Abstract: Luminaires are described herein employing waveguides and associated architectures for dynamic alteration of illuminance distribution patterns. The waveguide includes a light extraction component. The waveguide transmits light from a light source to the light extraction component by total internal reflection (TIR). The light extraction component includes one or more reversibly moveable surfaces for altering illuminance distribution patterns of the luminaire in response to one or more forces applied to the light extraction component by a force application assembly of the luminaire.

Abstract: Luminaires are described herein employing waveguides and associated architectures for dynamic alteration of illuminance distribution patterns. The waveguide includes a light extraction component. The waveguide transmits light from a light source to the light extraction component by total internal reflection (TIR). The light extraction component includes one or more reversibly moveable surfaces for altering illuminance distribution patterns of the luminaire in response to one or more forces applied to the light extraction component by a force application assembly of the luminaire.

Abstract: Luminaires are described herein employing waveguides and associated architectures for dynamic alteration of illuminance distribution patterns. The waveguide includes a light extraction component. The waveguide transmits light from a light source to the light extraction component by total internal reflection (TIR). The light extraction component includes one or more reversibly moveable surfaces for altering illuminance distribution patterns of the luminaire in response to one or more forces applied to the light extraction component by a force application assembly of the luminaire.

Abstract: A chip package and method for fabricating the same are provided which utilize a cover having one or more windows formed through one or more sidewalls to provide excellent resistance to warpage while allowing access to an internal volume of the chip package. In one example, the chip package includes a package substrate, an integrated circuit (IC) die, and a cover disposed over the IC die. The cover includes a lower surface facing the IC die, an upper surface facing away from the IC die, a lip extending from the lower surface, and a first sidewall extending from a first edge of the upper surface to the bottom of the lip. The lip is secured to the package substrate and encloses a volume between the lower surface and the package substrate. The IC die resides in the volume. A first elongated window is formed through the first sidewall and exposes the volume through the cover.

Abstract: In view of delamination and other failure mechanisms, bonded assemblies are described herein comprising one or more reinforcement members reducing deflection of the assemblies under applied flexural loads, wherein the reinforcement members do not materially interfere with the functionality of the bonded assemblies. In one aspect, waveguide assemblies are provided. A waveguide assembly, in some embodiments, comprises a waveguide body and light extraction elements bonded to the waveguide body, wherein at least one reinforcement member is coupled to the waveguide assembly at one or more locations to reduce deflection of the waveguide assembly under an applied flexural load.

Abstract: A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of the LED chips. A heat sink is included with the circuit board mounted to the heat sink so that heat from the LED chips spreads into the heat sink. In some embodiments the circuit board can be thermally conductive and electrically insulating. Method of forming an LED component are also disclosed utilizing chip-on-board mounting techniques for mounting the LED chips on the circuit board, and molding of the primary lenses directly over the LED chips individually or in sub-groups of LED chips.

Abstract: According to one example aspect, a device for venting a luminaire compartment comprises a luminaire compartment disposed between first and second luminaire components and one or more luminaire gaskets maintaining a weather-proof seal about the luminaire compartment. The device further comprises one or more venting tubes traversing the one or more luminaire gaskets such that the one or more venting tubes extend into the luminaire compartment and the one or more venting tubes equalize one or more environmental parameters of the luminaire compartment with one or more environmental parameters of the ambient environment.

Abstract: Emitter packages are disclosed that can include an insulating layer covering the emitter, such as between the emitter's primary emission surface and a lens or encapsulant. The packages can comprise a submount with an emitter flip-chip mounted such that the diode region is between the emitter's non-insulating and/or conductive substrate and the submount. The submount can then be covered with a thin insulating layer. The same or another insulating layer can cover other electrically active surfaces on the submount. By insulating the electrically active surfaces of the emitter and, in some embodiments, other electrically active surfaces, the package can meet UL8750 class 4 enclosure standards even if it does not meet the lens adhesion criteria. This can enable the use of cheaper and/or more optically efficient materials at the fixture level, since the package itself meets class 4 standards.

Abstract: According to one example aspect, a device for venting a luminaire compartment comprises a luminaire compartment disposed between first and second luminaire components and one or more luminaire gaskets maintaining a weather-proof seal about the luminaire compartment. The device further comprises one or more venting tubes traversing the one or more luminaire gaskets such that the one or more venting tubes extend into the luminaire compartment and the one or more venting tubes equalize one or more environmental parameters of the luminaire compartment with one or more environmental parameters of the ambient environment.

Abstract: This disclosure related to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads with protruding contact bumps. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at least a contact pad, such that the contact pad is recessed in relation to a surface of the device. Contact bumps are formed in contact with the contact pads, such that the contact bumps protrude beyond the surface and may contact a surface of a submount that the device is meant to be mounted to. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

Abstract: In view of delamination and other failure mechanisms, bonded assemblies are described herein comprising one or more reinforcement members reducing deflection of the assemblies under applied flexural loads, wherein the reinforcement members do not materially interfere with the functionality of the bonded assemblies. In one aspect, waveguide assemblies are provided. A waveguide assembly, in some embodiments, comprises a waveguide body and light extraction elements bonded to the waveguide body, wherein at least one reinforcement member is coupled to the waveguide assembly at one or more locations to reduce deflection of the waveguide assembly under an applied flexural load.

Abstract: A submount-free light emitter package with primary optic and method of fabricating the same are disclosed, these packages and methods comprising a light emitter with an optic. The optic may have a shape, which includes a portion that is wider at a point further from the light emitter than a point which is closer. The method includes a light emitter disposed on a carrier surface with at least one structure at least partially surrounding the light emitter. The encapsulant is over the light emitter forming a primary optic. The intermediate element at least partially defines the shape of the primary optic.

Abstract: Emitter packages are disclosed that can include an insulating layer covering the emitter, such as between the emitter's primary emission surface and a lens or encapsulant. The packages can comprise a submount with an emitter flip-chip mounted such that the diode region is between the emitter's non-insulating and/or conductive substrate and the submount. The submount can then be covered with a thin insulating layer. The same or another insulating layer can cover other electrically active surfaces on the submount. By insulating the electrically active surfaces of the emitter and, in some embodiments, other electrically active surfaces, the package can meet UL8750 class 4 enclosure standards even if it does not meet the lens adhesion criteria. This can enable the use of cheaper and/or more optically efficient materials at the fixture level, since the package itself meets class 4 standards.

Abstract: A submount-free light emitter package with primary optic and method of fabricating the same are disclosed, these packages and methods comprising a light emitter with an optic. The optic may have a shape, which includes a portion that is wider at a point further from the light emitter than a point which is closer. The method includes a light emitter disposed on a carrier surface with at least one structure at least partially surrounding the light emitter. The encapsulant is over the light emitter forming a primary optic. The intermediate element at least partially defines the shape of the primary optic.

Abstract: Solid state fixtures and packages are disclosed that include an optical element, such as an encapsulant, having an integrated indicator which indicates one or more characteristics of the package to a user, such as package orientation, polarity, chip-type, etc. The host optical element can be substantially symmetrical but for the indicator. Indicators can be additive, such as a bump, or subtractive, such as a hole. The indicator can be visible to the human eye, and/or can be machine detectable, such as by pick-and-place technology. Indicators can be formed by many processes including molding and laser ablation/imprinting, which is particularly suited for use with a hard host material.

Abstract: This disclosure related to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads with protruding contact bumps. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at least a contact pad, such that the contact pad is recessed in relation to a surface of the device. Contact bumps are formed in contact with the contact pads, such that the contact bumps protrude beyond the surface and may contact a surface of a submount that the device is meant to be mounted to. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

Abstract: A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of the LED chips. A heat sink is included with the circuit board mounted to the heat sink so that heat from the LED chips spreads into the heat sink. In some embodiments the circuit board can be thermally conductive and electrically insulating. Method of forming an LED component are also disclosed utilizing chip-on-board mounting techniques for mounting the LED chips on the circuit board, and molding of the primary lenses directly over the LED chips individually or in sub-groups of LED chips.