Abstract: A high voltage connector for a vehicle may include a male connector having a truncated conical protuberance-shaped first terminal, and a female connector having a second terminal provided with a truncated conical coupling groove corresponding to the first terminal, wherein an electrical connection between the male connector and the female connector is accomplished as the first terminal is inserted into the coupling groove of the second terminal. When the first terminal and the second terminal are coupled to each other, elastic deformation may be induced which may provide a holding force between the first and second terminals using elastic stress, resulting in improved stability of a high voltage power supply.

Abstract: A semiconductor package includes a molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. The molding member includes an extendible material which includes a first part having a warped shape, a second part extending from one end of the first part to be flat, and a third part extending from the other end of the first part to be flat, where first surfaces of the connectors are exposed at a surface of the molding member and second surfaces of the connectors are coupled to the chip.

Abstract: A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.

Abstract: An apparatus for detecting a defect of a press panel includes: an acoustic emission sensor unit configured to detect at least one elastic wave signal emitted from the press panel as a detection target during press work, a period measurer configured to measure a period as a section in which there are consecutive signals with a greater voltage than a threshold voltage among the at least one detected signals, and a defect existence determination unit configured to determine that a defect is generated in the press panel when the measured period is greater than a first reference value, and to determine that the press panel is in a normal state when the measured period is smaller than a second reference value which is smaller than the first reference value.

Abstract: A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.

Abstract: A flexible package may be provided. The flexible package may include a flexible molding member including a top surface. The flexible package may include a first chip within the flexible molding member, and including a first top surface. The flexible package may include a second chip within the flexible molding member, and including a second top surface. The first top surface may face away from the top surface of the flexible molding member and the second top surface may face towards the top surface of the flexible molding member.

Abstract: A flexible package may be provided. The flexible package may include a flexible molding member including a top surface. The flexible package may include a first chip within the flexible molding member, and including a first top surface. The flexible package may include a second chip within the flexible molding member, and including a second top surface. The first top surface may face away from the top surface of the flexible molding member and the second top surface may face towards the top surface of the flexible molding member.

Abstract: A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.

Abstract: A flexible package may be provided. The flexible package may include a flexible molding member including a top surface. The flexible package may include a first chip within the flexible molding member, and including a first top surface. The flexible package may include a second chip within the flexible molding member, and including a second top surface. The first top surface may face away from the top surface of the flexible molding member and the second top surface may face towards the top surface of the flexible molding member.

Abstract: A semiconductor package includes a first substrate including a plurality of first connecting portions disposed thereon, a second substrate disposed on a portion of the first substrate to be adjacent to the first connecting portions and including a plurality of conductive contact rails disposed thereon, and a plurality of conductive cantilevers respectively placed in contact with surfaces of the conductive contact rails so that one end portion of each conductive cantilever is electrically coupled to one of the first connecting portions and the other end portion slides along one of the conductive contact rails.

Abstract: A semiconductor package includes a flexible package substrate including a first surface and a second surface, a metal post penetrating the flexible package substrate from the first surface toward the second surface and including a first protrusion that protrudes from the first surface and a second protrusion that protrudes from the second surface, a first semiconductor chip connected to the first protrusion, a second semiconductor chip connected to the second protrusion, a first flexible molding member covering the first semiconductor chip and the first surface of the flexible package substrate, a second flexible molding member covering the second semiconductor chip disposed on the second surface of the flexible package substrate, and an external connection terminal disposed on the second surface of the flexible package substrate.

Abstract: An apparatus for detecting a defect of a press panel includes: an acoustic emission sensor unit configured to detect at least one elastic wave signal emitted from the press panel as a detection target during press work, a period measurer configured to measure a period as a section in which there are consecutive signals with a greater voltage than a threshold voltage among the at least one detected signals, and a defect existence determination unit configured to determine that a defect is generated in the press panel when the measured period is greater than a first reference value, and to determine that the press panel is in a normal state when the measured period is smaller than a second reference value which is smaller than the first reference value.