Abstract: Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e.g., picosecond imaging circuit analysis (PICA), are disclosed. Embodiments attach a beacon to the signal of interest and apply a voltage across the beacon to enhance photon emissions responsive to the signal of interest. The voltage is greater than the operable circuit voltage, Vdd, to enhance photon emissions with respect to intensity and energy. Thus, the photon emissions are more distinguishable from noise. In many embodiments, the beacon includes a transistor and, in several embodiments, the beacon includes an enablement device to enable and disable photon emissions from the beacon. Further, a PICA detector may capture photon emissions from the beacon and process the photons to generate time traces.

Abstract: A method and system for scanning data from a specific latch in a matrix array of latches. The matrix array is made up of vertical selector lines and horizontal data lines. Each latch is coupled at an intersection of a selector line and a data line by a transistor. By turning on the transistor, the contents of the latch can be selectively read or written to.

Abstract: A method and system for scanning data from a specific latch in a matrix array of latches. The matrix array is made up of vertical selector lines and horizontal data lines. Each latch is coupled at an intersection of a selector line and a data line by a transistor. By turning on the transistor, the contents of the latch can be selectively read or written to.

Abstract: A method and system for scanning data from a specific latch in a matrix array of latches. The matrix array is made up of vertical selector lines and horizontal data lines. Each latch is coupled at an intersection of a selector line and a data line by a transistor. By turning on the transistor, the contents of the latch can be selectively read or written to.

Abstract: Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e.g., picosecond imaging circuit analysis (PICA), are disclosed. Embodiments attach a beacon to the signal of interest and apply a voltage across the beacon to enhance photon emissions responsive to the signal of interest. The voltage is greater than the operable circuit voltage, Vdd, to enhance photon emissions with respect to intensity and energy. Thus, the photon emissions are more distinguishable from noise. In many embodiments, the beacon includes a transistor and, in several embodiments, the beacon includes an enablement device to enable and disable photon emissions from the beacon. Further, a PICA detector may capture photon emissions from the beacon and process the photons to generate time traces.

Abstract: A method and system for manipulating data in a state holding elements array. Process data is moved through the state holding elements array by a process controller. A separate scan controller scans data out of the state holding elements array by scanning data out of a group of cascaded latches where there are insufficient extra state holding elements in the group to enable normal scan. A multiplicity of local scan clocks are utilized to shift selected amounts of data only when a next state holding element in the group has been made available by clearing the contents of that next state holding element. In this way, any given latch, for the purpose of scan, is not a dedicated master or slave latch, but can act as either. This invention also addresses a circuit for the creation of the multiplicity of local clocks from a conventional LSSD clock source.

Abstract: A method and ring oscillator circuit for measuring circuit delays over a wide operating range permits improved analysis of dynamic circuits. A pulse generator circuit provides a pulse to an input of a dynamic circuit under test, which may be a pre-charge or evaluation pulse that is triggered by a transition of an output of the dynamic circuit that occurs during the state opposite that of the state commanded by the pulse. The action of the circuit provides for measuring any amount of delay to the next transition in the opposite state irrespective of the pulse width. By providing a wide-range of operation, characteristics such as leakage, charge sharing, data dependent node capacitance, previous value dependence as well as other dynamic circuit behaviors may be determined. The ring oscillator circuit includes an enable start circuit that causes a first pulse to be generated by the one-shot when the ring oscillator circuit is enabled.

Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.

Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.

Abstract: Power consumption is reduced for power supplied by a voltage adapter, such as an AC/DC adapter. A power source is connected to a power unit, including the voltage adapter and control circuitry. The voltage adapter supplies power to a load, such as a computer system. A load current supplied by the voltage adapter and an output voltage of the voltage adapter are measured by the control circuitry, and a control device of the control circuitry selectively disconnects the voltage adapter from the power source. The disconnecting is responsive to the control circuitry inferring from the measured current and voltage that the load is turned off, or at least operating in a reduced power consumption mode.

Abstract: An apparatus for measuring capacitance of a semiconductor device is disclosed. The apparatus includes a signal source circuit, a first transistor, a second transistor, and bypass capacitor. The first transistor is connected in series with the second transistor, and the second transistor is connected in series with a device under test. The bypass capacitor connected in parallel with the first and second transistors. Coupled to the first and second transistors, the signal source circuit generates a first signal and a second signal to alternately turn on said first and second transistors such that a discharge current is generated to flow through the first and second transistors.

Abstract: A disclosed electronic transaction system and method include a virtual identity database and a virtual identity resolver. The database comprises at least one entry, each entry corresponding to a virtual identity of an individual. The resolver receives a request containing the virtual identity from a requestor and retrieves from the database at least a portion of data stored in the entry corresponding to the virtual identity. The retrieved information is then provided to the requestor. The portion of data retrieved may be determined, at least in part, by the identity of the requestor. Typically each database entry includes a set of fields wherein each field is indicative of a subset of the individual's personal information. Some of the fields may comprise a pointer to a secondary database where the personal information corresponding to the field is located. An individual's entry in the virtual identity database may reside on the individual's personal data processing system.

Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.

Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.

Abstract: Power consumption is reduced for power supplied by a voltage adapter, such as an AC/DC adapter. A power source is connected to a power unit, including the voltage adapter and control circuitry. The voltage adapter supplies power to a load, such as a computer system. A load current supplied by the voltage adapter and an output voltage of the voltage adapter are measured by the control circuitry, and a control device of the control circuitry selectively disconnects the voltage adapter from the power source. The disconnecting is responsive to the control circuitry inferring from the measured current and voltage that the load is turned off, or at least operating in a reduced power consumption mode.

Abstract: A method of fabricating a scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. The invention also relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.

Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.

Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.

Abstract: A scanning heat flow probe for making quantitative measurements of heat flow through a device under test is provided. In one embodiment the scanning heat flow probe includes an electric current conductor in a cantilever beam connected to a probe tip and coupled to two voltmeter leads. The probe also includes two thermocouple junctions in the cantilever beam electrically isolated from the electric current conductor and the two voltmeter leads. Heat flow is derived quantitatively using only voltage and current measurements. In other forms, the invention relates to the calibration of scanning heat flow probes through a method involving interconnected probes, and relates to the minimization of heat flow measurement uncertainty by probe structure design practices.

Abstract: A thermoelectric cooler and a system and method for fabricating the thermoelectric cooler are provided. In one embodiment, the thermoelectric cooler includes a first magnetic element, a second magnetic element composed of magnetic or magnetically susceptible material, a first thermoelectric sub-component, and a second thermoelectric sub-component. The first thermoelectric sub-component and the second thermoelectric sub-component are situated between the first and second magnetic elements. The first and second magnetic elements are selected such that a compressive force is exerted on the first and second thermoelectric elements. The magnetic elements are selected and adjusted in magnetic attraction such that the force exerted on the first and second thermoelectric elements establishes and maintains a contact of selected pressure between the first and second thermoelectric sub-components.