Abstract: The present invention discloses microtextures for a thin-film evaporation. The microstructure is called as wedged micropillar and a forest of these micropillar helps in maintaining a thin-film of liquid over the heat sink surface through capillary action. The inherent sharp corners of these wedged micropillars drives the liquid filament along the vertical direction and the large mean curvature of the liquid meniscus provides high capillary pumping pressure. At the same time, these microstructures can offer high permeability for liquid flow thereby leading to low viscous pressure loss as compared to the cylindrical microstructured heat sink. As a result of these, the predicted dryout heat flux for thin-film evaporation is more than twice that of the conventional cylindrical microstructures. Also, we have proposed a combined architecture of wedged and cylindrical micropillars for hotspot-targeted cooling application.