Patents by Inventor Chanseok LEE

Chanseok LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heterocyclic compound and organic light-emitting device including the same
    Patent number: 11957042
    Abstract: An organic light-emitting device includes a heterocyclic compound represented by Formula 1, wherein A11 is a group represented by one of Formulae 10A to 10D: The organic light-emitting device including the heterocyclic compound may have improved efficiency and/or lifespan characteristics.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: April 9, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Munki Sim, Sunyoung Pak, Junha Park, Hankyu Pak, Jangyeol Baek, Chanseok Oh, Hyoyoung Lee, Minjung Jung, Seokhwan Hwang
  • High-sensitivity sensor comprising conductive thin film containing cracks and method for manufacturing same
    Patent number: 9927311
    Abstract: A high-sensitivity sensor containing cracks is provided. The high-sensitivity sensor is obtained by forming microcracks on a conductive thin film, which is formed on top of a support, wherein the microcracks form a micro joining structure in which the microcracks are electrically changed, short-circuited or open, thereby converting external stimuli into electric signals by generating a change in a resistance value. The high-sensitivity sensor can be useful in a displacement sensor, a pressure sensor, a vibration sensor, artificial skin, a voice recognition system, and the like.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: March 27, 2018
    Assignees: Global Frontier Center-Multiscale Energy Systems, SNU R&DB Foundation, Research & Business Foundation Sungkyunkwan Univ.
    Inventors: Daeshik Kang, Yong Whan Choi, Chanseok Lee, Kahp-Yang Suh, Tae-il Kim, Man Soo Choi
  • HIGH-SENSITIVITY SENSOR COMPRISING CONDUCTIVE THIN FILM CONTAINING CRACKS AND METHOD FOR MANUFACTURING SAME
    Publication number: 20160123820
    Abstract: A high-sensitivity sensor containing cracks is provided. The high-sensitivity sensor is obtained by forming microcracks on a conductive thin film, which is formed on top of a support, wherein the microcracks form a micro joining structure in which the microcracks are electrically changed, short-circuited or open, thereby converting external stimuli into electric signals by generating a change in a resistance value. The high-sensitivity sensor can be useful in a displacement sensor, a pressure sensor, a vibration sensor, artificial skin, a voice recognition system, and the like.
    Type: Application
    Filed: December 3, 2014
    Publication date: May 5, 2016
    Inventors: Daeshik KANG, Yong Whan CHOI, Chanseok LEE, Kahp-Yang SUH, Tae-il KIM, Man Soo CHOI