Abstract: A stabilized ultra-high bandwidth capacity transceiver system that combines an E-band (71-76 GHz, 81-86 GHz) millimeter wave RF transceiver with an eye-safe adaptive optics Free Space Optical (FSO) transceiver as a combined apparatus for simultaneous point-to-point commercial communications. The apparatus has a high degree of assured carrier availability under stressing environmental conditions. The apparatus establishes and maintains pointing and stabilization of mmW RF and FSO optical beams between adjacent line of sight apparatuses. The apparatus can rapidly acquire and reacquire the FSO optical carrier link in the event the optical carrier link is impaired due to adverse weather.

Abstract: A stabilized ultra-high bandwidth capacity transceiver system that combines an E-band (71-76 GHz, 81-86 GHz) millimeter wave RF transceiver with an eye-safe adaptive optics Free Space Optical (FSO) transceiver as a combined apparatus for simultaneous point-to-point commercial communications. The apparatus has a high degree of assured carrier availability under stressing environmental conditions. The apparatus establishes and maintains pointing and stabilization of mmW RF and FSO optical beams between adjacent line of sight apparatuses. The apparatus can rapidly acquire and reacquire the FSO optical carrier link in the event the optical carrier link is impaired due to adverse weather.

Abstract: A stabilized ultra-high bandwidth capacity transceiver system that combines an E-band (71-76 GHz, 81-86 GHz) millimeter wave RF transceiver with an eye-safe adaptive optics Free Space Optical (FSO) transceiver as a combined apparatus for simultaneous point-to-point commercial communications. The apparatus has a high degree of assured carrier availability under stressing environmental conditions. The apparatus establishes and maintains pointing and stabilization of mmW RF and FSO optical beams between adjacent line of sight apparatuses. The apparatus can rapidly acquire and reacquire the FSO optical carrier link in the event the optical carrier link is impaired due to adverse weather.

Abstract: A stabilized ultra-high bandwidth capacity transceiver system that combines an E-band (71-76 GHz, 81-86 GHz) millimeter wave RF transceiver with an eye-safe adaptive optics Free Space Optical (FSO) transceiver as a combined apparatus for simultaneous point-to-point commercial communications. The apparatus has a high degree of assured carrier availability under stressing environmental conditions. The apparatus establishes and maintains pointing and stabilization of mmW RF and FSO optical beams between adjacent line of sight apparatuses. The apparatus can rapidly acquire and reacquire the FSO optical carrier link in the event the optical carrier link is impaired due to adverse weather.

Abstract: An apparatus is described to provide multi-channel bulk optical power detection. The apparatus has a plurality of optical splitters coupled to respective fiber-optic lines of a plurality of fiber-optic lines. An optimal time-division multiplexer has an input coupled to the plurality of optical splitters. A photodetector is coupled to an output of the optical time-division multiplexer to provide bulk optical power detection. The optical time-division multiplexer includes a scanning mirror.

Abstract: An apparatus is described to provide multi-channel bulk optical power detection. The apparatus has a plurality of optical splitters coupled to respective fiber-optic lines of a plurality of fiber-optic lines. An optimal time-division multiplexer has an input coupled to the plurality of optical splitters. A photodetector is coupled to an output of the optical time-division multiplexer to provide bulk optical power detection. The optical time-division multiplexer includes a scanning mirror.

Abstract: A scalable optical switch that uses substrates to multiplex and demultiplex input and output optical signals for optical networks. The switch includes a plurality of input fibers each configured to carry a plurality of lambda signals, a first stack of substrates, each of the substrates coupled to one of the input fibers and configured to demultiplex the lambda signals received on the input fiber by wavelength respectively, a plurality of output fibers, and a switching matrix configured to switch the demultiplexed lambda signals from the first stack of substrates to the plurality of output fibers. In one embodiment, the switch further includes a second stack of substrates coupled between the switching matrix and the output fibers. Each of the substrates of the second stack is configured to multiplex the switched lambda signals onto one of the output fibers respectively.

Abstract: An optical switch having switch mirror arrays controlled by scanning beams that reduce the amount of electrical connections required and reduce the complexity for constructing large optical switches. Movement of the switch mirror arrays is controlled by one or more scanning beams. The optical switch includes one or more arrays of optical switch inputs and outputs and one or more arrays of movable mirrors to direct light beams from the optical switch inputs to the optical switch outputs. The optical switch also includes one or more control elements to control the movable mirrors based on scanning beams directed to the one or more control elements.

Abstract: An apparatus is provided including a first chip having a plurality of solder bumps and recesses formed therein at preselected locations. A second chip is provided with a plurality of solder pads and projections. A plurality of solder bonds are coupled between the first and second chips. At least one of the recesses and projections includes angled walls for capturing and directing the other during reflow of the solder bonds such that the first chip aligns relative to the second chip under the surface tension of the solder bonds. If desired, vibrating waves may be applied to the first and second chips during reflow to assist movement of the projections relative to the recesses.

Abstract: An apparatus is provided including a first chip having a plurality of solder bumps and recesses formed therein at preselected locations. A second chip is provided with a plurality of solder pads and projections. A plurality of solder bonds are coupled between the first and second chips. At least one of the recesses and projections includes angled walls for capturing and directing the other during reflow of the solder bonds such that the first chip aligns relative to the second chip under the surface tension of the solder bonds. If desired, vibrating waves may be applied to the first and second chips during reflow to assist movement of the projections relative to the recesses.