Patents by Inventor CHANDLER YING LAI SEE

CHANDLER YING LAI SEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240157511
    Abstract: A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.
    Type: Application
    Filed: January 25, 2024
    Publication date: May 16, 2024
    Inventors: HUA-CHOU CHIANG, CHANDLER YING LAI SEE, CHUNG-CHIEH KO
  • Patent number: 11911871
    Abstract: A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hua-Chou Chiang, Chandler Ying Lai See, Chung-Chieh Ko
  • Publication number: 20200130137
    Abstract: A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.
    Type: Application
    Filed: February 26, 2019
    Publication date: April 30, 2020
    Inventors: HUA-CHOU CHIANG, CHANDLER YING LAI SEE, CHUNG-CHIEH KO