Patents by Inventor Chang-An Wu

Chang-An Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11864341
    Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: January 2, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Wei-Ju Chen
  • Publication number: 20230422426
    Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.
    Type: Application
    Filed: June 22, 2022
    Publication date: December 28, 2023
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Wei-Ju CHEN
  • Publication number: 20230395610
    Abstract: A thin film transistor includes a substrate, a gate, a gate insulating layer, a semiconductor layer, a first conductive layer, a covering layer and a sidewall protection layer. The gate is disposed on the substrate, the gate insulating layer is disposed on the gate, and the semiconductor layer is disposed on the gate insulating layer. The first conductive layer is disposed on the semiconductor layer, and the first conductive layer includes copper. The covering layer is disposed on an upper surface of the first conductive layer, and the covering layer includes copper nitride. The sidewall protection layer is disposed on a side surface of the first conductive layer, and the sidewall protection layer includes copper nitride.
    Type: Application
    Filed: May 4, 2023
    Publication date: December 7, 2023
    Applicant: HANNSTAR DISPLAY CORPORATION
    Inventors: Chiung-Chang Wu, Jeng-Long Sheu, Yu-Kai Chuang
  • Patent number: 11835441
    Abstract: A sample classification device including a carrier, a first detection module, and a sample pipeline is provided. The first detection module includes a first light-emitting device, a second light-emitting device, and a first optical sensing device. The first light emitting device is located on the carrier and used to emit light of a first wavelength. The second light emitting device is located on the carrier and used to emit light of a second wavelength. The first wavelength is different from the second wavelength. The first optical sensing device is located on the carrier and between the first light emitting device and the second light emitting device. The sample pipeline is located above the carrier and passes above the first optical sensing device.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: December 5, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Hung Huang, Yuan-Fa Lee, Miao-Chang Wu, Sheng-Li Chang, Chih-Ching Liao
  • Publication number: 20230388801
    Abstract: A method for implementing requests from an app by a SIM in a mobile phone comprises the steps of: binding an app to a BIP server by a mobile phone; delivering a request command to the BIP server from the mobile phone; converting the request command to an APDU format, packing the converted request command in the APDU format in a request packet, and delivering the request packet to an IP of a SIM by the BIP server; receiving and unpacking the request packet to have the converted request command, and providing the converted request command to the SIM; executing the request command to have a result by the SIM; delivering the result in a response packet to the BIP server via the mobile network relayed; unpacking the response packet to fetch the result, and delivering the result to the mobile phone for the app by the BIP server.
    Type: Application
    Filed: May 26, 2022
    Publication date: November 30, 2023
    Inventors: CHUN HSIN HO, CHIH NUNG WANG, CHIEN CHOU CHEN, CHIN CHANG WU
  • Patent number: 11829317
    Abstract: A cable includes a first plug, a second plug, and a controller. The first plug is configured to be connected with a host. The second plug is configured to be connected with a device. The controller is coupled between the first plug and the second plug, and is configured to monitor a connection message transferred between the host and the device, and to determine, according to the connection message, a transfer mode that the host and the device is to enter, and to set a plurality of electrical parameters to be a corresponding one set in a plurality of sets of predetermined parameters.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: November 28, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Ming-Chang Wu, Kai Liu, Yao Feng, Neng-Hsien Lin, Chen Shen
  • Publication number: 20230360944
    Abstract: Some implementations described herein provide a deposition tool that includes a grounding component between an edge ring of a substrate stage and a pumping plate component. The grounding component includes a grounding strap having a deformation region. The deformation region includes a recessed edge to reduce a likelihood of the grounding strap rubbing against a surface of the pumping plate component during operation of the deposition tool. Material properties of the grounding strap may reduce a likelihood of plastic deformation of the grounding strap during repeated cycling. In this way, an amount of particulates dislodged from the surface of the pumping plate component may be decreased to improve a yield of semiconductor product fabricated using the deposition tool. Furthermore, a frequency of servicing the grounding component may be decreased to decrease a downtime of the deposition tool and increase a throughput of semiconductor product fabricated using the deposition tool.
    Type: Application
    Filed: May 3, 2022
    Publication date: November 9, 2023
    Inventors: Hsuan-Ying PENG, Chin-Szu LEE, Chiang Hsien SHIH, Chih-Chang WU, Che-Wei TUNG
  • Publication number: 20230354556
    Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.
    Type: Application
    Filed: April 27, 2022
    Publication date: November 2, 2023
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Ching-Yi SHIH, Kang HSU
  • Publication number: 20230339322
    Abstract: A method of using a mobile device as a dashboard of a motorcycle and a motorcycle using the method are provided. The motorcycle includes a body, an electronic control unit (ECU), a protocol converter, and a transceiver. The body includes a steering wheel, and the steering wheel includes a placement space for disposing a mobile device. The ECU is installed in the body and outputs a first signal via a first protocol. The protocol converter is installed in the body and coupled to the ECU. The protocol converter converts the first signal from the first protocol to a second protocol so as to generate a second signal, and the second protocol is different from the first protocol. The transceiver is installed in the body and coupled to the protocol converter. The transceiver transmits the second signal to the mobile device in the placement space.
    Type: Application
    Filed: February 16, 2023
    Publication date: October 26, 2023
    Applicant: Kinpo Electronics, Inc.
    Inventors: Yu Chi Chen, Hsien Chung Chen, Sheng-Chang Wu
  • Publication number: 20230341681
    Abstract: A method of displaying a rear-view image and a mobile device using the method are provided. The method includes: receiving the rear-view image; displaying a virtual dashboard through a display; and displaying the rear-view image on a default area of the virtual dashboard in response to receiving a signal associated with a direction indicator light, wherein the default area corresponds to the direction indicator light.
    Type: Application
    Filed: February 14, 2023
    Publication date: October 26, 2023
    Applicant: Kinpo Electronics, Inc.
    Inventors: Yu Chi Chen, Hsien Chung Chen, Sheng-Chang Wu
  • Publication number: 20230339403
    Abstract: A method of displaying a rear-view image and a digital dashboard using the method are provided. The method includes: receiving a rear-view image; and displaying the rear-view image on a default area of a display in response to receiving a signal associated with a direction indicator light, wherein the default area corresponds to the direction indicator light.
    Type: Application
    Filed: February 16, 2023
    Publication date: October 26, 2023
    Applicant: Kinpo Electronics, Inc.
    Inventors: Yu Chi Chen, Hsien Chung Chen, Sheng-Chang Wu
  • Publication number: 20230345669
    Abstract: A heat transmissive chassis for a fan-less equipment component such as a 5G component is disclosed. The chassis includes a heat sink section having an interior surface and an exterior surface. The interior surface is configured for contact with a heat-generating electronic device. A lateral hollow compartment is located near the interior surface. A coolant is contained in the hollow compartment.
    Type: Application
    Filed: April 20, 2022
    Publication date: October 26, 2023
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Te-Chuan WANG, Po-Kai TSENG
  • Patent number: 11778787
    Abstract: A computing system includes a cabinet, an inlet temperature sensor, a cooling device, an environmental sensor, and at least one processor. The cabinet houses at least one computing device. The inlet temperature sensor is configured to detect inlet temperature data for the at least one computing device. The inlet temperature data represents internal temperature within the cabinet. The cooling device is coupled to the cabinet for maintaining temperature within the cabinet. The environmental sensor is configured to detect environmental temperature data external to the cabinet. The environmental temperature data represents external temperature outside the cabinet. The at least one processor is configured to: (a) determine if one or more of the inlet temperature data and the environmental temperature data exceeds a temperature range; and (b) in response to the temperature range being exceeded, generate a first warning signal indicating a temperature problem.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: October 3, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Yan-Kuei Chen, Yangtzu Lee
  • Publication number: 20230309258
    Abstract: A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.
    Type: Application
    Filed: March 22, 2022
    Publication date: September 28, 2023
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Ching-Yi SHIH, Po-Cheng SHEN
  • Publication number: 20230294746
    Abstract: An underneath type railway freight car bogie wheelset radial device has front and rear subframes and two cross-arranged connecting rods that are pinned by round pin connectors. The subframe is a combination structure of the adapter and the lateral arm. The connecting rods are arranged under the bolster to form the underneath bogie wheelset radial structure. The height of the central plane of the connecting rod is lower than the height of the central plane of the subframe adapter surface. The adapter has an adapter surface forming an arc-shaped adapter structure and an adapter connecting arm integrated with the adapter surface structure and vertically arranged at one end of the adapter surface; the subframes are fixed to the adapter by the rivet assembly.
    Type: Application
    Filed: July 23, 2020
    Publication date: September 21, 2023
    Inventors: Rui ZHANG, Chang WU, Ji ZHU, Yungui WANG, Dong LI, Xianfeng ZHANG, Hanjiang LUO, Jun LIAO, Jiale LI, Chengli FENG, Jun YANG, Guangcai ZHANG
  • Patent number: 11755084
    Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: September 12, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Chieh Chen, Yueh-Chang Wu, Te-Chuan Wang, Tzu-Hsuan Hsu
  • Publication number: 20230280228
    Abstract: A detection system adapted for a liquid-cooling system includes a pressurizing device and at least one pressure sensor, the pressurizing device is configured to connect to and to pressure the liquid-cooling system, the pressure sensor is configured to measure a transient pressure response in response to detecting residual air bubbles in the liquid-cooling system.
    Type: Application
    Filed: August 31, 2022
    Publication date: September 7, 2023
    Inventors: Tzu-Han TING, MING-CHANG WU, WEI-CHUNG HSIAO
  • Publication number: 20230273089
    Abstract: A testing device for simulating frictional wear behaviors of threaded joints of a drill pipe under turbid seafloor environment, including a support, an oil cylinder, upper and lower specimens, a first motor, several second motors, stirring rods, a turbidity sensor, and a test tank. The oil cylinder and test tank are arranged on the support. A piston rod of the oil cylinder is connected to the first motor. A rotating-speed sensor is arranged on a bottom surface of the first motor, facing toward an output shaft of the first motor. The output shaft of the first motor is connected to an upper end of a torque limiter. A lower end of the upper specimen fits an upper end of the lower specimen under loading of a main shaft of the first motor. The stirring rods are provided at two sides of the test tank.
    Type: Application
    Filed: May 9, 2023
    Publication date: August 31, 2023
    Inventors: Yongping JIN, Chang WU, Deshun LIU
  • Publication number: 20230262937
    Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.
    Type: Application
    Filed: February 11, 2022
    Publication date: August 17, 2023
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Ching-Yi SHIH, Kang HSU
  • Publication number: 20230247800
    Abstract: A computing system includes a cabinet, an inlet temperature sensor, a cooling device, an environmental sensor, and at least one processor. The cabinet houses at least one computing device. The inlet temperature sensor is configured to detect inlet temperature data for the at least one computing device. The inlet temperature data represents internal temperature within the cabinet. The cooling device is coupled to the cabinet for maintaining temperature within the cabinet. The environmental sensor is configured to detect environmental temperature data external to the cabinet. The environmental temperature data represents external temperature outside the cabinet. The at least one processor is configured to: (a) determine if one or more of the inlet temperature data and the environmental temperature data exceeds a temperature range; and (b) in response to the temperature range being exceeded, generate a first warning signal indicating a temperature problem.
    Type: Application
    Filed: January 28, 2022
    Publication date: August 3, 2023
    Inventors: Yi-Chieh CHEN, Yueh-Chang WU, Yan-Kuei CHEN, Yangtzu LEE