Patents by Inventor Chan S. Chung

Chan S. Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYMERS WITH METAL FILLER FOR EMI SHIELDING
    Publication number: 20120177906
    Abstract: A composite material includes a thermoplastic material, and a metallic filler dispersed within the thermoplastic material. The metallic filler may be fibrous, particulate or a combination thereof. The metallic filler may have a length in a range of about 3 mm to about 10 mm, and/or a mean particle size of about 2 microns to about 10 microns. The composite material may have a volumetric resistivity of not greater than about 0.5 Ohm·cm. The composite material can be in the form of a sealing component.
    Type: Application
    Filed: December 23, 2011
    Publication date: July 12, 2012
    Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
    Inventors: Jose R. Sousa, Jon M. Lenhert, Chan S. Chung