Patents by Inventor Chang Chaun Hu

Chang Chaun Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Incorporation of dielectric layer onto SThM tips for direct thermal analysis
    Patent number: 6566650
    Abstract: One of the limitations to current usage of scanning thermal microscopes arises when one needs to obtain a thermal map of an electrically biased specimen. Current practice is for the conductive parts of the specimen to be passivated to prevent excessive current leakage between the tip and the conductive sample. The present invention eliminates the need for this by coating the probe's microtip with a layer of insulation that is also a good thermal conductor. Examples of both thermocouple and thermistor based probes are given along with processes for their manufacture.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: May 20, 2003
    Assignees: Chartered Semiconductor Manufacturing Ltd., National University of Singapore, Institute of Microelectronics
    Inventors: Chang Chaun Hu, Kin Leong Pey, Yung Fu Chong, Chim Wai Kin, Pavel Neuzil, Lap Chan