Patents by Inventor Chanatkarn Angsutanasombat

Chanatkarn Angsutanasombat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Suspension Damping
    Publication number: 20240290347
    Abstract: A dielectric layer configured to overlay a spring metal layer in a suspension assembly is described. The dielectric layer includes a tongue portion including a proximate end and a distal end, trace portions extending from the tongue portion, and an aperture aligned with the void and defined by the tongue portion. The aperture includes an elongated opening with opposing ends partially aligning with the central opening of the void. The aperture further includes slits extending from the opposing ends of the elongated opening and at least partially aligned with slits of the void in the spring metal layer.
    Type: Application
    Filed: May 8, 2024
    Publication date: August 29, 2024
    Inventors: Ekaratch Pankaew, Kuen Chee Ee, Preecha Sudachun, David Glaess, Chanatkarn Angsutanasombat
  • Suspension damping
    Patent number: 12002497
    Abstract: A dielectric layer configured to overlay a spring metal layer in a suspension assembly is described. The dielectric layer includes a tongue portion including a proximate end and a distal end, trace portions extending from the tongue portion, and an aperture aligned with the void and defined by the tongue portion. The aperture includes an elongated opening with opposing ends partially aligning with the central opening of the void. The aperture further includes slits extending from the opposing ends of the elongated opening and at least partially aligned with slits of the void in the spring metal layer.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: June 4, 2024
    Assignee: Magnecomp Corporation
    Inventors: Ekaratch Pankaew, Kuen Chee Ee, Preecha Sudachun, David Glaess, Chanatkarn Angsutanasombat
  • Suspension Damping
    Publication number: 20210241791
    Abstract: A dielectric layer configured to overlay a spring metal layer in a suspension assembly is described. The dielectric layer includes a tongue portion including a proximate end and a distal end, trace portions extending from the tongue portion, and an aperture aligned with the void and defined by the tongue portion. The aperture includes an elongated opening with opposing ends partially aligning with the central opening of the void. The aperture further includes slits extending from the opposing ends of the elongated opening and at least partially aligned with slits of the void in the spring metal layer.
    Type: Application
    Filed: January 26, 2021
    Publication date: August 5, 2021
    Inventors: Ekaratch Pankaew, Kuen Chee Ee, Preecha Sudachun, David Glaess, Chanatkarn Angsutanasombat