Patents by Inventor Chan Sup Park

Chan Sup Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200353928
    Abstract: A vehicle control method may include determining by a controller, a state of a brake pedal wherein a controller is configured to determine during performing an SSC control mode whether a brake pedal is in an ON state; determining, by the controller, overlap of control modes wherein when it is determined in the determining by a controller, a state of a brake pedal that the brake pedal is in the ON state, the controller is configured to determine whether conditions for performing an extended ISG control mode are satisfied; and converting, by the controller, a control mode wherein when it is determined in the determining, by the controller, overlap of control modes that the conditions for performing the extended ISG control mode are satisfied, the controller terminates the SSC control mode being performed and converts the current control mode to the extended ISG control mode.
    Type: Application
    Filed: September 25, 2019
    Publication date: November 12, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Chan Hee WON, Jung Sup BYUN, Seong Kyu PARK, Seong Hwan CHEONG
  • Patent number: 10718114
    Abstract: An RC lattice beam is provided that can greatly dampen the transfer of vibrations in particular. As the concrete included in the RC lattice beam is polymer concrete that contains a polymer, fine-scale vibrations that may otherwise affect exposure apparatuses may be effectively dampened, while the depth of the conventional lattice beam may be kept the same. Thus, a high-damping RC lattice beam is provided that is capable of maximizing the performance of a precision exposure apparatus by reducing the defect rate and improving productivity.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: July 21, 2020
    Assignee: SAMSUNG C&T CORPORATION
    Inventors: Chan Kyu Park, Sang Kyung Ahn, Yong Ku Kim, Hyun Sup Noh, Eun Seok Lee, Young Kee Lew, Byong Kap Jeon, Jae Eun Jung
  • Publication number: 20140377453
    Abstract: The present invention relates to an insulating adhesive composition for metal printed circuit board, an adhesive-coated metal plate using the same, and a method for manufacturing the adhesive-coated metal plate. The adhesive composition according to the present invention forms an adhesive layer that is excellent in terms of adhesion to a copper foil, electrical insulating properties, and thermal resistance. The composition contains a specific epoxy resin, a curing agent and alumina. According to the present invention, in coating the metal plate with the solvent type adhesive, a roll coating method is used to perform a continuous coating process on the metal plate, thereby improving productivity when compared to the general method using a sheet type adhesive film.
    Type: Application
    Filed: December 21, 2012
    Publication date: December 25, 2014
    Inventors: Chan Sup Park, Rae-Hong Cho, Dong Hyon Kim, Kyung Ho Park, Sang-Kwon Han, Chong Soo Park, Bae Geun Lee, Jung Bong Kim, Jae Man Han, Tae Kyoo Shin, Dae Chul Bae