Abstract: A method for manufacturing a structure having an air gap includes following steps. A plurality of patterns is formed in a pattern region of a substrate. A sacrificial layer is formed on the substrate, and a top surface of the sacrificial layer is lower than a top surface of the patterns to expose a plurality of upper portions of the patterns. A hard mask layer is formed to cover the sacrificial layer and the upper portions of the patterns. An etching-back process is performed to the hard mask layer to expose the sacrificial layer outside the pattern region, and the hard mask layer remaining inside the pattern region seals the opening between the upper portions of the patterns. The sacrificial layer is removed to form an air gap between the two adjacent patterns.

Abstract: A method for manufacturing a structure having an air gap includes following steps. A plurality of patterns is formed in a pattern region of a substrate. A sacrificial layer is formed on the substrate, and a top surface of the sacrificial layer is lower than a top surface of the patterns to expose a plurality of upper portions of the patterns. A hard mask layer is formed to cover the sacrificial layer and the upper portions of the patterns. An etching-back process is performed to the hard mask layer to expose the sacrificial layer outside the pattern region, and the hard mask layer remaining inside the pattern region seals the opening between the upper portions of the patterns. The sacrificial layer is removed to form an air gap between the two adjacent patterns.

Abstract: A correcting apparatus for wafer transport equipment is provided. The correcting apparatus includes a reflective component, an image capture module, an image processing module and a screen. The reflective component is disposed near a wafer carrying device to reflect an image of the wafer carrying device to the image capture module. The image capture module is disposed in the optical path of the reflected light of the reflective component to capture the image in the wafer carrying device. The image capture module is coupled to the image processing module. When a conveyer stretches into the wafer carrying device, the image processing module analyzes the image captured by the image capture module to determine whether the location of the conveyer is correct or not. The location of the conveyer is accurately and immediately adjusted according to the result of the analysis.