Patents by Inventor Chandrashekar Ramaswamy

Chandrashekar Ramaswamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making substrate package with through holes for high speed I/O flex cable
    Patent number: 8353101
    Abstract: An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: January 15, 2013
    Assignee: Intel Corporation
    Inventors: Charan Gurumurthy, Sanka Ganesan, Chandrashekar Ramaswamy, Mark Hlad
  • SUBSTRATE PACKAGE WITH THROUGH HOLES FOR HIGH SPEED I/O FLEX CABLE
    Publication number: 20110108427
    Abstract: An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.
    Type: Application
    Filed: January 18, 2011
    Publication date: May 12, 2011
    Inventors: Charan Gurumurthy, Sanka Ganesan, Chandrashekar Ramaswamy, Mark Hlad