Abstract: A silicone-modified polyphenylene ether resin containing an unsaturated double bond, and a thermosetting resin composition, a prepreg, and a laminate containing the resin. By introducing a C?C double bond and a siloxy group into an end group of polyphenylene ether, the resin combines the low dielectric property of double bond curing and the advantages such as desirable heat resistance, weatherability, flame retardancy, dielectric property, and low water absorbency of the siloxy group. The resin can provide a high-frequency, high-speed copper-clad laminate with excellent dielectric property, humidity resistance, and heat resistance that are required by the high-frequency, high-speed copper-clad laminate.

Abstract: A styryl siloxy polyphenylene ether resin, a preparation method therefor and an application thereof. The styryl siloxy polyphenylene ether resin is obtained by introducing styryl groups and siloxy groups into polyphenylene end groups by means of a simple synthesis method. The resin combines low dielectric property of curing of styryl groups and heat resistance, weather resistance, flame retardancy, dielectric property, and low water absorption of siloxy groups, thereby making better use of the application advantages of polyphenylene ether resins in copper clad laminates and providing excellent dielectric property, moist-heat resistance and heat resistance required by a high-frequency and high-speed copper clad laminate.

Abstract: The present invention provides a styrenic polysilicon phenylate resin, a preparation method therefor and an application thereof. The styrenic polysilicon phenylate resin of the present invention has the structure shown in formula I. A main chain in the structure of the styrenic polysilicon phenylate resin comprises a siloxy structure and a benzene ring structure. Styrene is introduced into an end group of the polysilicon phenylate resin to realize a solidification mode for solidifying by means of styrene as well as combining the low dielectric and the high heat resistance of a phenylate structure with the weather-ability, the flame resistance, the dielectric property, and the low specific water absorption of a siloxy. The present invention is applied to the field of copper clad laminates, and can provide great dielectric property and heat resistance required for a high-frequency and high-speed copper clad laminate.

Abstract: A deposition apparatus and a deposition method are described. The deposition apparatus includes an accommodating element, a plurality of lasers and a carrier. The accommodating element is configured to accommodate a material. The lasers are disposed at a periphery of the accommodating element, and are configured to simultaneously emit a plurality of laser beams toward the material to melt the material to form a deposition liquid. The carrier is disposed under the accommodating element and the lasers, and are configured to carry the deposition liquid.