Patents by Inventor Chan Sung CHUNG

Chan Sung CHUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11525626
    Abstract: A first-in first-out solder container automatic supply management system includes a refrigerating chamber configured to store a plurality of solder containers, a transfer part positioned outside the refrigerating chamber and configured to move at least one of the plurality of solder containers, a stirring part formed at one end of the transfer part and configured to stir the at least one solder container, and a hand part configured to move any one solder container of the at least one solder container positioned on the transfer part to the stirring part.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: December 13, 2022
    Assignee: BOSUNG ENG CO., LTD.
    Inventors: Chan Sung Chung, Ho Yeol Park
  • Publication number: 20200331035
    Abstract: An automatic nozzle cleaning-inspection management system includes a nozzle plate on which target nozzles to be cleaned are arranged, a cleaning chamber including a cleaning portion which cleans the target nozzles, a drying chamber including a drying portion which dries the target nozzles, an inspection chamber including an inspection portion which checks cleaned states of the target nozzles, and a transferring portion which transfers the nozzle plate, wherein the cleaning chamber, the drying chamber, and the inspection chamber are sequentially arranged in a line.
    Type: Application
    Filed: April 22, 2019
    Publication date: October 22, 2020
    Inventor: Chan Sung CHUNG
  • Publication number: 20200333067
    Abstract: A first-in first-out solder container automatic supply management system includes a refrigerating chamber configured to store a plurality of solder containers, a transfer part positioned outside the refrigerating chamber and configured to move at least one of the plurality of solder containers, a stirring part formed at one end of the transfer part and configured to stir the at least one solder container, and a hand part configured to move any one solder container of the at least one solder container positioned on the transfer part to the stirring part.
    Type: Application
    Filed: April 22, 2019
    Publication date: October 22, 2020
    Inventors: Chan Sung CHUNG, Ho Yeol PARK