Abstract: A display device is provided, which has a display region and includes: a substrate having a first surface and a second surface; a driving layer disposed on the first surface; a self-emitting layer disposed on the driving layer and including a reflective electrode; a plurality of sensors overlapping the display region in a normal direction of the first surface; a pixel defining layer disposed on the reflective electrode, wherein the pixel defining layer comprises a top surface and a bottom surface facing the driving layer; a spacer disposed on the top surface; and a plurality of first touch electrodes and second touch electrodes disposed in the display region, wherein in the normal direction of the first surface, at least two sensors overlaps one of the first touch electrodes or one of the second touch electrodes; wherein the sensors are adjacent to the second surface away from the driving layer.

Abstract: An electronic device includes a substrate, a first signal line disposed on the substrate, first and second electronic units, first and second transistors, and a first connecting element. The first and second electronic units are disposed on the substrate and electrically connected to the first signal line. The first transistor is disposed on the substrate and has a first control element, a first conductive element, and a first semiconductor. The second transistor is disposed on the substrate and has a second control element, a second conductive element, and a second semiconductor. The first connecting element is electrically connected to the first control element and the second control element. The first semiconductor overlaps with the first control element and is disposed between the substrate and the first control element. The second semiconductor overlaps with the second control element and is disposed between the substrate and the second control element.

Abstract: The present disclosure provides an electronic device. The electronic device includes a substrate, a first circuitry, a first functional unit, a layer, an organic insulating layer, a second circuitry, and a second functional unit. The organic insulating layer is disposed on the layer. The first functional unit is driven by the first circuitry. A thickness of the organic insulating layer overlapped with an opening of the layer is greater than that of the organic insulating layer not overlapped with the opening. The second functional unit is driven by the second circuitry. A function of the first functional unit is different from a function of the second functional unit. A first portion of the second circuitry is overlapped with the first functional unit and a second portion of the second circuitry is overlapped with the second functional unit.

Abstract: The present disclosure provides an electronic device including a first substrate, a plurality of sub-pixels, a first integrated circuit chip, a plurality of sub-sensor units, and a second integrated circuit chip. The first substrate has a surface, and the surface has a normal direction. The sub-pixels are disposed on the first substrate. The first integrated circuit chip is disposed on the first substrate and electrically connected to the sub-pixels. The sub-sensor units are disposed on the first substrate. The second integrated circuit chip is disposed on the first substrate and electrically connected to the sub-sensor units. A gap is included between two adjacent ones of the sub-pixels, and at least a portion of one of the sub-sensor units is overlapped with the gap along the normal direction.

Abstract: Disclosed is a bio sensing device including a medium layer, a light emitting element and an optical sensor. The light emitting element is configured to emit a light toward a user's skin layer, in which the light passes through the medium layer and has a maximum intensity in a first wavelength. The optical sensor is configured to receive a reflected part of the light from the user's skin layer, in which the reflected part of the light passes through the medium layer, and the medium layer has a first transmittance greater than 60% with respect to the first wavelength.

Abstract: An electronic device includes a substrate, a first sensing electrode disposed on the substrate, a second sensing electrode disposed on the substrate and adjacent to the first sensing electrode, a first conductive line disposed between the substrate and the first sensing electrode, a light emitting region disposed on the substrate, and an insulating layer disposed between the first sensing electrode and the first conductive line. The first conductive line includes at least one turning portion. A projection of the light emitting region on the substrate and a projection of the first conductive line on the substrate are separated from each other. The insulating layer includes at least three first vias. The first conductive line is electrically connected to the first sensing electrode through the at least three first vias. The first conductive line crosses the second sensing electrode.

Abstract: A display device includes a substrate, a first light-emitting unit, and a first lens. The first light-emitting unit is disposed on the substrate and configured to emit a first light beam. The first lens is disposed on the first light-emitting unit and configured to receive at least a portion of the first light beam. In a cross-sectional view of the display device, the first light-emitting unit has a first width W1, the first lens has a second width W2, the first lens has a height L, the first lens has a radius of curvature R, a distance between the first lens and the first light-emitting unit is T, and the display device satisfies: T ( W ? 2 - W ? 1 ) / 2 ? 57.29 + 2 ? ( R - L ) W 2 1 - 114.58 ? ( R - L ) W 2 ; 0.1 ?m?(W2?W1)/2?30 ?m; and R?L.

Abstract: An electronic device is provided and comprises a substrate, a first mesh unit, a first sub-pixel, and a second sub-pixel. The first mesh unit is disposed on the substrate, wherein the first mesh unit comprises a plurality of first mesh openings. The first sub-pixel and the second sub-pixel are disposed on the substrate, wherein the first sub-pixel and the second sub-pixel are overlapped with one of the plurality of first mesh openings in a top view direction of the electronic device. The first sub-pixel generates a first color light, the second sub-pixel generates a second color light, and the second color light is different from the first color light in color.

Abstract: A display panel having a display region which has a sensing area includes a substrate, a semiconductor layer, a light shielding layer and a first insulating layer. The semiconductor layer is disposed on the substrate. The light shielding layer is disposed between the semiconductor layer and the substrate and has a first through hole in the sensing area. The first insulating layer is disposed on the semiconductor layer and has a second through hole in the sensing area. The first through hole and the second through hole are overlapped with each other. In a cross section view of the display panel, the first through hole has a first edge, the second through hole has a second edge which is closer to the first edge and a distance between the first edge and the second edge is greater than zero.

Abstract: The disclosure provides a manufacturing method of an electronic device, including the following steps. A substrate is provided. A conductive layer is formed on the substrate. An insulating layer is formed on the conductive layer. The insulating layer is patterned to form a first opening and a second opening. A first electronic element is disposed in the first opening and the first electronic element is electrically connected to the conductive layer. A second electronic element is disposed in the second opening and the second electronic element is electrically connected to the conductive layer. The first electronic element and the second electronic element have different functions.

Abstract: The disclosure provides an electronic device including a substrate, a semiconductor, a first conductive layer, a second conductive layer, a first insulating layer, and a second insulating layer. The semiconductor is disposed on the substrate. The first conductive layer is disposed on the semiconductor. The second conductive layer is disposed on the first conductive layer. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second insulating layer is disposed between the first conductive layer and the semiconductor. The second conductive layer is electrically connected to the first conductive layer through a first via penetrating the first insulating layer and electrically connected to the semiconductor through a second via penetrating the first insulating layer and the second insulating layer. A width of the first via is less than a width of the second via.

Abstract: An electronic device includes: a first electronic unit; a first transistor electrically connected to the first electronic unit and including a first polysilicon semiconductor; a first insulating layer disposed on the first polysilicon semiconductor; an oxide metal layer disposed on the first insulating layer; a second transistor electrically connected to the first electronic unit and the first transistor and including a first oxide semiconductor; and a second insulating layer disposed between the metal oxide layer and the first oxide semiconductor, wherein the oxide metal layer includes a first pattern overlapping with the first polysilicon semiconductor and a second pattern overlapping with the first oxide semiconductor, a thickness of the second insulating layer between the second pattern and the first oxide semiconductor is greater than or equal to 1000 ? and less than or equal to 8000 ?.

Abstract: An electronic device includes a flexible display, a sensor electrode, and a plurality of signal lines. The flexible display includes a plurality of light emitting diodes. The sensor electrode is disposed on the flexible display. The plurality of signal lines is electrically connected to the sensor electrode, wherein the plurality of signal lines includes a mesh structure, the mesh structure includes a first opening, and a second opening adjacent to the first opening, in the at least a portion of a bending region, one of the plurality of light emitting diodes is in the first opening, another one of the plurality of light emitting diodes is in the second opening, and a displaying color of the one of the plurality of light emitting diodes in the first opening is different from a displaying color of the another one of the plurality of light emitting diodes in the second opening.

Abstract: An electronic device is provided. The electronic device includes a first substrate, a second substrate, a first transistor, a second transistor, a passivation layer, a conductive through hole, an electrode, and a shielding layer. The second substrate overlaps the first substrate. The first transistor is disposed on the first substrate. The second transistor is disposed on the second substrate. The passivation layer is disposed between the first substrate and the second substrate. The conductive through hole penetrates the passivation layer. The electrode is disposed between the first substrate and the second substrate and electrically connected to the first transistor through the conductive through hole. The shielding layer is disposed between the first transistor and the second transistor and overlaps the conductive through hole.

Abstract: An electronic device includes a substrate, a layer overlapped with the substrate and having a first side and a second side opposite to the first side, a sensor unit disposed between the substrate and the layer, a first blocking layer disposed on the first side, and a second blocking layer disposed on the sensor unit. The layer includes flexible material. The second side is disposed between the sensor unit and the first side, and the first side is between the first blocking layer and the second side. The first blocking layer has a first opening, and the second blocking layer has a second opening. A width of the first opening is smaller than a width of the second opening.

Abstract: An electronic device is provided, including a substrate, an electronic component, and a circuit. The electronic component is disposed on the substrate. The circuit is disposed on the substrate and coupled to the electronic component. The circuit includes a first transistor, a first conductive line, a second transistor, a second conductive line, a third conductive line, and a fourth conductive line. The first transistor includes a first semiconductor and a first gate that overlaps with the first semiconductor. The first conductive line is coupled to the first gate of the first transistor. The second transistor includes a second semiconductor and a second gate that overlaps with the second semiconductor. The second semiconductor is different from the first semiconductor in material. The second conductive line is disposed adjacent to the first conductive line and is coupled to the second gate of the second transistor.

Abstract: The disclosure provides an electronic device including a substrate, a semiconductor, a first conductive layer, a second conductive layer, a first insulating layer, and a second insulating layer. The semiconductor is disposed on the substrate. The first conductive layer is disposed on the semiconductor. The second conductive layer is disposed on the first conductive layer. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second insulating layer is disposed between the first conductive layer and the semiconductor. The second conductive layer is electrically connected to the first conductive layer through a first via penetrating the first insulating layer and electrically connected to the semiconductor through a second via penetrating the first insulating layer and the second insulating layer. A width of the first via is less than a width of the second via.

Abstract: An electronic device includes a substrate, a first interposer and a plurality of package units. The first interposer is disposed on the substrate. The plurality of package units are disposed on the first interposer. Along a vertical direction, one of the plurality of package units sequentially includes a circuit structure, a first chip and a plurality of second chips. The circuit structure is disposed on the first interposer and electrically connected to the first interposer. The first chip is disposed on the circuit structure and electrically connected to the circuit structure. The plurality of second chips are disposed on the first chip and electrically connected to the circuit structure. The first chip overlaps at least two of the plurality of second chips, and the plurality of package units are electrically connected to the substrate through the first interposer.

Abstract: A light emitting device includes a substrate, a pixel circuit disposed on the substrate, a light-emitting unit disposed on the pixel circuit, and a first color filter layer and a second color filter layer disposed on the pixel circuit. The pixel circuit includes a first transistor and a second transistor. The light-emitting unit includes a portion corresponding to a first light-emitting region and an another portion corresponding to a second light-emitting region. The second color filter layer is different from the first color filter layer in color. In a cross-section view, the first light-emitting region corresponds to a first portion of the first color filter layer and the first transistor, and the second light-emitting region corresponds to a second portion of the second color filter layer and the second transistor. A projection length of the first portion is different from a projection length of the second portion.

Abstract: A flexible electronic assembly includes a flexible supporting assembly, an electronic component, and a cover layer. The flexible supporting assembly includes a first surface and a second surface opposite to the first surface. In a plan view of the flexible electronic assembly, the second surface includes a plurality of protrusions and one of the protrusions includes at least one rounded corner. The electronic component is coupled to the first surface of the flexible supporting assembly. The cover layer is coupled to the electronic component.