Patents by Inventor Chan Sung Jung

Chan Sung Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150379925
    Abstract: An organic light emitting display device includes a plurality of pixels, each of the plurality of pixels including: a first sub-pixel configured to emit light of a first color; a second sub-pixel configured to emit light of a second color that is different from the first color; a third sub-pixel configured to emit light of a third color that is different from the first and second colors; and a transmission sub-pixel configured to selectively transmit external light in response to an electrical signal.
    Type: Application
    Filed: September 9, 2015
    Publication date: December 31, 2015
    Inventors: Chan-Sung Jung, Jae-Won Choi, Tae-Hyeog Jung
  • Patent number: 9159295
    Abstract: An organic light emitting display device includes a plurality of pixels, each of the plurality of pixels including: a first sub-pixel configured to emit light of a first color; a second sub-pixel configured to emit light of a second color that is different from the first color; a third sub-pixel configured to emit light of a third color that is different from the first and second colors; and a transmission sub-pixel configured to selectively transmit external light in response to an electrical signal.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: October 13, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Chan-Sung Jung, Jae-Won Choi, Tae-Hyeog Jung
  • Patent number: 8860068
    Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: October 14, 2014
    Assignee: Seoul Semiconductor Co. Ltd.
    Inventors: Tae Won Seo, Sang Cheol Lee, Chan Sung Jung
  • Publication number: 20140225815
    Abstract: An organic light emitting display device includes a plurality of pixels, each of the plurality of pixels including: a first sub-pixel configured to emit light of a first color; a second sub-pixel configured to emit light of a second color that is different from the first color; a third sub-pixel configured to emit light of a third color that is different from the first and second colors; and a transmission sub-pixel configured to selectively transmit external light in response to an electrical signal.
    Type: Application
    Filed: August 23, 2013
    Publication date: August 14, 2014
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Chan-Sung Jung, Jae-Won Choi, Tae-Hyeog Jung
  • Publication number: 20140203321
    Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.
    Type: Application
    Filed: March 26, 2014
    Publication date: July 24, 2014
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Won SEO, Sang Cheol LEE, Chan Sung JUNG
  • Publication number: 20140202014
    Abstract: There is provided a flexible display capable of improving an angle-measuring accuracy using different kinds of sensors and a method of measuring an angle thereof. The flexible display includes a first sensor unit disposed in a first region and including different kinds of sensors, a second sensor unit disposed in a second region adjacent to the first region and including different kinds of sensors, and an angle-measuring unit measuring a folding angle between the first region and the second region in response to sensing signals outputted from the first sensor unit and the second sensor unit.
    Type: Application
    Filed: June 7, 2013
    Publication date: July 24, 2014
    Inventors: Jae-Won Choi, Chan-Sung Jung
  • Publication number: 20120098019
    Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.
    Type: Application
    Filed: January 3, 2012
    Publication date: April 26, 2012
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Tae Won SEO, Sang Cheol LEE, Chan Sung JUNG
  • Patent number: 8120054
    Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: February 21, 2012
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Won Seo, Sang Cheol Lee, Chan Sung Jung
  • Publication number: 20110191707
    Abstract: A user interface using a hologram includes a memory unit to store information on a shape, a function, a position, and a movement pattern for a virtual object; a hologram output unit to project a hologram display area and to display the virtual object in the projected hologram display area; a real object sensing unit to sense a real object in the hologram display area and to generate information on a position and a movement pattern of the real object; a contact recognizing unit to determine the positions and the movement patterns of the respective virtual object and the real object to recognize a contact between the virtual object and the real object; and a control unit to determine whether the recognized contact between the virtual object and the real object corresponds to an input for selecting the virtual object.
    Type: Application
    Filed: August 23, 2010
    Publication date: August 4, 2011
    Applicant: PANTECH CO., LTD.
    Inventors: Han Gweon LEE, Ki Jung KIM, Eung Bong KIM, Soo Been AHN, Gi Seop WON, Hyun Keun LIM, Hyung Yeon LIM, Chan Sung JUNG, Eui Seok HAN
  • Publication number: 20090057704
    Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.
    Type: Application
    Filed: September 4, 2008
    Publication date: March 5, 2009
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Tae Won Seo, Sang Cheol Lee, Chan Sung Jung