Patents by Inventor Chan Un JEON

Chan Un JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing slurry composition and slurry composition prepared thereby
    Patent number: 10428240
    Abstract: The present invention relates to a method for preparing a slurry composition and a slurry composition prepared thereby, and has advantages of reducing scratches and residual particles, which are considered to be one of the biggest factors contributing to the decline in yield due to macroparticles and aggregated particles, while maintaining a high polishing rate, in a semiconductor CMP process. Furthermore, the present invention can achieve excellent results in the application to various patterns required in the ultra-large scale integration semiconductor process, the wafer non-uniformity (WIWNU) exhibiting a polishing rate, polishing selectivity, and polishing uniformity, which meet the needs, and the micro-scratch minimization.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: October 1, 2019
    Assignee: KCTECH CO., LTD.
    Inventors: Jang Kuk Kwon, Chan Un Jeon, Ki Hwa Jung, Jung Yoon Kim, Nak Hyun Choi, Seong Pyo Lee, Bo Hyeok Choi
  • METHOD FOR PREPARING SLURRY COMPOSITION AND SLURRY COMPOSITION PREPARED THEREBY
    Publication number: 20170051180
    Abstract: The present invention relates to a method for preparing a slurry composition and a slurry composition prepared thereby, and has advantages of reducing scratches and residual particles, which are considered to be one of the biggest factors contributing to the decline in yield due to macroparticles and aggregated particles, while maintaining a high polishing rate, in a semiconductor CMP process. Furthermore, the present invention can achieve excellent results in the application to various patterns required in the ultra-large scale integration semiconductor process, the wafer non-uniformity (WIWNU) exhibiting a polishing rate, polishing selectivity, and polishing uniformity, which meet the needs, and the micro-scratch minimization.
    Type: Application
    Filed: January 23, 2015
    Publication date: February 23, 2017
    Applicant: K.C. Tech Co., Ltd.
    Inventors: Jang Kuk KWON, Chan Un JEON, Ki Hwa JUNG, Jung Yoon KIM, Nak Hyun CHOI, Seong Pyo LEE, Bo Hyeok CHOI