor memory device includes a substrate having a cell region and a contact region with a peripheral circuit region, first and second stacks on the cell region, and a first peripheral transistor on the peripheral circuit region. Each of the first and second stacks includes semiconductor patterns stacked, in a vertical direction, on the cell region, bit lines stacked in the vertical direction on the cell region and respectively connected to first ends of the semiconductor patterns, each of the bit lines extending, in a horizontal direction with respect to the upper surface of the substrate, from the cell region to the contact region, and a word line disposed adjacent to the semiconductor patterns and extending in the vertical direction from the cell region of the substrate. The first peripheral transistor is disposed between the bit lines of the first stack and the bit lines of the second stack.

Abstract: A semiconductor memory device includes a substrate having a cell region and a contact region with a peripheral circuit region, first and second stacks on the cell region, and a first peripheral transistor on the peripheral circuit region. Each of the first and second stacks includes semiconductor patterns stacked, in a vertical direction, on the cell region, bit lines stacked in the vertical direction on the cell region and respectively connected to first ends of the semiconductor patterns, each of the bit lines extending, in a horizontal direction with respect to the upper surface of the substrate, from the cell region to the contact region, and a word line disposed adjacent to the semiconductor patterns and extending in the vertical direction from the cell region of the substrate. The first peripheral transistor is disposed between the bit lines of the first stack and the bit lines of the second stack.

Abstract: Semiconductor devices, and methods for forming the same, include forming a first wiring film and an etching buffer film in a cell array region and a peripheral circuit region of a substrate, and forming a contact hole by selectively etching the etching buffer film and the first wiring film so as to expose an active region of the cell array region and at least a part of a field isolation region adjacent thereto. A bit line contact is formed in the contact hole to be in contact with the active region, and a second wiring film is formed over the substrate. By patterning the second wiring film, the bit line contact, the etching buffer film, and the first wiring film, a bit line is formed in the cell array region and a peripheral gate is formed in the peripheral circuit region.

Abstract: A semiconductor device may include a substrate including an active pattern delimited by a device isolation pattern, a gate electrode crossing the active pattern, a first impurity region and a second impurity region in the active pattern on both sides of the gate electrode, a bit line crossing the gate electrode, a first contact electrically connecting the first impurity region with the bit line, and a first nitride pattern on a lower side surface of the first contact. A width of the first contact measured perpendicular to an extending direction of the bit line may be substantially equal to that of the bit line.

Abstract: Semiconductor devices, and methods for forming the same, include forming a first wiring film and an etching buffer film in a cell array region and a peripheral circuit region of a substrate, and forming a contact hole by selectively etching the etching buffer film and the first wiring film so as to expose an active region of the cell array region and at least a part of a field isolation region adjacent thereto. A bit line contact is formed in the contact hole to be in contact with the active region, and a second wiring film is formed over the substrate. By patterning the second wiring film, the bit line contact, the etching buffer film, and the first wiring film, a bit line is formed in the cell array region and a peripheral gate is formed in the peripheral circuit region.

Abstract: A semiconductor device includes a conductive line, a diode on the conductive line, one or more insulating patterns adjacent to diode, and a data storage region coupled to the diode. An upper surface of the diode is between the one or more insulating patterns and the data storage region. The data storage region may include a phase-change region, and the diode may taper in width between two insulating patterns in one arrangement.

Abstract: A semiconductor device includes a conductive line, a diode on the conductive line, one or more insulating patterns adjacent to diode, and a data storage region coupled to the diode. An upper surface of the diode is between the one or more insulating patterns and the data storage region. The data storage region may include a phase-change region, and the diode may taper in width between two insulating patterns in one arrangement.

Abstract: A semiconductor device may include a substrate including an active pattern delimited by a device isolation pattern, a gate electrode crossing the active pattern, a first impurity region and a second impurity region in the active pattern on both sides of the gate electrode, a bit line crossing the gate electrode, a first contact electrically connecting the first impurity region with the bit line, and a first nitride pattern on a lower side surface of the first contact. A width of the first contact measured perpendicular to an extending direction of the bit line may be substantially equal to that of the bit line.

Abstract: A device isolation layer is formed in a substrate to define spaced-apart linear active regions in the substrate. Buried gate patterns are formed in the substrate and extending along a first direction to cross the active regions. An etch stop layer and a first insulating layer are formed on the substrate. Bit line structures are formed on the first insulating layer and extending along a second direction transverse to the first direction to cross the active regions. A second insulating layer is formed on the bit line structures. Contact plugs are formed penetrating the second insulating layer, the first insulating layer, and the etch stop layer to contact one of the active regions between adjacent ones of the bit line structures.