Abstract: A seat for a vehicle having a fold-and-dive function is proposed. When a seatback is rotated forwards and folded, a seat cushion is moved down, so the fold-and-dive function of the seat is realized. When a full-flat mode is realized by the reclining operation of the seatback, a rear end of the seat cushion is moved up, so a step between the seat cushion and the seatback can be significantly reduced or eliminated. Furthermore, a front link connecting a back cushion interlocking frame and a cushion fixing bracket to perform the fold-and-dive function is installed to have directivity where it is inclined rearwards, thus preventing a submarine phenomenon of the seat in the event of a forward collision.

Abstract: A seat for a vehicle in which user convenience may be improved by implementing various postures with a simple configuration is provided. The seat for a vehicle includes a pair of support rails coupled to the vehicle and arranged to be spaced apart from side to side, a first slide unit slidably installed back and forth on the support rail, a second slide unit slidably installed back and forth on the first slide unit, a pair of cushion side frames spaced apart from side to side, a first link member connecting the cushion side frame and the first slide unit, and a second link member connecting the cushion side frame and the second slide unit.

Abstract: The present disclosure relates to a vehicle seat wherein matchability with a luggage box is maintained when the seat is folded, and a relax mode and a backward relax mode can be implemented. The vehicle seat according to the present disclosure includes: a tilting link configured to tilt a front portion of a seat cushion upwards/downwards; and a sliding bracket having one end to which a seat is connected by a hinge structure such that the seat is tilted around the hinge structure, the other end of the sliding bracket being connected so as to slide forwards/backwards.

Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.

Abstract: An apparatus of tilting a seat cushion of a vehicle, includes a tilting motor, a pinion gear, a sector gear, and a tilting link which perform the tilting operation of the seat cushion and exert a binding force in a tilted state of the seat cushion and are provided to be connected to both of one side and the other side of a seat cushion frame, and has two sector gears positioned on left and right sides and connected to each other by a connection bar so that, by strengthening a binding force of the front portion of the seat cushion, it is possible to secure the safety of passengers in the event of a collision.

Abstract: Disclosed is a water container for camping. The water container for camping of the present invention comprises: a connector part which is coupled to a main body in which water is stored and provided as a discharge passage of the water stored in the main body; an opening/closing part which is coupled to the connector part and provided as an air passage while discharging the water flowing into the connector part by opening/closing one side portion of the connector; and a water inflow prevention part of which one side portion is floated by the water stored in the main body and the other side portion is connected to the connector part so as to prevent the water from flowing into a passage of air to be discharged through the connector part and the opening/closing part.

Abstract: A semiconductor package includes a package substrate, a semiconductor chip, an insulating layer pattern, conductive connecting members and a contact-preventing member. The semiconductor chip is arranged on an upper surface of the package substrate. The semiconductor chip has bonding pads. The insulating layer pattern is formed on the semiconductor chip to expose the bonding pads. The conductive connecting members electrically connect the bonding pads with the package substrate. The contact-preventing member covers an edge portion of the semiconductor chip to prevent a contact between the conductive connecting members and the semiconductor chip. Thus, the conductive connecting members do not make contact with the semiconductor chip.

Abstract: A semiconductor package and a package mounting substrate can be joined using a conductive material column. Each of the semiconductor package and the package mounting substrate include an insulating protective opening exposing a wiring layer therein. The solder column resides within the insulating protective openings to electrically couple the wiring layers. The insulating protective openings protect the solder column against stress faults to form reliable electrical connections and to support high-density electrical connections between the semiconductor package and the package mounting substrate.

Abstract: The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.

Abstract: In the stacked semiconductor package, on a first semiconductor chip, a second semiconductor chip is stacked offset such that a portion of the first semiconductor chip is exposed. At least one first conductor electrically connects the exposed portion of the first semiconductor chip to the second semiconductor chip. The first conductor may be formed such that the first conductor does not extend beyond a periphery of the first semiconductor chip. The first conductor electrically connects at least one bond pad on the first semiconductor chip with at least one bond pad on the second semiconductor chip, and a redistribution pattern electrically connects the bond pad on the second semiconductor chip to a differently positioned bond pad on the second semiconductor chip.

Abstract: In one embodiment, a semiconductor package and a package mounting substrate are joined using a conductive material column such as a solder column. Each of the semiconductor package and the package mounting substrate include an insulating protective opening exposing a wiring layer therein. The solder column resides within the insulating protective openings to electrically couple the wiring layers. By forming the insulating protective openings with sufficient depth, each protects the solder column against stress faults and thereby forms more reliable electrical connections and supports high-density electrical connections between the semiconductor package and the package mounting substrate.

Abstract: A semiconductor package such as a bumped chip carrier (BCC) package has projections extending from a lower surface of a resin encapsulant. Each projection has a concave depression formed thereon. By reflowing a solder layer, external terminals are formed to cover the projections. An interface between the terminals and the projections increases in area, relative to conventional structures, because of the concave depressions. Therefore, the adhesive strength between the terminals and the projections also increases, and, when the BCC package is mounted on a next-level circuit board through the terminals, solder joint is also improved in reliability.

Abstract: The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.

Abstract: A semiconductor package such as a bumped chip carrier (BCC) package has projections extending from a lower surface of a resin encapsulant. Each projection has a concave depression formed thereon. By reflowing a solder layer, external terminals are formed to cover the projections. An interface between the terminals and the projections increases in area, relative to conventional structures, because of the concave depressions. Therefore, the adhesive strength between the terminals and the projections also increases, and, when the BCC package is mounted on a next-level circuit board through the terminals, solder joint is also improved in reliability.

Abstract: In the stacked semiconductor package, on a first semiconductor chip, a second semiconductor chip is stacked offset such that a portion of the first semiconductor chip is exposed. At least one first conductor electrically connects the exposed portion of the first semiconductor chip to the second semiconductor chip. The first conductor may be formed such that the first conductor does not extend beyond a periphery of the first semiconductor chip. The first conductor electrically connects at least one bond pad on the first semiconductor chip with at least one bond pad on the second semiconductor chip, and a redistribution pattern electrically connects the bond pad on the second semiconductor chip to a differently positioned bond pad on the second semiconductor chip.