Patents by Inventor Chan-Young Choi

Chan-Young Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250099959
    Abstract: Disclosed are an improved guide device capable of being easily replaced for damage, and a detector having the same. The guide device includes a first plate configured to have a plurality of grooves disposed in one surface thereof; and a second plate configured to be in contact with the first plate, wherein the second plate is in contact with the first plate to separate a plurality of channels, wherein the first plate is configured so that the plurality of microdroplets pass through any one of the plurality of channels, the fluid passes through channels facing each other among the plurality of flow channels, and the microdroplets are regularly spaced apart by the fluid that is discharged from the channels facing each other.
    Type: Application
    Filed: December 10, 2024
    Publication date: March 27, 2025
    Applicant: BioTNS Co., Ltd.
    Inventors: Bong Suk Kim, Byeong ll Kim, Ji Soo Lee, Chan Min Park, Won Rae Lim, Hyeon Woo Kang, So Young Kim, Song Yi Baek, Ji Hyun Choi, Yik Jae Lee
  • Publication number: 20250086926
    Abstract: A difference detection device comprising: a data collection module configured to collect a satellite image set comprising a plurality of satellite images; a pre-processing module configured to generate a pre-processing image set by matching characteristic information of the satellite images included in the satellite image set; and a difference determination module configured to generate difference information between the plurality of satellite images by determining a difference between pre-processing images included in the pre-processing image set, wherein the characteristic information comprises at least one of illumination information and color information of the satellite image.
    Type: Application
    Filed: December 22, 2023
    Publication date: March 13, 2025
    Applicant: Meissa Planet Inc.
    Inventors: Chan hee CHOI, Hyun sun PARK, Dong young KIM
  • Patent number: 12245489
    Abstract: A display device includes: a pixel defining layer defining openings arranged in first and second directions, the openings forming emission areas in which light emitting elements are disposed to emit light of different colors; a light blocking layer disposed on the pixel defining layer, and defining holes, each overlapping the opening and having a larger diameter than the opening; and color filters disposed on the light blocking layer to overlap the holes and overlap the emission areas. The opening has an opening interval, which is defined as a difference in diameter between the overlapping hole and the opening, in the openings, among homogeneous openings in which the light emitting elements for emitting light of the same color are disposed, the homogeneous openings adjacent in the first or second direction have different opening intervals, and among the homogeneous openings, openings having different opening intervals are at least three types.
    Type: Grant
    Filed: May 2, 2023
    Date of Patent: March 4, 2025
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Chan Young Kim, Yeong Ho Lee, Ha Seok Jeon, Jun Hee Lee, Choong Youl Im, Hyun Duck Cho, Kook Hyun Choi
  • Patent number: 12211630
    Abstract: Provided are stretchable electronics and a method for manufacturing the same. The stretchable electronics may include a substrate, a plurality of electronic elements disposed to be spaced apart from each other on the substrate, and a wire structure disposed on the substrate to connect the plurality of electronic elements to each other. The wire structure may include an insulator extending from one of the electronic elements to the other of the adjacent electronic elements and a metal wire configured to cover a top surface and side surfaces of the insulator. The insulator may include at least one bent part in a plan view.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: January 28, 2025
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ji Hun Choi, Chan Woo Park, Ji-Young Oh, Seung Youl Kang, Yong Hae Kim, Hee-ok Kim, Jeho Na, Jaehyun Moon, Jong-Heon Yang, Himchan Oh, Seong-Mok Cho, Sung Haeng Cho, Jae-Eun Pi, Chi-Sun Hwang
  • Publication number: 20250018900
    Abstract: An integrated cleaning module of a vehicle sensor includes a washing liquid supply module configured to supply cleaning liquid; and an air supply module connected to the washing liquid supply module and configured to supply air. The air supply module includes a compressor configured to generate compressed air; an air tank in which the compressed air generated by the compressor is stored; and an integrated dispenser configured to be in fluid connection with the washing liquid supply module and the air tank. The integrated dispenser is configured to distribute the cleaning liquid and the compressed air.
    Type: Application
    Filed: November 27, 2023
    Publication date: January 16, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HYUNDAM INDUSTRIAL CO., LTD., DONG HEE INDUSTRIAL CO., LTD.
    Inventors: Seong Cheol Cho, Yoon Geun Cho, Sung Won Lee, Je Yeon Kim, Chul Young Choi, Hyun Su Yoo, Kyun Bum Park, Kun Su Hwang, Bu Hyeon Cho, Chan Yo Jeon, Seung Hwan Lee
  • Publication number: 20240146103
    Abstract: Embodiments of the inventive concept provide a wireless power apparatus for a substrate treating apparatus and a manufacturing method for the wireless power apparatus for the substrate treating apparatus for preventing a heat generation by preventing a generation of an eddy current in a coupling element, if the coupling element is used around an outer housing at which an induced magnetic field is formed. The inventive concept provides a wireless power apparatus for a substrate treating apparatus.
    Type: Application
    Filed: April 26, 2023
    Publication date: May 2, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Chan Young Choi, Ki Won Han, Wan Hee Jeong, Kyo Bong Kim, Hee Chan Kim, Doo Hyun Baek, Sang-Oh Kim, Hee Jae Byun
  • Publication number: 20240112938
    Abstract: A method and apparatus for aligning a wafer using a laser scanner, and a semiconductor transfer device are provided. The method includes a laser irradiation operation of irradiating a laser toward the wafer using a laser scanner disposed on a rear side or a lower side of the wafer and obtaining an image, a dataset acquisition operation of obtaining location information of at least three wafer edges by using a distance corresponding to a laser irradiation direction to a wafer edge in the image, a calculation operation of calculating a center point of the wafer by using the obtained location information of the wafer edge, and a detection operation of detecting whether a calculated center point is within a preset tolerance range.
    Type: Application
    Filed: April 13, 2023
    Publication date: April 4, 2024
    Inventors: Hee Jae BYUN, Kyo Bong KIM, Chan Young CHOI, Wan Hee JEONG, Sang Oh KIM
  • Publication number: 20240063039
    Abstract: An apparatus and method of detecting a wafer edge using a laser scanner, and a semiconductor transfer device are provided. The apparatus for detecting a wafer edge using a laser scanner includes a laser scanner disposed on a rear side of a mounted wafer and radiating a laser to a portion of an edge of the wafer, and a detection unit receiving an image acquired by the laser scanner and detecting the wafer edge in the image. The detection unit determines whether each wafer is present or aligned according to wafer edges detected in a plurality of wafer areas in the image.
    Type: Application
    Filed: April 17, 2023
    Publication date: February 22, 2024
    Inventors: Hee Jae BYUN, Chang Rak Baek, Kyo Bong Kim, Chan Young Choi, Wan Hee Jeong, Ki Won Han, Sang Oh Kim
  • Publication number: 20240014059
    Abstract: Proposed is a power supply apparatus capable of suppressing heat generation, and semiconductor manufacturing equipment and a transport system including the same. The power supply apparatus, which supplies power to a transport device in semiconductor manufacturing equipment, includes a first base member made of a conductive material installed along a moving path of the transport device, a second base member provided on a surface of the first base member and made of a magnetic core material, a track member provided as an installation structure disposed on a side of the second base member, a power supply member installed in the track member and to which current is applied to supply power, and a power reception member disposed in a power reception core member provided in the transport device at a predetermined interval from the power supply member, and magnetically coupled to the power supply member to generate an induced current.
    Type: Application
    Filed: March 21, 2023
    Publication date: January 11, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Chan Young CHOI, Sang Oh KIM, Wan Hee JEONG, Hee Jae BYUN
  • Patent number: 8041503
    Abstract: The present invention relates to a traffic information providing system and method using a traffic information collecting digital map. A traffic information collecting terminal receives GPS data from at least one GPS satellite, and generates traffic information target location information with reference to traffic information established based on the GPS data. The traffic information target location information includes a coordinate and a time and can further include a type or an order on the traffic information target location information. The traffic information providing system matches traffic information target location information provided by the terminals on nodes and links for collecting traffic information of a traffic information collecting digital map, generates section communication information for a section, processes the section communication information, and provides it as traffic information.
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: October 18, 2011
    Assignee: SK Marketing & Company, Co., Ltd
    Inventors: Chan-Young Choi, Yeong-Sam Jeong
  • Patent number: 7768141
    Abstract: A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: August 3, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventors: Joon-Mo Seo, Byoung-Un Kang, Kyung-Tae Wi, Jae-Hoon Kim, Tae-Hyun Sung, Soon-Young Hyun, Byoung-Kwang Lee, Chan-Young Choi
  • Publication number: 20100179748
    Abstract: The present invention relates to a traffic information providing system and method using a traffic information collecting digital map. A traffic information collecting terminal receives GPS data from at least one GPS satellite, and generates traffic information target location information with reference to traffic information established based on the GPS data. The traffic information target location information includes a coordinate and a time and can further include a type or an order on the traffic information target location information. The traffic information providing system matches traffic information target location information provided by the terminals on nodes and links for collecting traffic information of a traffic information collecting digital map, generates section communication information for a section, processes the section communication information, and provides it as traffic information.
    Type: Application
    Filed: November 29, 2007
    Publication date: July 15, 2010
    Inventors: Chan-Young Choi, Yeong-Sam Jeong
  • Publication number: 20090091044
    Abstract: A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.
    Type: Application
    Filed: February 14, 2007
    Publication date: April 9, 2009
    Inventors: Joon-Mo Seo, Byoung-Un Kang, Kyung-Tae Wi, Jae-Hoon Kim, Tae-Hyun Sung, Soon-Young Hyun, Byoung-Kwang Lee, Chan-Young Choi