Patents by Inventor Chang AN

Chang AN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME
    Publication number: 20250087627
    Abstract: A method of forming a semiconductor package includes the following operations. A first integrated circuit structure is provided, and the first integrated circuit structure includes a first substrate and a silicon layer over the first substrate. A plasma treatment is performed to transform a top portion of the silicon layer to a first bonding layer on the remaining silicon layer of the first integrated circuit structure. A second integrated circuit structure is provided, and the second integrated circuit structure includes a second substrate and a second bonding layer over the second substrate. The second integrated circuit structure is bonded to the first integrated circuit structure through the second bonding layer of the second integrated circuit structure and the first bonding layer of the first integrated circuit structure.
    Type: Application
    Filed: November 26, 2024
    Publication date: March 13, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Jui Kuo, Hui-Jung Tsai, Chia-Wei Wang, Yu-Tzu Chang
  • ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20250087635
    Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element stacking structure is disposed on a carrier structure to integrate multiple chips into a single package, so that the electronic package can meet with the requirements of miniaturization without increasing the layout area of the carrier structure.
    Type: Application
    Filed: May 21, 2024
    Publication date: March 13, 2025
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Shu-Chuan CHI, Yih-Jenn JIANG, Cheng-Kai CHANG, Huan-Shiang LI, Yi-Chieh WANG
  • INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
    Publication number: 20250087608
    Abstract: In an embodiment, a method includes forming a device layer over a first substrate; forming a first interconnect structure over a front-side of the device layer; attaching a second substrate to the first interconnect structure; forming a second interconnect structure over a back-side of the device layer, the second interconnect structure comprising back-side memory elements, wherein the back-side memory elements and a first plurality of active devices of the device layer provide a first memory array; and forming conductive connectors over the second interconnect structure.
    Type: Application
    Filed: November 25, 2024
    Publication date: March 13, 2025
    Inventors: Chuei-Tang Wang, Wei Ling Chang, Chieh-Yen Chen, Chen-Hua Yu
  • STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE
    Publication number: 20250087652
    Abstract: A semiconductor package includes an interposer that has a first side and a second side opposing the first side. A semiconductor device that is on the first side of the interposer and an optical device that is on the first side of the interposer and next to the semiconductor device. A first encapsulant layer includes a first portion and a second portion. The first portion of the first encapsulant layer is on the first side of the interposer and along sidewalls of the semiconductor device. A gap is between a first sidewall of the optical device and a second sidewall of the first portion of the first encapsulant layer. A substrate is over the second side of the interposer. The semiconductor device and the optical device are electrically coupled to the substrate through the interposer.
    Type: Application
    Filed: January 5, 2024
    Publication date: March 13, 2025
    Inventors: Wei-Yu Chen, Cheng-Shiuan Wong, Chia-Shen Cheng, Hsuan-Ting Kuo, Hao-Jan Pei, Hsiu-Jen Lin, Mao-Yen Chang
  • ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
    Publication number: 20250087546
    Abstract: In one example, an electronic device includes a substrate, an electronic component disposed over the substrate, and an encapsulant disposed over the substrate and the electronic component. A molded heat spreader can be disposed over the encapsulant and can comprise a heat spreader and a mold compound disposed around a lateral side of the heat spreader. A lateral side of the mold compound is coplanar with a lateral side of the encapsulant. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 13, 2025
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Joon Dong Kim, Gi Tae Lim, Gi Jeong Kim, Min Hwa Chang, Gyu Wan Han, Hwi Won Yun
  • SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
    Publication number: 20250087532
    Abstract: A method includes forming a metal layer over a dielectric layer; forming hard masks over the metal layer; etching the metal layer using the hard masks as etch mask to form metal features; selectively forming dielectric liners on opposite sidewalls of each of the metal features, while leaving surfaces of the hard masks and the dielectric layer exposed by the dielectric liners; and forming an inter-metal dielectric layer laterally surrounding the metal features.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 13, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kuang-Wei YANG, Cheng-Chin LEE, Shao-Kuan LEE, Jing Ting SU, Hsin-Ning HUNG, Hsin-Yen HUANG, Hsiao-Kang CHANG
  • PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
    Publication number: 20250087567
    Abstract: A package substrate is provided, in which a thinner second dielectric layer is formed on one side of a circuit structure including a first dielectric layer, so as to prevent large stress difference between two opposite sides of the circuit structure, thereby preventing the package substrate from warpage problems. A method of fabricating the package substrate is also provided.
    Type: Application
    Filed: September 10, 2024
    Publication date: March 13, 2025
    Inventors: Jiun-Hua CHIUE, Yin-Ju CHEN, Yi-Wen LIU, Min-Yao CHEN, Andrew C. CHANG
  • Tsv structure and fabricating method of the same
    Publication number: 20250087559
    Abstract: A TSV structure includes a substrate. A through via penetrates the substrate. A copper layer fills the through via. A trench is embedded in the substrate and surrounds the copper layer, and a material layer fills the trench. The material layer includes W, Cr, Ir, Re, Zr, SiOC glass, hydrogen-containing silicon oxynitride, silicon oxide or spin-on glass.
    Type: Application
    Filed: October 18, 2023
    Publication date: March 13, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, I-Fan Chang, Jia-Rong Wu
  • Semiconductor device including multiple inner spacers with different etch rates and method of making
    Patent number: 12249639
    Abstract: Improved inner spacers for semiconductor devices and methods of forming the same are disclosed.
    Type: Grant
    Filed: January 2, 2024
    Date of Patent: March 11, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu
  • Power device and fabrication method thereof
    Patent number: 12249647
    Abstract: A power device includes a substrate, an ion well in the substrate, a body region in the ion well, a source doped region in the body region, a drain doped region in the ion well, and gates on the substrate between the source doped region and the drain doped region. The gates include a first gate adjacent to the source doped region, a second gate adjacent to the drain doped region, and a stacked gate structure between the first gate and the second gate.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: March 11, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Chien Chang, Shen-De Wang, Cheng-Hua Yang, Linggang Fang, Jianjun Yang, Wei Ta
  • Switching of battery strings and modules when a fault is diagnosed in a battery string
    Patent number: 12249854
    Abstract: A battery system includes: a first positive terminal, a second positive terminal, and a negative terminal; at least two battery modules, each including switches and at least three strings of battery cells configured to, via the switches, at different times be: connected in series and to the first positive terminal; connected in parallel and to the second positive terminal; and disconnected from both of the first and second positive terminals; and a switch control module configured to, when a fault is diagnosed in one of the strings of one of the battery modules: at least one of: actuate the switches and isolate the one of the battery modules from the first and second positive terminals; and actuate the switches and isolate the one of the strings from the first and second positive terminals; and selectively actuate the switches of the remainder of the battery modules using model predictive control.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: March 11, 2025
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Jun-mo Kang, Chen-Fang Chang, Dave G. Rich
  • All solid battery
    Patent number: 12249685
    Abstract: An all-solid battery includes a body including a solid electrolyte layer and an anode layer and a cathode layer alternately stacked with the solid electrolyte layer interposed therebetween, and first and second external electrodes disposed on external surfaces of the body. The anode layer and the cathode layer include an active electrode material. The active electrode material included in the anode layer and the cathode layer is the same non-polar-based material.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: March 11, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Lock Kim, Chang Ryul Jung
  • Electrode structure comprising potential sheath for secondary battery and fabrication method therefor
    Patent number: 12249719
    Abstract: An electrode structure for a secondary battery includes a potential sheath capable of suppressing a side reaction between an electrode and an electrolyte through electric potential control. The electrode structure for the secondary battery uses the electric potential control so that an unstable SEI layer, which causes decrease in cycle characteristic and capacity of an anode material, occurs only on the surface of a potential sheath without occurring on the surface of the anode active material, thereby being capable of completely solving the problems of the existing nanostructured electrode.
    Type: Grant
    Filed: May 10, 2023
    Date of Patent: March 11, 2025
    Assignee: Industry-University Cooperation Foundation Hanyang University
    Inventors: Won Il Park, Won Jun Chang
  • Method of displaying rear-view image and digital dashboard using the same
    Patent number: 12246650
    Abstract: A method of displaying a rear-view image and a digital dashboard using the method are provided. The method includes: receiving a rear-view image; and displaying the rear-view image on a default area of a display in response to receiving a signal associated with a direction indicator light, wherein the default area corresponds to the direction indicator light.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: March 11, 2025
    Assignee: Kinpo Electronics, Inc.
    Inventors: Yu Chi Chen, Hsien Chung Chen, Sheng-Chang Wu
  • Mold core structure
    Patent number: 12246472
    Abstract: Provided is a mold core structure, which is arranged on a mold.
    Type: Grant
    Filed: May 19, 2024
    Date of Patent: March 11, 2025
    Inventors: Shun Fu Lin, Yu-Chang Su
  • Deposition mask cleaning apparatus and deposition mask cleaning method
    Patent number: 12246362
    Abstract: Provided are a deposition mask cleaning apparatus and a deposition mask cleaning method. The deposition mask cleaning apparatus includes a treated water bath containing treated water in which a deposition mask is immersed; a treated water generation part supplying the treated water to the treated water bath; a treated water supply pipe connecting the treated water bath and the treated water generation part; and a bubble generation part disposed in the treated water supply pipe and generating bubbles in the treated water. The treated water includes at least one of ozone water, hydrogen water, ammonia hydrogen water, and carbonated water. The bubbles include at least one of microbubbles having a bubble diameter of about 50 ?m or less and nanobubbles having a bubble diameter of about 1 ?m or less.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: March 11, 2025
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jai Phoong Kim, Hyuk Kang, Chang Uk An, Jae Min Hong
  • Colorant solvent system, methods of use, and articles
    Patent number: 12247127
    Abstract: Aspects of the present disclosure relate to color compositions and methods of making a printed layer using the color composition as well as an article that can include the printed layer.
    Type: Grant
    Filed: October 4, 2023
    Date of Patent: March 11, 2025
    Assignee: NIKE, Inc.
    Inventors: Yihua Chang, Christopher J. Dimitriou, Jeremy Gantz, Adam Kohn, Richard L. Watkins, Mary Austin
  • Energy-saving process and device for recovering C2 from refinery dry gas
    Patent number: 12247173
    Abstract: The preset invention provides an energy-saving process and device for recovering C2 from refinery dry gas. The process is as follows: dry gas is cooled and then sent to a multi-stage absorption tower for treatment; the gas phase from the multi-stage absorption tower is sent to a fuel gas pipeline network or PSA unit, and the liquid phase is sent to a high-pressure flash zone for treatment; the gas phase from the high-pressure flash zone is returned to a compression section of a dry gas pretreatment system; the gas phase from the low-pressure flash zone is sent to a C2 concentrated gas compressor system; and the gas phase from the desorption tower is mixed with the gas phase obtained from the low-pressure flash zone and sent to an ethylene cracking furnace as a C2 concentrated gas product, most of the liquid phase is returned to the multi-stage absorption tower.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: March 11, 2025
    Assignee: DALIAN UNIVERSITY OF TECHNOLOGY
    Inventors: Hongguang Dong, Wenchang Chang, Haotian Ye, Jilong Jia, Zhizhong Han
  • Microfluidic system and method of use thereof
    Patent number: 12247195
    Abstract: This invention concerns an integrated microfluidic system that utilizes microfluidic chip technology to receive a patient sample including cells, expand the cells, reprogram the expanded cells and then store the reprogrammed cells in a microfluidic chip. These microfluidic chips with stored reprogrammed cells may then be used in scenarios of genetic differentiation into specific cell types. Overall this system and workflow is suitable as a hospital based device that will allow the generation of iPSCs from every patient for downstream diagnostic or therapeutic use.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: March 11, 2025
    Assignee: New York Stem Cell Foundation, Inc.
    Inventors: Scott Noggle, Stephen Chang
  • Mobile device and control method interacting with conductive element using proximity sensor
    Patent number: 12250648
    Abstract: A mobile device includes a hybrid antenna, a tunable circuit element, an RF (Radio Frequency) module, and a proximity sensor. The tunable circuit element provides an impedance value. The RF module generates RF power. The hybrid antenna is coupled through the tunable circuit element to the RF module. The proximity sensor is respectively coupled to the hybrid antenna, the tunable circuit element, and the RF module, and is configured to detect a specific distance between the hybrid antenna and a conductive element. The tunable circuit element and the RF module are operated according to relative information of the specific distance. If the specific distance is shorter than or equal to a first threshold distance, the RF module will reduce the RF power. If the specific distance is shorter than or equal to a second threshold distance, the tunable circuit element will change the impedance value.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 11, 2025
    Assignee: ACER INCORPORATED
    Inventors: Kun-Sheng Chang, Ching-Chi Lin