Patents by Inventor Chang Chi
Chang Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230215810Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.Type: ApplicationFiled: December 30, 2021Publication date: July 6, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE
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Publication number: 20230207524Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.Type: ApplicationFiled: February 28, 2023Publication date: June 29, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang Chi LEE, Jung Jui KANG, Chiu-Wen LEE, Li Chieh CHEN
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Patent number: 11594518Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.Type: GrantFiled: June 3, 2021Date of Patent: February 28, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chang Chi Lee, Jung Jui Kang, Chiu-Wen Lee, Li Chieh Chen
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Publication number: 20220389414Abstract: Molecular computer techniques for solving a computational problem using an array of reaction sites, for example, droplets, are disclosed. The problem may be represented as a Hamiltonian in terms of problem variables and problem parameters. The reaction sites may have a physicochemical property mapping to discrete site states corresponding to possible values of the problem variables. In a purely molecular approach, the reaction sites have intra-site and inter-site couplings enforced thereon representing the problem parameters, and the array is allowed to evolve, subjected to the enforced couplings, to a final configuration conveying a solution to the problem. In a hybrid classical-molecular approach, an iterative procedure may be performed that involves feeding read-out site states into a digital computer, determining, based on the problem parameters, perturbations to be applied to the states, and allowing the array to evolve under the perturbations to a final configuration conveying a solution to the problem.Type: ApplicationFiled: October 28, 2020Publication date: December 8, 2022Inventors: Alan ASPURU-GUZIK, Si Yue GUO, Tony Chang-Chi WU, Pascal Thomas FRIEDERICH, Randall Howard GOLDSMITH, Leroy CRONIN, Abhishek SHARMA, Yudong CAO, Nathan C. GIANNESCHI, Christopher James FORMAN
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Publication number: 20220392871Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.Type: ApplicationFiled: June 3, 2021Publication date: December 8, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang Chi LEE, Jung Jui KANG, Chiu-Wen LEE, Li Chieh CHEN
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Patent number: 11426508Abstract: A snivel suction apparatus includes a suction mechanism and an air extraction mechanism. The air extraction mechanism is connected to the suction mechanism. The air extraction mechanism includes a pump, a piston, a communicating tube, a first check valve and a second check valve. The piston is arranged on the pump. One side of the communicating tube is connected to the pump. The other side of the communicating tube is connected to the suction mechanism. The first check valve is arranged in the pump and at one side of the communicating tube. The second check valve is arranged on the pump.Type: GrantFiled: October 2, 2019Date of Patent: August 30, 2022Assignee: TAI-SHINY TECHNOLOGY CO., LTD.Inventor: Chang-Chi Lee
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Publication number: 20220196673Abstract: Disclosed herein are recombinant baculoviruses suitable for detecting the presence of arthropod-borne viruses in a biological sample of a test subject. The information derived from the detection may also be used to render a diagnosis on whether the test subject is infected with the arthropod-borne viruses or not, so that proper course of treatment may be assigned to the subject.Type: ApplicationFiled: March 9, 2022Publication date: June 23, 2022Applicant: Chung Yuan Christian UniversityInventors: Tzong-Yuan WU, Szu-Cheng KUO, Pei-Yun SHU, Chang-Chi LIN, Der-Jiang CHIAO, Ying-Ju CHEN, Yi-Ting LIN, Shu-Fen CHANG, Chien-Ling SU
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Patent number: 11127650Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.Type: GrantFiled: February 24, 2020Date of Patent: September 21, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chien Lin Chang Chien, Chiu-Wen Lee, Hung-Jung Tu, Chang Chi Lee, Chin-Li Kao
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Publication number: 20210265273Abstract: A semiconductor device package includes a plurality of semiconductor chips and an interposer structure. The interposer structure has a plurality of tiers for accommodating the plurality of semiconductor chips. The interposer structure includes at least one conductive via connecting to a pad of the plurality of semiconductor chips.Type: ApplicationFiled: February 21, 2020Publication date: August 26, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien Lin CHANG CHIEN, Chiu-Wen LEE, Ian HU, Chang Chi LEE
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Publication number: 20210265231Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.Type: ApplicationFiled: February 24, 2020Publication date: August 26, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien Lin CHANG CHIEN, Chiu-Wen LEE, Hung-Jung TU, Chang Chi LEE, Chin-Li KAO
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Patent number: 11057076Abstract: Methods, apparatuses, and system for performing at least one of error correction or error detection are described. In one embodiment, a radio frequency identification (RFID) tag receives a signal activating or interrogating the tag. The tag includes memory that stores data associated with the tag. The tag performs at least one of error detection or error correction on the stored data. The error detection includes detecting, by the tag, that one or more bits of the stored data are inflicted with an error. The error correction includes correcting the erroneous bit if the error affects less than a predetermined number of the bits of the stored data. The tag transmits the stored data to a reader in response to the detection or correction. The reader can analyze the stored data for additional information about the error or provide the stored data to another computing system that performs the analysis.Type: GrantFiled: September 3, 2015Date of Patent: July 6, 2021Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANYInventors: Chang-Chi Liu, Steve Wang
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Publication number: 20210086470Abstract: A spacer fabric having removable yarns is provided. The spacer fabric includes a first fabric layer, a second fabric layer, and a middle fabric layer. The first fabric layer is formed of general-purpose yarns and the removable yarns wherein the general-purpose yarns and the removable yarns are arranged to a weft-knitted loop construction according to a predetermined pattern The middle fabric layer is formed of wave-like fibers interlocked with the first fabric layer and the second fabric layer. The predetermined pattern appears on the first fabric layer after the removable yarns are removed.Type: ApplicationFiled: September 18, 2020Publication date: March 25, 2021Inventors: Yi-Chen Lin, Chang-Chi Wang
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Publication number: 20210062967Abstract: An electronic device includes a device main body, a stand, and a rotating structure including a base body, a first rotating member, and a second rotating member. The base body connected to the device main body has at least one elastic part abutting against the first rotating member. The first rotating member is rotatably connected to the base body along a first rotating axis and is suitable for resisting an elastic force of the elastic part to rotate relative to the base body. The second rotating member is connected to the stand, has at least one friction part, and is rotatably connected to the first rotating member along a second rotating axis. The friction part abuts against the first rotating member, and the second rotating member is suitable for resisting a friction force between the friction part and the first rotating member to rotate relative to the first rotating member.Type: ApplicationFiled: December 4, 2019Publication date: March 4, 2021Applicant: CAL-COMP BIG DATA, INC.Inventors: Tung-Kai Tsai, Min-Chang Chi
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Patent number: 10824850Abstract: A body information analysis apparatus capable of indicating shading-areas includes: an image capturing module (12) for capturing an external image; a processor (10) electrically connected to the imager capturing module (12), stored multiple face types and multiple indicating processes respectively corresponding to each of the face types, wherein the processor (10) determines a face type of a face when the face is recognized in the external image, and executes one of the multiple indicating processes corresponding to the determined face type, so as to indicate shading-areas on the face; a mirror screen (11) for reflecting the face of a user; and, a display module (111) electrically connected to the processor (10) and arranged inside the mirror screen (11), for displaying the indicated shading-areas and the displayed shading-areas are overlapped with the face.Type: GrantFiled: November 21, 2019Date of Patent: November 3, 2020Assignee: CAL-COMP BIG DATA, INC.Inventors: Shyh-Yong Shen, Min-Chang Chi, Hui-Teng Lin
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Publication number: 20200305579Abstract: A personalized make-up information recommendation method adopted by a make-up assisting device is disclosed. The make-up assisting device records usage data and response message of a user while using the make-up assisting device, and analyzes user preference according to the usage data and the response message. When being triggered for executing a make-up information recommendation procedure, the make-up assisting device first retrieves a preference analyzing result of the user, and then accesses a storage unit (14) for obtaining make-up appearance information relative to the preference analyzing result of the user, and displays the make-up appearance information on a display unit (11) of the make-up assisting device (1). Therefore, the user may improve his/her make-up based on the displayed make-up appearance information.Type: ApplicationFiled: July 29, 2019Publication date: October 1, 2020Inventors: Ren-Jie YANG, Min-Chang CHI, Shyh-Yong SHEN
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Publication number: 20200307150Abstract: A garment is provided with at least a portion of cloth being made of a fabric structure. According to the present invention, the fabric structure comprises an outer fabric layer, an inner fabric layer and a central fabric layer. The outer fabric layer is knitted with nylon-contained fibers, and the inner fabric layer is knitted with PU-dominated sticky fibers. The central fabric layer is interposed between the outer fabric layer and the inner fabric layer and knitted with wave-like fibers. The wave-like fibers are intertwined with the nylon-contained fibers and the PU-dominated sticky fibers respectively. Therefore, the inner fabric layer is in close contact with the skin of the user to provide mild stickiness.Type: ApplicationFiled: March 27, 2020Publication date: October 1, 2020Inventor: Chang-Chi Wang
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Publication number: 20200300856Abstract: Disclosed herein are recombinant baculoviruses suitable for detecting the presence of arthropod-borne viruses in a biological sample of a test subject. The information derived from the detection may also be used to render a diagnosis on whether the test subject is infected with the arthropod-borne viruses or not, so that proper course of treatment may be assigned to the subject.Type: ApplicationFiled: June 4, 2020Publication date: September 24, 2020Applicant: Chung Yuan Christian UniversityInventors: Tzong-Yuan WU, Szu-Cheng KUO, Pei-Yun SHU, Chang-Chi LIN, Der-Jiang CHIAO, Ying-Ju CHEN, Yi-Ting LIN, Shu-Fen CHANG, Chien-Ling SU
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Patent number: 10783802Abstract: A lip gloss guide device including an image capturing unit, a processing unit and a display unit is provided to guide a user to draw a lip gloss. The image capturing unit captures a face image of the user, where the face image at least includes a lip of the user. The processing unit receives the face image, and acquires a plurality of lip feature points according to the face image. The processing unit performs calculation according to the lip feature points and a predetermined angle of an upper lip peak to obtain an upper lip gloss guide block. The display unit displays the face image and the upper lip gloss guide block, and guides a user to put on makeup to the upper lip gloss guide block. The disclosure further provides a lip gloss guide method adapted to the lip gloss guide device.Type: GrantFiled: June 15, 2017Date of Patent: September 22, 2020Assignee: CAL-COMP BIG DATA, INC.Inventors: Shyh-Yong Shen, Min-Chang Chi, Cheng-Hsuan Tsai
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Patent number: 10762799Abstract: A make-up assisting method implemented by a make-up assisting device is disclosed, wherein the make-up assisting device (1) has a reflecting mirror (11), an image capturing unit (13) and a display unit (12) arranged behind the reflecting mirror (11). The make-up assisting method includes steps of: reflecting user's face image (110) through the reflecting mirror (11) and controlling the image capturing unit (13) to execute an image recording procedure toward the user when the make-up assisting device (1) enters a make-up assisting mode; obtaining video content information (162) corresponding to user's current make-up procedure; displaying the video content information (162) on a first assisting interface (121) of the display unit (12), wherein the first assisting interface (121) does not overlap with the face image; and, terminating the image recording procedure to generate a recorded video (163) when the make-up procedure is completed.Type: GrantFiled: July 30, 2019Date of Patent: September 1, 2020Assignee: CAL-COMP BIG DATA, INC.Inventors: Ren-Jie Yang, Min-Chang Chi, Shyh-Yong Shen
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Patent number: D910062Type: GrantFiled: August 31, 2017Date of Patent: February 9, 2021Assignee: CAL-COMP BIG DATA, INC.Inventors: Shyh-Yong Shen, Min-Chang Chi, Chen-Lei Tsao, Hsiao-Ting Su