Patents by Inventor Chang An JUNG

Chang An JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250070259
    Abstract: An all-solid-state battery includes a positive-electrode stack including a positive-electrode and a first external solid electrolyte layer formed on at least one surface of the positive-electrode; and a negative-electrode stack including a negative-electrode and a second external solid electrolyte layer formed on at least one surface of the negative-electrode, wherein the first external solid electrolyte layer of the positive-electrode stack and the second external solid electrolyte layer of the negative-electrode stack face each other and are in contact with each other, wherein the first external solid electrolyte layer and the second external solid electrolyte layer include sulfide-based solid electrolytes having different chemical compositions. Further, a manufacturing method of the battery is provided.
    Type: Application
    Filed: March 14, 2024
    Publication date: February 27, 2025
    Inventors: Sung Hoo Jung, Ga Young Choi, Gyeong Min Bak, Ji Chang Kim, Hyun Min Seo
  • Patent number: 12233099
    Abstract: The present invention relates to a composition for promoting myogenesis, containing, as an active ingredient, a processed ginseng extract in which a trace amount of a ginsenoside ingredient is increased. It has been ascertained that the processed ginseng extract promotes the differentiation of myoblasts into muscle and inhibits muscle atrophy caused by myostatin, which is a myogenesis inhibitory factor, and thus it is expected that a composition for preventing or treating muscle disorder-related diseases, having excellent effects, can be developed.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: February 25, 2025
    Assignee: GREEN CROSS WELLBEING CORPORATION
    Inventors: Sun Kyu Park, Jeom Yong Kim, Young Hyo Yoo, Min Jung Jang, Chang Taek Oh, Min Ju Lim, Gwan Su Yi, Yi Li, Yoon Hyeok Lee, Jae Cheal Yoo
  • Patent number: 12237320
    Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii
  • Patent number: 12237218
    Abstract: A method of fabricating a contact structure includes the following steps. An opening is formed in a dielectric layer. A conductive material layer is formed within the opening and on the dielectric layer, wherein the conductive material layer includes a bottom section having a first thickness and a top section having a second thickness, the second thickness is greater than the first thickness. A first treatment is performed on the conductive material layer to form a first oxide layer on the bottom section and on the top section of the conductive material layer. A second treatment is performed to remove at least portions of the first oxide layer and at least portions of the conductive material layer, wherein after performing the second treatment, the bottom section and the top section of the conductive material layer have substantially equal thickness.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Ting Chung, Shih-Wei Yeh, Kai-Chieh Yang, Yu-Ting Wen, Yu-Chen Ko, Ya-Yi Cheng, Min-Hsiu Hung, Chun-Hsien Huang, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Patent number: 12232683
    Abstract: A shoe care device includes an inner cabinet, an air supply device that is configured to blow air to an accommodated space of the inner cabinet and includes a plurality of dehumidifying materials separate from one another, and a controller configured to control the air supply device. The air supply device includes a connection path configured to circulate air between an inlet and an outlet of the inner cabinet, and a regeneration path branched from the connection path and configured to guide air having passed through at least one of the dehumidifying materials to a portion of the air supply device other than the inlet. The controller is configured to control the air supply device to selectively open and close at least one of the connection path or the regeneration path based on whether or not at least one of the dehumidifying materials is heated.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: February 25, 2025
    Assignee: LG Electronics Inc.
    Inventors: Taeyong Jung, Chan Ho Chun, Chang Kyu Kim, Hye Yong Park, Manho Chun, Sora Kim, DoHyun Jung, Taehee Lee
  • Publication number: 20250062481
    Abstract: A battery module includes a plurality of overlapped battery cells and an insert panel inserted between the overlapped battery cells. The battery module further includes a top flange extended in an overlapping direction of the battery cells above the battery cells.
    Type: Application
    Filed: March 14, 2024
    Publication date: February 20, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Hyun Chang Kang, Ji Woong Jung, Yu Ri Oh, Jun Young Kang, Sun Keun Park, Byung Su Kim, In Gook Son
  • Publication number: 20250063885
    Abstract: A light emitting element of an embodiment includes a first electrode, a hole transport region on the first electrode, an emission layer on the hole transport region, an electron transport region on the emission layer, and a second electrode on the electron transport region, the electron transport region includes a nanoparticle including a nanoparticle core and a ligand, the nanoparticle core includes a core compound represented by Formula 1, and the ligand is bonded to the surface of the nanoparticle core and represented by Formula 2 or Formula 3.
    Type: Application
    Filed: June 21, 2024
    Publication date: February 20, 2025
    Inventors: YUNKU JUNG, SOOHO LEE, Jungho JO, Chang Yeol HAN, YUNHYUK KO, SEHUN KIM
  • Publication number: 20250062426
    Abstract: The present disclosure relates to an all-solid-state battery defect detection apparatus, system, and method. An exemplary embodiment of the present disclosure provides an all-solid-state battery defect detection apparatus including: a processor configured to detect a defect in an all-solid-state battery by using a pressure distribution measurement of the all-solid-state battery at ends of charging and discharging of the all-solid-state battery immediately after fastening a pressurizing jig to the all-solid-state battery; and a storage configured to store data and algorithms driven by the processor.
    Type: Application
    Filed: March 14, 2024
    Publication date: February 20, 2025
    Inventors: Ga Young Choi, Ji Chang Kim, Gyeong Min Bak, Sung Hoo Jung, Hyun Min Seo
  • Patent number: 12230443
    Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers and external electrodes disposed on the body and connected to the internal electrodes. The one of the internal electrodes includes Ni, Ba, Ti, O, and Tb, and a content of Tb relative to a sum of contents of Ni, Ba, Ti, O, and Tb is 0.45 to 3.0 wt %.
    Type: Grant
    Filed: June 15, 2023
    Date of Patent: February 18, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Jung Cho, Byung Kun Kim, Yu Hong Oh, Chang Hak Choi
  • Publication number: 20250050906
    Abstract: Disclosed is an autonomous driving control apparatus which includes a sensor device, a memory, and a controller. For example, the autonomous driving control apparatus may determine at least one lane detection result regarding a lane in which a host vehicle is traveling, using at least one of a first sensor included in a sensor device or a second sensor included in the sensor device, or any combination thereof, generate at least one driving route, based on the at least one lane detection result, and determine a final driving route for autonomous driving of the host vehicle, based on the at least one driving route.
    Type: Application
    Filed: July 15, 2024
    Publication date: February 13, 2025
    Inventors: Keon Chang Lee, Yong Suk kang, Chang Young jung, Dong Hwi Lee
  • Publication number: 20250057013
    Abstract: A display device includes a substrate including a display area and a first non-display area around the display area; a light emitting element on the display area of the substrate in the display area; a lower inorganic encapsulation film on the substrate in the display area and the first non-display area; an organic encapsulation film on the lower inorganic encapsulation film; an upper inorganic encapsulation film on the organic encapsulation film; and a first dam between the lower inorganic encapsulation film and the upper inorganic encapsulation film in the first non-display area, wherein a first side surface of the first dam is in contact with the organic encapsulation film, and a second side surface of the first dam different from the first side surface of the first dam is in contact with the upper inorganic encapsulation film.
    Type: Application
    Filed: May 13, 2024
    Publication date: February 13, 2025
    Inventors: Yeon Guk KIM, Hee Yeon PARK, Chang Yeong SONG, Hye In JUNG, Yong Chan JU, Jae Heung HA
  • Patent number: 12221053
    Abstract: Technology for safely protecting a passenger's pelvic region and below in the event of a side crash and a door-mounted passenger protection device and a method of controlling the device that includes a pusher moving from the inside of the door toward a passenger seated in a seat to be supported by the passenger's body and a pusher moving device applying air pressure to the pusher to move the pusher toward the passenger.
    Type: Grant
    Filed: August 24, 2023
    Date of Patent: February 11, 2025
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventors: Seok Hoon Ko, Seok Min Lee, Dae Chang Jung
  • Publication number: 20250041481
    Abstract: The present invention relates to a multi-stage decellularized mammal-derived tissue matrix, prepared by a method comprising: a preparation step for preparing tissue of a non-human mammal; a pretreatment step for pretreating the tissue; a first inactivation step for inactivating a virus included in the pretreated tissue using alcohol; a primary decellularization step for removing cells from the virus-inactivated tissue using an aqueous basic solution; a secondary decellularization step for removing cells by enzymatically treating the primary decellularized tissue; and a second inactivation step for inactivating a virus included in the decellularized tissue using an acid, and wherein the DNA content in the tissue subjected to the second inactivation step is 50 ng/mg or less, and the reduction rate (L) of the elastin content in the tissue subjected to the pretreatment step to the second inactivation step is 20% or less; and a method for preparing the same.
    Type: Application
    Filed: October 21, 2024
    Publication date: February 6, 2025
    Applicant: T&R BIOFAB CO., LTD.
    Inventors: Hyun Jung KIM, Chang Hwan KIM, Eun Hye PARK, Young Hwan KIM, Jae Hang SHIN, In Hank CHOI
  • Publication number: 20250041482
    Abstract: The present invention relates to a multi-stage decellularized mammal-derived tissue supplement, prepared by a method comprising: a preparation step for preparing tissue of a non-human mammal; a pretreatment step for pretreating the tissue; a first inactivation step for inactivating a virus included in the pretreated tissue using alcohol; a primary decellularization step for removing cells from the virus-inactivated tissue using an aqueous basic solution; a secondary decellularization step for removing cells by enzymatically treating the primary decellularized tissue; and a second inactivation step for inactivating a virus included in the decellularized tissue using an acid, and wherein the DNA content in the tissue subjected to the pretreatment step to the second inactivation step is 50 ng/mg or less, and the degradation time using 100 U/ml of collagenase is at least 90 hours; and a method for preparing the same.
    Type: Application
    Filed: October 18, 2024
    Publication date: February 6, 2025
    Applicant: T&R BIOFAB CO., LTD.
    Inventors: Hyun Jung KIM, Chang Hwan KIM, Eun Hye PARK, Young Hwan KIM, Jae Hang SHIN, In Hank CHOI
  • Patent number: 12219692
    Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.
    Type: Grant
    Filed: November 22, 2023
    Date of Patent: February 4, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Tae Hong Min, Jin Won Lee
  • Publication number: 20250037650
    Abstract: A display device includes a power supply to supply a first initialization power source to the pixels through a first initialization and to supply a second initialization power source to the pixels through a second power line.
    Type: Application
    Filed: October 14, 2024
    Publication date: January 30, 2025
    Inventors: Kyong Hwan OH, Jin Tae JEONG, Ji Hyun KA, Won Kyu KWAK, Hyung Jun PARK, Chang Soo PYON, Ji Eun LEE, Hai Jung IN, Won Mi HWANG
  • Publication number: 20250039880
    Abstract: Methods and systems for transmitting uplink control information and feedback are disclosed for carrier aggregation systems. A user equipment device may be configured to transmit uplink control information and other feedback for several downlink component carriers using one or more uplink component carriers. The user equipment device may be configured to transmit such data using a physical uplink control channel rather than a physical uplink shared channel. The user equipment device may be configured to determine the uplink control information and feedback data that is to be transmitted, the physical uplink control channel resources to be used to transmit the uplink control information and feedback data, and how the uplink control information and feedback data may be transmitted over the physical uplink control channel.
    Type: Application
    Filed: October 7, 2024
    Publication date: January 30, 2025
    Applicant: InterDigital Patent Holdings, Inc.
    Inventors: Shahrokh Nayeb Nazar, Kyle Jung-Lin Pan, Robert L. Olesen, Ghyslain Pelletier, Marian Rudolf, Paul Marinier, Charles A. Dennean, Stephen G. Dick, Allan Y. Tsai, Christopher R. Cave, Chang-Soo Koo
  • Patent number: 12211750
    Abstract: Embodiments of mechanisms for forming a semiconductor device are provided. The semiconductor device includes a substrate. The semiconductor device also includes a first fin and a second fin over the substrate. The semiconductor device further includes a first gate electrode and a second gate electrode traversing over the first fin and the second fin, respectively. In addition, the semiconductor device includes a gate dielectric layer between the first fin and the first gate electrode and between the second fin and the second gate electrode. Further, the semiconductor device includes a dummy gate electrode over the substrate, and the dummy gate electrode is between the first gate electrode and the second gate electrode. An upper portion of the dummy gate electrode is wider than a lower portion of the dummy gate electrode.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: January 28, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Che-Cheng Chang, Chang-Yin Chen, Jr-Jung Lin, Chih-Han Lin, Yung-Jung Chang
  • Publication number: 20250029741
    Abstract: The present invention relates to a method for analyzing a severe accident at a nuclear power plant by using a modular analysis code, comprising the step of: receiving the input of a nuclear power plant to be analyzed and an accident sequence; selecting, from a modular analysis code, an individual module for analyzing a severe accident that is triggered by the accident sequence; setting an accident simulation variable for simulating the severe accident from a nuclear power plant input model; determining whether the accident simulation variable is valid; and, if determined to be valid, analyzing the severe accident through the modular analysis code by using the accident simulation variable, wherein the individual module of the modular analysis code includes: a master module; a first module for analyzing in-core phenomena in the event of a severe accident; a second module for analyzing ex-core phenomena in the event of a severe accident; and a third module for analyzing behaviors of fission products in the event
    Type: Application
    Filed: January 5, 2023
    Publication date: January 23, 2025
    Inventors: Jae Hwan PARK, Yu Jung CHOI, Chang Hyun KIM
  • Publication number: 20240404839
    Abstract: A bonded assembly may be formed by: providing a substrate and a semiconductor chip in a low-oxygen ambient having an oxygen partial pressure that is lower than 17 kPa; disposing the semiconductor chip on the substrate; performing a plasma treatment process on a copper-containing surface of a chip bonding pad on the semiconductor chip in the low-oxygen ambient by directing a plasma jet to the chip bonding pad; and attaching a bonding wire to the semiconductor chip and to the substrate such that a first end of the bonding wire is attached to the copper-containing surface and a second end of the bonding wire is attached to a substrate bonding pad on the substrate.
    Type: Application
    Filed: June 2, 2023
    Publication date: December 5, 2024
    Inventors: Hui-Min Huang, Chang-Jung Hsueh, Chih-Yuan Chiu, Jen-Hao Liu, Ming-Da Cheng, Amram Eitan