Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.

Abstract: A coil component includes a body; a first coil portion disposed inside of the body and having a first core portion; a first external electrode and a second external electrode disposed outside of the body and connected to both ends of the first coil portion, respectively; a second coil portion disposed on the first coil portion in the body and having a second core portion; and a third external electrode and a fourth external electrode disposed outside of the body and connected to both ends of the second coil portion, respectively, wherein the first core portion comprises a first shared core portion overlapping the second core portion and a first non-shared core portion not overlapping the second core portion, and the second core portion comprises a second shared core portion overlapping the first core portion and a second non-shared core portion not overlapping the first core portion.

Abstract: A coil component includes a body; a first substrate disposed inside of the body, and a second substrate, disposed below the first substrate; a first coil layer disposed on an upper surface of the first substrate; a second coil layer disposed between the first substrate and the second substrate; a third coil layer disposed on a lower surface of the second substrate; a conductive via passing through the first substrate and connecting the first coil layer and the second coil layer to each other; a connection electrode disposed outside of the body and connecting the second coil layer and the third coil layer to each other; a first external electrode disposed outside of the body and connected to the first coil layer; and a second external electrode disposed outside of the body and connected to the third coil layer.

Abstract: An organic light emitting display is provided. The organic light emitting display includes a first base substrate; a plurality of organic light emitting diodes disposed on the first base substrate; an encapsulation layer disposed on the organic light emitting diodes; and a plurality of first color conversion filters disposed on the encapsulation layer. The encapsulation layer includes: a first sub-inorganic layer disposed on the organic light emitting diodes; a second sub-inorganic layer disposed on the first sub-inorganic layer and having a refractive index different from that of the first sub-inorganic layer; an organic layer disposed on the second sub-inorganic layer; and a third sub-inorganic layer disposed on the organic layer.

Abstract: A thin film-type inductor includes a body having a coil, and a first external electrode and a second external electrode. The first and second external electrodes are each disposed on an external surface of the body. The coil includes a coil body and a via portion. The via portion is directly connected to the first external electrode. The coil body includes a base conductor layer in a lower portion and a plating layer in an upper portion.

Abstract: Provided are a business default prediction system and an operation method thereof The method includes collecting a plurality of news articles on the Internet, selecting a business that is an analysis target, classifying news articles related to an analysis target business among the plurality of collected news articles into analysis target articles, calculating a risk level for each of the analysis target articles, generating feature vectors representing each group by performing grouping of the analysis target articles based on the calculated risk level, and calculating the default risk of the analysis target business based on the generated feature vectors.

Abstract: A coil electronic component includes a support substrate; first and second coil patterns disposed on an upper surface and a lower surface of the support substrate, respectively; an encapsulant covering at least portions of the support substrate and the first and second coil patterns; and first and second external electrodes connected to the first and second coil patterns, respectively, and disposed on portions of a lower surface of the encapsulant, wherein at least one portion of a lower surface of the first coil pattern is exposed from the encapsulant, at least one portion of a lower surface of the second coil pattern is exposed from the encapsulant, and the first and second external electrodes are respectively connected to the at least one portion of the lower surface of the first coil pattern and the at least one portion of the lower surface of the second coil pattern.

Abstract: An inductor array component includes a body including a plurality of coil portions a coil included in the coil portions, external electrodes connected to both end portions of the coil and disposed on an outer surface of the body, a first blocking layer disposed between the coil portions, and a second blocking layer disposed within the first blocking layer.

Abstract: The present invention relates to a high-speed imaging system for measuring a target object within a sample, comprising: a light source emitting a plane wave; an angle-adjustment mirror adjusting an angle of the plane wave emitted from the light source; an optical interferometer dividing the plane wave whose angle was adjusted by the angle-adjustment mirror into a reference wave and a sample wave and forming an interference wave between the reference wave reflected from a reference mirror and the sample wave reflected from the target object; a camera module obtaining the interference wave, and an imaging controller controlling the angle-adjustment mirror to adjust the angle of the plane wave sequentially, forming a time-gated reflection matrix by using the interference waves obtained by the camera module in accordance with each angle of the plane wave, and imaging the target object based on the time-gated reflection matrix.

Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, a lead-out pattern disposed on at least one surface of the support substrate to be connected to the coil pattern, an encapsulant disposed to encapsulate the support substrate, the coil pattern, and at least one portion of the lead-out pattern, and an external electrode disposed on an external surface of the encapsulant to be connected to the lead-out pattern. The lead-out pattern includes a slit disposed on a side of a region facing the external electrode. The slit is exposed in a direction toward the external electrode and in a direction away from the support substrate, on the basis of a thickness direction of the support substrate, and is not connected to the support substrate.

Abstract: A coil electronic component includes first and second coil portions magnetically coupled to each other, an intermediate layer disposed between the first and second coil portions and including first magnetic particles, and an encapsulant encapsulating the first and second coil portions and including second magnetic particles. The intermediate layer and the encapsulant have permeabilities different from each other.

Abstract: A coil component and a board having the same are provided. The coil component includes: a first coil; a second coil sharing a magnetic core with the first coil; a main board disposed between the first and second coils; first and second external electrodes connected to the first coil; and third and fourth external electrodes connected to the second coil.

Abstract: An inductor includes a body including a coil part therein. The coil part includes a first coil layer electrically connected to a first via; a second coil layer disposed below the first coil layer and electrically connected to a second via displaced laterally from that of the first via; and a via connection layer disposed between the first coil layer and the second coil layer and electrically connected to the first and second vias.

Abstract: A coil electronic component includes a first coil and a second coil disposed on and beneath a main board, respectively, wherein the first coil includes a first coil pattern and a second coil pattern connected to each other through a first via of a first insulating layer and disposed on and beneath the first insulating layer, respectively, and the second coil includes a third coil pattern and a fourth coil pattern connected to each other through a second via of a second insulating layer and disposed on and beneath the second insulating layer, respectively. In this case, the main board, the first insulating layer, and the second insulating layer include through-holes formed in central portions thereof, respectively.

Abstract: A coil component includes: a body having coil portions disposed therein and exposed to one or more of surfaces of the body opposing each other in a width direction; external electrodes disposed on external surfaces of the body and connected to the coil portions; and insulating layers further disposed on the exposed coil portions.

Abstract: The present invention relates to a carrier apparatus for a vehicle in which the number of components is reduced and various functions are added in comparison with a carrier apparatus in the related art, and the carrier apparatus includes: a horizontal supporting means 50 which perpendicularly traverses article mounts 40 of two carriers C1 and C2 for a vehicle, is coupled to lower portions of the article mounts 40, has two lateral bars 52 protruding upward from the article mounts 40, has shock absorbing members 56 fitted with two horizontal bars 54 perpendicular to the lateral bars 52, and has a quadrangular frame shape; two reinforcing members 25 which horizontally connect vertical supports 20 and horizontal supports 30 of the two carriers C1 and C2 for a vehicle; and loops 42 which are installed on bottom surfaces of the article mounts 40 of the two carriers C1 and C2 for a vehicle such that a fixing strap 43 is fitted with the loop 42, in which the fixing strap 43, which is installed through the loops 42, i

Abstract: A coil component includes a body including first, second, third and fourth coils and including a first end surface and a second end surface opposed in a first direction, a first side surface and a second side surface opposing each other in a second direction, and an upper surface and a lower surface opposing each other in a third direction and a plurality of external electrodes disposed on the body and connected to the first to fourth coils. A first group including the first and second coils is arranged in point symmetry with respect to a second group including the third and fourth coils about a center between the first and second groups.

Abstract: A coil component includes: a body including a coil and an encapsulant encapsulating the coil; and an external electrode disposed on an external surface of the body, wherein a core center of the coil is filled with the encapsulant, the coil includes a plurality of coil patterns connected to each other by a via, the plurality of coil patterns have a stacked structure in which the plurality of coil patterns are stacked in one direction, and the external electrode includes a first external electrode, a second external electrode, and a third external electrode disposed to be spaced apart from one another.

Abstract: A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.

Abstract: The present invention relates to a fixing apparatus for quickly and simply fixing a carrier for vehicles to a vehicle, the fixing apparatus including: a female coupler which is installed in the vicinity of a rotating wheel at an end portion of an article mount; and a male coupler which is fixed to a roof of the vehicle and detachably coupled to the female coupler, in which when a trunk of the vehicle is opened in a state in which the carrier is installed, the article mount moves forward toward a front side of the vehicle, the female coupler is separated from the male coupler, and the rotating wheel rolls along a roof of the vehicle, and when the trunk is closed, the article mount moves rearward, and the female coupler engages with the male coupler, such that the carrier is fixed to the vehicle.