Patents by Inventor Chandra Mohan M. Jha

Chandra Mohan M. Jha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Phase change material in substrate cavity
    Patent number: 11387224
    Abstract: A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a cavity, and phase change material within the cavity. In an example, the phase change material has a phase change temperature lower than 120 degree centigrade. A die may be coupled to the substrate. In an example, the semiconductor device package structure includes one or more interconnect structures that are to couple the die to the phase change material within the cavity.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: July 12, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan M Jha, Ying Wang, Kyu-oh Lee
  • PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY
    Publication number: 20200118990
    Abstract: A semiconductor device package structure is provided. The semiconductor device package structure includes a substrate having a cavity, and phase change material within the cavity. In an example, the phase change material has a phase change temperature lower than 120 degree centigrade. A die may be coupled to the substrate. In an example, the semiconductor device package structure includes one or more interconnect structures that are to couple the die to the phase change material within the cavity.
    Type: Application
    Filed: October 11, 2018
    Publication date: April 16, 2020
    Applicant: Intel Corporation
    Inventors: Cheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan M. Jha, Ying Wang, Kyu-oh Lee