Patents by Inventor Chang-An Ho
Chang-An Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240413426Abstract: An endothermic pouch assembly includes an endothermic pouch with liquid-impregnated absorbent material sealed inside, and a pouch cartridge including a pair of rim frames that bind a heat-fusion sealing portion formed along the rim of the endothermic pouch at both sides.Type: ApplicationFiled: June 12, 2023Publication date: December 12, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Yong Ho LEE, Jin Kyu LEE, Won Pill HWANG, Doo Han YOON, Chang Keun SON, Sun Jae KIM
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Publication number: 20240413203Abstract: A semiconductor device includes a substrate. An active pattern is on the substrate and extends in a first horizontal direction. First to third nanosheets are sequentially stacked on the active pattern and are spaced apart from each other in a vertical direction. A gate electrode is on the active pattern and extends in a second horizontal direction. The gate electrode surrounds each of the first to third nanosheets. A source/drain region is on the active pattern on at least one side of the gate electrode. An interlayer insulating layer covers the source/drain region. A source/drain contact penetrates the interlayer insulating layer in the vertical direction and is connected to the source/drain region. At least a portion of the interlayer insulating layer is disposed between sidewalls of the source/drain contact and the source/drain region in the first horizontal direction and overlaps sidewalls of the third nanosheet along the first horizontal direction.Type: ApplicationFiled: December 18, 2023Publication date: December 12, 2024Inventors: Chang Min YOE, Ji Wang KO, Jae Hong CHOI, Jun Ho HONG, Dong Min KIM, Jeong Min CHOI
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Publication number: 20240412681Abstract: A display device includes pixels connected to scan lines and data lines, each pixel including a driving transistor and at least one light emitting element, and a timing controller configured to generate output data using external input data. The timing controller includes a first compensator configured generate first data by correcting the external input data using at least one of optical measurement information, a threshold voltage of each of the driving transistors, mobility information, dimming information, and temperature information, and an afterimage compensator configured to generate second data based on age information of each light emitting element and the first data, generate third data based on a current amount corresponding to the first data and a current amount corresponding to the second data, and generate the age information by accumulating the third data.Type: ApplicationFiled: August 21, 2024Publication date: December 12, 2024Inventors: Joon Hyeok JEON, Byoung Kwan AN, Sang Myeon HAN, Chang Hun KIM, Seung Ho PARK, Seok Gyu BAN, Nam Jae LIM
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Publication number: 20240413247Abstract: A reduced interfacial defect density and low contact resistance can be provided for a thin film transistor by using a compositionally-modulated capping layer. A stack including a gate electrode, a gate dielectric layer, an active layer including a semiconducting metal oxide material, an in-process capping layer including a dielectric metal oxide material can be formed over a substrate. A dielectric material layer can be formed, and a source cavity and a drain cavity can be formed through the dielectric material layer. Exposed portions of the in-process capping layer can be converted into conductive material portions to provide a compositionally-modulated capping layer, which includes a first conductive capping material portion, the second conductive capping material portion, and a dielectric capping material portion.Type: ApplicationFiled: June 6, 2023Publication date: December 12, 2024Inventors: Kuo-Chang Chiang, Katherine H. Chiang, Yen-Chung Ho, Ming-Yen Chuang, Chung-Te Lin
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Patent number: 12166108Abstract: The present disclosure describes a structure with a conductive plate and a method for forming the structure. The structure includes a gate structure disposed on a diffusion region of a substrate, a protective layer in contact with the diffusion region and covering a sidewall of the gate structure and a portion of a top surface of the gate structure, and a first insulating layer in contact with the gate structure and the protective layer. The structure further includes a conductive plate in contact with the first insulating layer, where a first portion of the conductive plate laterally extends over a horizontal portion of the protective layer, and where a second portion of the conductive plate extends over a sidewall portion of the protective layer covering the sidewall of the gate structure. The structure further includes a second insulating layer in contact with the conductive plate.Type: GrantFiled: May 18, 2022Date of Patent: December 10, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chan-Yu Hung, Chia-Cheng Ho, Fei-Yun Chen, Yu-Chang Jong, Puo-Yu Chiang, Tun-Yi Ho
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Patent number: 12166127Abstract: In an embodiment, a method includes forming a plurality of semiconductor fins over a substrate, the plurality of semiconductor fins comprising a first fin, a second fin, a third fin, and a fourth fin; forming a first dielectric layer over the plurality of semiconductor fins, the first dielectric layer filling an entirety of a first trench between the first fin and the second fin; forming a second dielectric layer over the first dielectric layer, the second dielectric layer filling an entirety of a second trench between the second fin and the third fin, the forming the second dielectric layer comprising: forming an oxynitride layer; and forming an oxide layer; and forming a third dielectric layer over the second dielectric layer, the third dielectric layer filling an entirety of a third trench between the third fin and the fourth fin.Type: GrantFiled: August 4, 2023Date of Patent: December 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi Chen Ho, Yiting Chang, Lun-Kuang Tan, Chien Lin
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Patent number: 12161197Abstract: Systems and apparatus related to footwear including a modular lacing engine are discussed. In this example, the footwear assembly can include a footwear upper and a lace cable running through a plurality of lace guides. The plurality of lace guides can be distributed along the medial side and the lateral side, and each lace guide of the plurality of lace guides can be adapted to receive a length of the lace cable. The lace cable can extend through each of the plurality of lace guides to form a pattern along each of the medial side and lateral side of the footwear upper. The footwear assembly can also include a medial proximal lace guide routing the lace cable into a lacing engine disposed within a mid-sole portion. Finally, the footwear assembly includes a lateral proximal lace guide to route the lace cable out of the lacing engine.Type: GrantFiled: July 18, 2022Date of Patent: December 10, 2024Assignee: NIKE, Inc.Inventors: Summer L. Schneider, Narissa Chang, Daniel A. Johnson, Peter R. Savage, Travis J. Berrian, Fanny Yung Ho, Eric P. Avar, Elizabeth A. Kilgore, Katelyn Ricciardi
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Patent number: 12161149Abstract: A method of manufacturing a wrapper for a non-combustion-type cigarette used in an aerosol generating device, according to an embodiment, includes manufacturing a reconstituted tobacco sheet by mixing a tobacco material and first pulp, and manufacturing a wrapper by mixing the reconstituted tobacco sheet and second pulp. A wrapper for a non-combustion-type cigarette used in an aerosol generating device has a tensile strength of 3.0 kgf/15 mm or greater, and includes at least one of cigar leaf powder, cigar leaf pieces, and cigar leaves.Type: GrantFiled: March 22, 2021Date of Patent: December 10, 2024Assignee: KT&G CORPORATIONInventors: Soo Ho Kim, Ki Jin Ahn, Young Rim Han, Jong Yeol Kim, Chang Jin Park
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Publication number: 20240400139Abstract: An active air skirt apparatus includes a base fixed to a vehicle body; a link portion including a plurality of links connected to be rotatable in a transverse direction; a drive portion mounted on the base, connected to the links of the link portion, and configured to generate rotational power to rotate the plurality of links; and a skirt provided on the base to be movable in an upward and downward direction and connected to the links of the link portion, the skirt being configured to be moved to a retracted position when the plurality of links is folded by operation of the drive portion, and moved to an extended position when the plurality of links is unfolded.Type: ApplicationFiled: November 6, 2023Publication date: December 5, 2024Applicants: Hyundai Motor Company, Kia Corporation, HYUNDAI MOBIS CO., LTD. SeoulInventors: Jin Young YOON, Chang Young LEE, Hong Heui LEE, Geon Hwi LIM, Dong Eun CHA, Myung Eun KIM, Jae Sup BYUN, Jang Ho KIM
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Patent number: 12157265Abstract: A method of manufacturing a coupler for an air suspension includes: preparing a topping cord sheet and a rubber band; connecting the topping cord sheet and the rubber band to each other by attaching the rubber band to an outer circumferential surface of the topping cord sheet; and vulcanizing an intermediately formed body made by the connecting of the topping cord sheet and the rubber band to each other.Type: GrantFiled: May 22, 2023Date of Patent: December 3, 2024Assignee: Hyundai Mobis Co., Ltd.Inventors: Kang Won Seo, Chang Ho Cho, Jong Hoon Kim
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Publication number: 20240395682Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first insulating layer, a first metal layer having a first portion protruding upwardly of the first insulating layer and a second portion embedded in the first insulating layer, and a barrier layer disposed at a boundary between the first insulating layer and the second portion and extending to a lower surface of the first insulating layer. The first portion and the second portion are integrated.Type: ApplicationFiled: May 16, 2024Publication date: November 28, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyun Hu Lee, Sang Ho Jeong, Chang Hwa Park, Deok Hong Jo, Sang Won Han, Jong Eun Park
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Patent number: 12153525Abstract: Disclosed herein are a method and apparatus for verifying integrity in a memory-disaggregated environment. The method for verifying integrity in a memory-disaggregated environment includes receiving write data and multiple hash values generated based on write data from a remote memory, and verifying integrity of the write data based on the write data and the hash values, wherein verifying the integrity of the write data comprises selecting a hash value for the integrity verification based on an access latency of the remote memory.Type: GrantFiled: March 24, 2023Date of Patent: November 26, 2024Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, SYSGEAR CO., LTD.Inventors: Tae-Hoon Kim, Kwang-Won Koh, Kang-Ho Kim, Chang-Dae Kim, Sang-Ho Eom
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Publication number: 20240387114Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface, connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface, connected to the first to fourth surfaces and opposing each other in a third direction; external electrodes disposed on the third and fourth surfaces; and a first side margin portion and a second side margin portion, respectively disposed on the fifth and sixth surfaces, wherein the first and second side margin portions include a first extension portion disposed to extend onto a portion of the first surface and a portion of the second surface.Type: ApplicationFiled: February 27, 2024Publication date: November 21, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Ho SEO, Jong Ho LEE, Yong Min HONG, Jung Tae PARK, Min Woo KIM, Yong PARK, Sun Mi KIM
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Publication number: 20240386182Abstract: A routing method in a multilayer structure is provided. The routing method may include: acquiring a routing problem, wherein the routing problem is a problem of generating a path set that includes respective paths for multiple node groups arranged in a multilayer structure, generating a routing order example for the multiple node groups, generating a path set for the multiple node groups by executing a routing algorithm based on the routing order example, establishing a training set by obtaining a cost of the generated path set based on a predefined evaluation function, and training a deep learning model to predict a routing order using the training set.Type: ApplicationFiled: May 17, 2024Publication date: November 21, 2024Applicants: SAMSUNG SDS CO., LTD., UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)Inventors: Jae Ho YANG, Rak-Kyeong Seong, Chang Hyeong Lee, Hee Jin Choi, Min Ji Lee
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Publication number: 20240382052Abstract: A vacuum suction device equipped with an electric shock module includes a suction main body in which a negative-pressure suction force is generated by a motor or a fan. A collective unit is spatially connected with the suction main body and includes a collective inlet and a filtering system. The filtering system is used to filter and collect an electrically shocked object and/or a sucked object. The suction tube set has an air inlet and an air outlet. The air outlet is connected with the collective inlet. The air inlet is used to proactively generate an approximate-vacuum negative pressure between the air inlet and a suction surface. The electric shock module is disposed in the suction tube set for electrical discharge under high electric voltages. The electric voltage boost module is electrically connected with the electric shock module to electrically power the electric shock module.Type: ApplicationFiled: April 25, 2024Publication date: November 21, 2024Inventor: YI-CHANG HO
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Patent number: 12148260Abstract: A bill storage unit of an automated teller machine according to an embodiment includes: a lower cassette and an upper cassette which have bills stored therein and are vertically stacked; an external control board disposed outside the lower cassette and the upper cassette to perform power supply and communication signal transmission to the lower cassette and the upper cassette; first and second internal control boards electrically connected to the external control board and disposed inside the lower cassette and the upper cassette to perform power supply and communication signal transmission to each of components inside the lower cassette and components inside the upper cassette; a plurality of connectors interconnected to electrically connect the external control board and the first and second internal control boards; and a position alignment means configured to, when the upper cassette is being stacked on the lower cassette, guide the plurality of connectors to be interconnected at correct positions.Type: GrantFiled: July 13, 2022Date of Patent: November 19, 2024Assignee: HYOSUNG TNS INC.Inventors: Tae Gang Kim, Ji Youn Cho, Gun Hyuk Lim, Chang Ho Lee, Sang Hyun Lee
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Patent number: 12149028Abstract: Introduced is a connector assembly in which a CPA member, which assists in fastening a first connector and a second connector, securely connects the first connector and the second connector, and prevents a short circuit of an electrical signal, may be automatically inserted.Type: GrantFiled: May 4, 2022Date of Patent: November 19, 2024Assignees: Hyundai Motor Company, Kia Corporation, Tyco Electronics AMP Korea Co., Ltd.Inventors: Bum Woo Nam, Kun Teak Lim, Chang Ho Lee, Ki Ho Choi
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Patent number: 12146308Abstract: Provided is a water supply system for sanitary ceramics in which, when a diaphragm configured to move downward is seated on a rotary cam device, the rotary cam device is eccentrically rotated and guides the diaphragm to gradually move downward, and here, an upper end of a water discharge hole is gradually blocked by the diaphragm, and a flow of water discharged through the water discharge hole is prevented from being suddenly blocked. According to the present disclosure, there are advantages that a rotary cam device supports a diaphragm configured to move downward and, by being eccentrically rotated, guides the diaphragm to gradually move downward so that a water discharge hole is prevented from being suddenly blocked by the diaphragm and the water discharge hole is gradually blocked to prevent a flow of water discharged through the water discharge hole from being suddenly blocked.Type: GrantFiled: February 9, 2023Date of Patent: November 19, 2024Assignee: ACE LIFE CO., LTD.Inventor: Chang Ho Kim
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Patent number: 12144368Abstract: The present disclosure provides an externally heated aerosol generation device and a cigarette that may provide a sufficient amount of atomization to allow a user to have a satisfactory smoking experience even during an initial puff because thermal energy is easily transferred to the cigarette.Type: GrantFiled: November 15, 2019Date of Patent: November 19, 2024Assignee: KT&G CORPORATIONInventors: Soo Ho Kim, Chang Jin Park, Man Seok Seo, Ki Jin Ahn, Jong Yeol Kim, Jin Chul Yang
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Publication number: 20240374092Abstract: A vacuum suction adapter device equipped with an electric shock module includes an adapter main body comprising an air inlet and an air outlet, the air outlet being detachably connected with a suction main body, negative pressure being formed inside the adapter main body, and the air inlet being detachably connected with a suction nozzle, air flows into the adapter main body from the air inlet and to be expelled from the air outlet. The electric shock module is disposed in the adapter main body for electrical discharge under high electric voltages for generating electric arc sparks. The electric voltage boost module is electrically connected with the electric shock module to electrically power the electric shock module for electrical discharge under the high electric voltages.Type: ApplicationFiled: April 25, 2024Publication date: November 14, 2024Inventor: YI-CHANG HO