Abstract: An LED light board includes a light board body, a fixing part and an adhesive layer. A surface of the light board body is provided with a plurality of LED light-emitting chips at intervals, and a region of the surface of the light board body without the LED light-emitting chips configured is provided with a first reflecting layer. A bottom side of the fixing part is provided with a plurality of grooves, and a region of the bottom side without the grooves configured is provided with a second reflecting layer. The adhesive layer is fixedly connected with the light board body by the adhesive layer, the fixing part is located above the light board body, and each of the LED light-emitting chips are matched with each of the grooves. The present application improves the reflectivity of the LED light board, and avoids the defects of time-consuming dispensing process.

Abstract: A quantum dot light guide module includes a transparent substrate and a transparent cover plate. The transparent substrate has a first groove, an inner wall of the first groove is a rough surface, and the first groove is provided with a quantum dot layer formed by curing a quantum dot paste. The transparent cover plate covers on a surface of the transparent substrate where the first groove is configured, a sealing adhesive layer is provided between the transparent cover plate and the transparent substrate, and the transparent cover plate is connected with the transparent substrate through the sealing adhesive layer and covered the first groove. In such a way, water vapor and oxygen are effectively isolated and the failure problem of the quantum dot layer is avoided, and the quantum dot layer is distributed uniformly in the first groove.

Abstract: An LED package device includes a substrate, an LED chip arranged on the substrate and a transparent groove. A quantum dot layer is provided inside the transparent groove, a barrier film layer is provided on the quantum dot layer, side walls of the barrier film layer are connected and sealed with side walls of the transparent groove, and a phosphor layer is provided on the barrier film layer. The transparent groove is inverted on the sealing adhesive layer and connected with the sealing adhesive layer, and an opening of the transparent groove is sealed by the sealing adhesive layer to cover the quantum dot layer, the barrier film layer and the phosphor layer. The device can isolate water vapor and oxygen, thereby effectively avoiding the failure problem of the quantum dot layer and reducing the failure risk caused by strong blue light to the quantum dot material.