Patents by Inventor Chang Bu Jeong

Chang Bu Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die pickup module and die bonding apparatus including the same
    Patent number: 11600515
    Abstract: Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker and an inverting driving unit for inverting the vacuum gripper to invert the die so that a rear surface of the die gripped by the vacuum gripper faces upward.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: March 7, 2023
    Assignees: Semes Co., Ltd, Samsung Electronics Co., Ltd.
    Inventors: Chang Bu Jeong, Min Gu Lee, Eui Sun Choi, Kang San Lee, Dae Ho Min, Seung Dae Seok
  • DIE PICKUP MODULE AND DIE BONDING APPARATUS INCLUDING THE SAME
    Publication number: 20210060798
    Abstract: Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.
    Type: Application
    Filed: August 25, 2020
    Publication date: March 4, 2021
    Inventors: Chang Bu Jeong, Jong Sung Park, Jung Sub Kim, Young Gun Park, Dae Seok Choi, Sang Hoon Jung
  • DIE PICKUP MODULE AND DIE BONDING APPARATUS INCLUDING THE SAME
    Publication number: 20210066112
    Abstract: Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker and an inverting driving unit for inverting the vacuum gripper to invert the die so that a rear surface of the die gripped by the vacuum gripper faces upward.
    Type: Application
    Filed: August 25, 2020
    Publication date: March 4, 2021
    Inventor: Chang Bu Jeong