Patents by Inventor Chan WU

Chan WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110048797
    Abstract: A surface mounted electronic component is provided. The surface mounted electronic component includes a main body, a circuit element, a conductive electrode, and a virtual electrode. The circuit element is arranged in the main body. The conductive electrode is disposed on an outer surface of the main body, wherein the conductive electrode electrically is connected to the circuit element. The virtual electrode is disposed on the outer surface of the main body, wherein the virtual electrode lies near the conductive electrode. There is a distance between the virtual electrode and the conductive electrode.
    Type: Application
    Filed: August 20, 2010
    Publication date: March 3, 2011
    Applicant: CYNTEC CO., LTD.
    Inventors: Yi-Min Huang, Tsung-Chan Wu
  • Publication number: 20110026939
    Abstract: An infrared-receiving device includes an infrared-receiving module, an expanded module, and a microprocessor control unit (MCU). The MCU receives a data pulse signal transmitted from the infrared-receiving module. The expanded module is electrically connected to the infrared-receiving module and the MCU to receive a substitution data pulse signal outputted from an external expanded device. The expanded module sends the substitution data pulse signal to the MCU to send a control command to an electronic appliance electrically connected to the MCU.
    Type: Application
    Filed: July 29, 2009
    Publication date: February 3, 2011
    Inventors: Chung-Ping Chi, Kun-Chan Wu
  • Patent number: 7868145
    Abstract: A magnetic particle and fabrication method thereof. The magnetic particle comprises a polymer core, a magnetic material layer covering the polymer core, and a silicon containing layer covering the magnetic material layer. In addition, the magnetic particle may further comprise a coupling agent on the silicon containing layer, and an active molecule connected to the coupling agent. The magnetic particles provide controllable size, uniform diameter distribution, high magnetization, improved storage stability, and modified surface for targeting biomolecules for biomaterial separation and environmental analysis.
    Type: Grant
    Filed: July 11, 2007
    Date of Patent: January 11, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Kun Chan Wu, Hui-Ju Cho, Pei-Shin Jiang, Hsiang Yuan Huang, Wen-Hsun Kuo, Chi-Min Chau, Chih Hsien Su, Kun Feng Lee
  • Publication number: 20100219924
    Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is fanned among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 ?m.
    Type: Application
    Filed: February 22, 2010
    Publication date: September 2, 2010
    Applicant: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh
  • Publication number: 20100182114
    Abstract: A method for adjusting the inductance of a choke is provided by the present invention. The method includes with an unchanged structure and unchanged dimensions of the core of the choke, changing the kind of the magnetic materials composing the cores so as to adjust the magnetic permeability of the magnetic material. In addition, the present invention also provides a method for designing a choke, the method includes determining the structure of a first choke and a second choke, determining the dimensions of the cores of the chokes, and selecting magnetic materials composing the cores.
    Type: Application
    Filed: September 4, 2009
    Publication date: July 22, 2010
    Applicant: Cyntec Co., Ltd.
    Inventors: Yi-Min Huang, Roger Hsieh, Lan-Chin Hsieh, Tsung-Chan Wu
  • Publication number: 20100182115
    Abstract: A choke coil including a drum-core and at least one wire is provided. The drum-core includes a pillar, a first board and a second board. Two ends of the pillar are respectively connected to the first board and the second board. A material of the drum-core includes ferrous alloy. The wire has a winding portion wrapped around the pillar.
    Type: Application
    Filed: September 22, 2009
    Publication date: July 22, 2010
    Applicant: CYNTEC CO., LTD.
    Inventors: Yi-Min Huang, Roger Hsieh, Lan-Chin Hsieh, Tsung-Chan Wu
  • Publication number: 20090189170
    Abstract: A light emitting diode includes a casing, comprising a concave accommodation space; a lead frame, disposed in the casing, wherein the lead frame has at least two individual leads which extend into the accommodation space; a light emitting chip, disposed in the accommodation space and electrically connected to the leads; and an encapsulating material, inside the accommodation space. The light emitting diode emits light along an optical axis. The ratio of a first tilt angle between the first reflecting wall and the optical axis, and a second tilt angle to a second tilt angle between the second reflecting wall and the optical axis is no more than 4.
    Type: Application
    Filed: March 18, 2008
    Publication date: July 30, 2009
    Inventors: Chung-Chan Wu, Chia-Hao Wu
  • Publication number: 20090017518
    Abstract: A magnetic particle and fabrication method thereof. The magnetic particle comprises a polymer core, a magnetic material layer covering the polymer core, and a silicon containing layer covering the magnetic material layer. In addition, the magnetic particle may further comprise a coupling agent on the silicon containing layer, and an active molecule connected to the coupling agent. The magnetic particles provide controllable size, uniform diameter distribution, high magnetization, improved storage stability, and modified surface for targeting biomolecules for biomaterial separation and environmental analysis.
    Type: Application
    Filed: July 11, 2007
    Publication date: January 15, 2009
    Inventors: Kun Chan Wu, Hui-Ju Cho, Pei-Shin Jiang, Hsiang Yuan Huang, Wen-Hsun Kuo, Chi-Min Chau
  • Publication number: 20060289812
    Abstract: An optoelectronic semiconductor component includes a housing including a light exit opening, a first semiconductor chip installed inside the housing for emitting light, and a second semiconductor chip located at a position inside the housing. A distance between the second semiconductor chip and the light exit opening is greater than a distance between the first semiconductor chip and the light exit opening.
    Type: Application
    Filed: February 7, 2006
    Publication date: December 28, 2006
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: 7009285
    Abstract: An optoelectronic semiconductor component applies to a surface mount component of an optoelectronic semiconductor. The optoelectronic semiconductor component has one or more semiconductor chip secured on a chip carrier. The chip carrier is a part of a lead frame, and another part of the lead frame is formed with an independent connection part as a contact of the semiconductor chip. An encapsulation body centers on the semiconductor chip and encircles part of the chip carrier and the independent connection part to form an annular ellipsoid for reflecting or receiving radiation of the semiconductor chip. The encapsulation body has a recess and a window part filling the recess. The window part is composed of materials for transforming the optical characteristics of the semiconductor chip. Part of the chip carrier and the independent connection part extend out the encapsulation body to form outside contacts as a SMT component.
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: March 7, 2006
    Assignee: Lite-on Technology Corporation
    Inventors: Hung-Yuan Su, Chung-Chan Wu, Shu-Yun Su
  • Publication number: 20050205974
    Abstract: An optoelectronic semiconductor component applies to a surface mount component of an optoelectronic semiconductor. The optoelectronic semiconductor component has one or more semiconductor chip secured on a chip carrier. The chip carrier is a part of a lead frame, and another part of the lead frame is formed with an independent connection part as a contact of the semiconductor chip. An encapsulation body centers on the semiconductor chip and encircles part of the chip carrier and the independent connection part to form an annular ellipsoid for reflecting or receiving radiation of the semiconductor chip. The encapsulation body has a recess and a window part filling the recess. The window part is composed of materials for transforming the optical characteristics of the semiconductor chip. Part of the chip carrier and the independent connection part extend out the encapsulation body to form outside contacts as a SMT component.
    Type: Application
    Filed: August 6, 2004
    Publication date: September 22, 2005
    Inventors: Hung-Yuan Su, Chung-Chan Wu, Shu-Yun Su
  • Patent number: 6836807
    Abstract: The present invention provides a wireless receiving device jointly used by computer peripherals and a method thereof. The wireless receiving device comprises a wireless receiving circuit, a micro-processing circuit, a keystroke circuit, and an interface circuit. The micro-processing circuit can receive wireless signals emitted by wireless emitting devices of different computer peripherals via the wireless receiving circuit, and has also learning function. The keystroke circuit can be pressed to let the micro-processing circuit memorize and lock on a specific wireless emitting device. The signal processed by the micro-processing circuit is then transferred to a computer via the interface circuit.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: December 28, 2004
    Assignee: Topseed Technology Corp.
    Inventors: Kun Chan Wu, Wen Sheng Liao, Chao Wu Chien, Chung Ping Chi
  • Publication number: 20040233165
    Abstract: A recordable wireless cursor-controlling device including a transmitter and a recorder is disclosed. The recorder has a microphone and a speaker. Therefore, the wireless cursor-controlling device can be used for controlling the computer cursor as well as a digital recording device. Furthermore, when more recording time is needed, it can use the transmitter to transmit the recording voice signal to the computer and store in a hard drive of the computer. Therefore, the recording ability can be further extended.
    Type: Application
    Filed: May 20, 2003
    Publication date: November 25, 2004
    Inventors: Chung-Ping Chi, Kun-Chan Wu
  • Patent number: D527352
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: August 29, 2006
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D533146
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: December 5, 2006
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D541760
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: May 1, 2007
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D550169
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: September 4, 2007
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D551383
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: September 18, 2007
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D562269
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: February 19, 2008
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D619111
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: July 6, 2010
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
    Inventors: Chung-Chan Wu, Yu-Fang Peng