Patents by Inventor Chan Wiryakusuma

Chan Wiryakusuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lightweight masonry bonding compound
    Publication number: 20090304980
    Abstract: A lightweight masonry compound (027) including the wrapping or protector cover (024, 025), said compound in a band form with particular dimensions in thickness, width and length; ready to use on site without the need of any equipment or tools; preferably having bonding strength and compressive strength equivalent or better than standard conventional mortar or dry premix or wet premix; capable of bonding masonry products.
    Type: Application
    Filed: February 20, 2006
    Publication date: December 10, 2009
    Inventor: Chan Wiryakusuma