Patents by Inventor Chan Wong

Chan Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6279810
    Abstract: A sensor for an ultrasonic bonding apparatus comprises a piezoelectric material located between the ultrasonic transducer and an ultrasonic concentrator of the bonding apparatus. The sensor has at least two outputs for measuring different bonding parameters, the outputs being chosen to optimize the signal response for the bonding parameters in question.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: August 28, 2001
    Assignees: ASM Assembly Automation LTD, The Hong Kong Polytechnic University
    Inventors: Lai Wa Chan-Wong, Siu San Chiu, Siu Wing Or, Yiu Ming Cheung
  • Patent number: D468428
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: January 7, 2003
    Assignee: Carl Parker Associates, Inc.
    Inventor: Chan Wong
  • Patent number: D413781
    Type: Grant
    Filed: October 23, 1998
    Date of Patent: September 14, 1999
    Assignee: Ching Wah Metal Ware Factory Limited
    Inventor: Siu Chan Wong