Patents by Inventor Chan Wen LIU

Chan Wen LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package device, semiconductor device, and method for manufacturing the package device
    Patent number: 10566279
    Abstract: A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: February 18, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen-Long Lu, Jen-Kuang Fang, Min Lung Huang, Chan Wen Liu, Ching Kuo Hsu
  • PACKAGE DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE PACKAGE DEVICE
    Publication number: 20190229054
    Abstract: A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.
    Type: Application
    Filed: January 25, 2018
    Publication date: July 25, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen-Long LU, Jen-Kuang FANG, Min Lung HUANG, Chan Wen LIU, Ching Kuo HSU