Patents by Inventor Chander Prakash Gupta

Chander Prakash Gupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12238851
    Abstract: The present disclosure relates to a thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a plurality of fins. The hardened optical platform also including a vapor chamber in the interior including a heat exchanger. The heat exchanger including a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: February 25, 2025
    Assignee: Ciena Corporation
    Inventors: Chander Prakash Gupta, Sachin Singla, Ranjeet Chaurasiya, Rampratap Mahawar, Shubham Kumar
  • Publication number: 20240422933
    Abstract: A chassis design and methodology providing for the use of multiple power supply unit and other module form factors without chassis redesign. This increases usable life and future upgradability (in terms of power, for example) for network platforms. The chassis design utilizes a power supply unit or other module slot that includes a width adjustment mechanism, such as a scissor mechanism. The chassis design utilizes variable mounting holes and a movable backplane printed circuit board assembly and edge connector for accommodating various power supply unit or other module lengths. Thus, an adaptive chassis design accommodating multi form factor pluggable modules in network applications, such as multi form factor pluggable power supply units in high power network applications, is provided.
    Type: Application
    Filed: July 31, 2023
    Publication date: December 19, 2024
    Inventors: Chander Prakash Gupta, Sachin Singla, Suyash Agrawal, Karan Goel
  • Publication number: 20240312332
    Abstract: Aspects of the subject disclosure may include, for example, a process for providing status indication, that includes receiving a control signal at a proximal end of an elongated flexible circuit assembly including a distal portion attached to and extending along at least a portion of an elongated, panel-facing edge of a planar circuit board. The process further includes directing the control signal around a bent portion of the elongated flexible circuit assembly and to a number of visual status indicators distributed along at least a distal end of the elongated flexible circuit assembly, wherein at least a portion of the number of visual status indicators is actuated, responsive to the control signal, to provide a visual indication of a status of equipment supported by the planar circuit board. Other embodiments are disclosed.
    Type: Application
    Filed: May 19, 2023
    Publication date: September 19, 2024
    Applicant: CIENA CORPORATION
    Inventors: Chander Prakash Gupta, Sardeep Heda, Ranjeet Chaurasiya, Rampratap Mahawar
  • Publication number: 20240292558
    Abstract: A networking equipment enclosure assembly, including: a base chassis; a lid coupled to the base chassis; a printed circuit board disposed within the base chassis; and a power supply unit disposed between the printed circuit board and the lid, wherein the power supply unit is spaced apart from and biased away from the printed circuit board and towards the lid via a spring mechanism coupled between the printed circuit board and the power supply unit. The networking equipment enclosure assembly also includes a heat spreader plate disposed between the power supply unit and the lid and coupled to the power supply unit. The power supply unit is biased towards the lid via the spring mechanism coupled between the printed circuit board and the power supply unit such that the heat spreader plate is pressed into thermal contact with the lid.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 29, 2024
    Inventors: Chander Prakash Gupta, Sachin Singla, Suyash Agrawal, Ranjeet Chaurasiya, Karan Goel
  • Publication number: 20240090116
    Abstract: The present disclosure relates to a thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a plurality of fins. The hardened optical platform also including a vapor chamber in the interior including a heat exchanger. The heat exchanger including a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior.
    Type: Application
    Filed: October 28, 2022
    Publication date: March 14, 2024
    Inventors: Chander Prakash Gupta, Sachin Singla, Ranjeet Chaurasiya, Rampratap Mahawar, Shubham Kumar
  • Patent number: 11617285
    Abstract: An outdoor, hardened telecommunications clamshell platform includes a base half and a top cover half. The platform also includes a Printed Circuit Board (PCB) disposed between two cooling plates within the platform, and a heat distributing mechanism surrounding the PCB within the platform and configured to distribute heat substantially evenly between the base half and the top cover half.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: March 28, 2023
    Assignee: Ciena Corporation
    Inventors: Simon J. E. Shearman, Michael R. Bishop, Marko Nicolici, Chander Prakash Gupta
  • Publication number: 20220304193
    Abstract: An outdoor, hardened telecommunications clamshell platform includes a base half and a top cover half. The platform also includes a Printed Circuit Board (PCB) disposed between two cooling plates within the platform, and a heat distributing mechanism surrounding the PCB within the platform and configured to distribute heat substantially evenly between the base half and the top cover half.
    Type: Application
    Filed: May 3, 2021
    Publication date: September 22, 2022
    Inventors: Simon J. E. Shearman, Michael R. Bishop, Marko Nicolici, Chander Prakash Gupta