Patents by Inventor Chang-Chao Su

Chang-Chao Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR FABRICATING ELECTRONIC STRUCTURE WITH CONDUCTIVE ELEMENTS ARRANGED FOR HEATING PROCESS
    Publication number: 20210351097
    Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.
    Type: Application
    Filed: April 27, 2021
    Publication date: November 11, 2021
    Inventors: Chih-Chiang He, Yu-Wei Yeh, Chia-Yang Chen, Chih-Yi Liao, Chih-Hsien Chiu, Chang-Chao Su
  • ELECTRONIC STRUCTURE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20210005524
    Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.
    Type: Application
    Filed: February 18, 2020
    Publication date: January 7, 2021
    Inventors: Chih-Chiang He, Yu-Wei Yeh, Chia-Yang Chen, Chih-Yi Liao, Chih-Hsien Chiu, Chang-Chao Su
  • ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200251395
    Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulating layer encapsulates the electronic component and the conductive elements. The encapsulating layer is formed with recessed portions corresponding in position to the conductive elements. A gap is formed between the conductive elements and the recessed portions.
    Type: Application
    Filed: July 2, 2019
    Publication date: August 6, 2020
    Inventors: Chih-Chiang He, Yu-Wei Yeh, Chia-Yang Chen, Chih-Yi Liao, Chih-Hsien Chiu, Chang-Chao Su