Patents by Inventor Chang Chi

Chang Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230215810
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE
  • Publication number: 20230207524
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.
    Type: Application
    Filed: February 28, 2023
    Publication date: June 29, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Chi LEE, Jung Jui KANG, Chiu-Wen LEE, Li Chieh CHEN
  • Patent number: 11594518
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: February 28, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chang Chi Lee, Jung Jui Kang, Chiu-Wen Lee, Li Chieh Chen
  • Publication number: 20220389414
    Abstract: Molecular computer techniques for solving a computational problem using an array of reaction sites, for example, droplets, are disclosed. The problem may be represented as a Hamiltonian in terms of problem variables and problem parameters. The reaction sites may have a physicochemical property mapping to discrete site states corresponding to possible values of the problem variables. In a purely molecular approach, the reaction sites have intra-site and inter-site couplings enforced thereon representing the problem parameters, and the array is allowed to evolve, subjected to the enforced couplings, to a final configuration conveying a solution to the problem. In a hybrid classical-molecular approach, an iterative procedure may be performed that involves feeding read-out site states into a digital computer, determining, based on the problem parameters, perturbations to be applied to the states, and allowing the array to evolve under the perturbations to a final configuration conveying a solution to the problem.
    Type: Application
    Filed: October 28, 2020
    Publication date: December 8, 2022
    Inventors: Alan ASPURU-GUZIK, Si Yue GUO, Tony Chang-Chi WU, Pascal Thomas FRIEDERICH, Randall Howard GOLDSMITH, Leroy CRONIN, Abhishek SHARMA, Yudong CAO, Nathan C. GIANNESCHI, Christopher James FORMAN
  • Publication number: 20220392871
    Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 8, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Chi LEE, Jung Jui KANG, Chiu-Wen LEE, Li Chieh CHEN
  • Patent number: 11426508
    Abstract: A snivel suction apparatus includes a suction mechanism and an air extraction mechanism. The air extraction mechanism is connected to the suction mechanism. The air extraction mechanism includes a pump, a piston, a communicating tube, a first check valve and a second check valve. The piston is arranged on the pump. One side of the communicating tube is connected to the pump. The other side of the communicating tube is connected to the suction mechanism. The first check valve is arranged in the pump and at one side of the communicating tube. The second check valve is arranged on the pump.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: August 30, 2022
    Assignee: TAI-SHINY TECHNOLOGY CO., LTD.
    Inventor: Chang-Chi Lee
  • Publication number: 20220196673
    Abstract: Disclosed herein are recombinant baculoviruses suitable for detecting the presence of arthropod-borne viruses in a biological sample of a test subject. The information derived from the detection may also be used to render a diagnosis on whether the test subject is infected with the arthropod-borne viruses or not, so that proper course of treatment may be assigned to the subject.
    Type: Application
    Filed: March 9, 2022
    Publication date: June 23, 2022
    Applicant: Chung Yuan Christian University
    Inventors: Tzong-Yuan WU, Szu-Cheng KUO, Pei-Yun SHU, Chang-Chi LIN, Der-Jiang CHIAO, Ying-Ju CHEN, Yi-Ting LIN, Shu-Fen CHANG, Chien-Ling SU
  • Patent number: 11127650
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: September 21, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chien Lin Chang Chien, Chiu-Wen Lee, Hung-Jung Tu, Chang Chi Lee, Chin-Li Kao
  • Publication number: 20210265273
    Abstract: A semiconductor device package includes a plurality of semiconductor chips and an interposer structure. The interposer structure has a plurality of tiers for accommodating the plurality of semiconductor chips. The interposer structure includes at least one conductive via connecting to a pad of the plurality of semiconductor chips.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 26, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien Lin CHANG CHIEN, Chiu-Wen LEE, Ian HU, Chang Chi LEE
  • Publication number: 20210265231
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.
    Type: Application
    Filed: February 24, 2020
    Publication date: August 26, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien Lin CHANG CHIEN, Chiu-Wen LEE, Hung-Jung TU, Chang Chi LEE, Chin-Li KAO
  • Patent number: 11057076
    Abstract: Methods, apparatuses, and system for performing at least one of error correction or error detection are described. In one embodiment, a radio frequency identification (RFID) tag receives a signal activating or interrogating the tag. The tag includes memory that stores data associated with the tag. The tag performs at least one of error detection or error correction on the stored data. The error detection includes detecting, by the tag, that one or more bits of the stored data are inflicted with an error. The error correction includes correcting the erroneous bit if the error affects less than a predetermined number of the bits of the stored data. The tag transmits the stored data to a reader in response to the detection or correction. The reader can analyze the stored data for additional information about the error or provide the stored data to another computing system that performs the analysis.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: July 6, 2021
    Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
    Inventors: Chang-Chi Liu, Steve Wang
  • Publication number: 20210086470
    Abstract: A spacer fabric having removable yarns is provided. The spacer fabric includes a first fabric layer, a second fabric layer, and a middle fabric layer. The first fabric layer is formed of general-purpose yarns and the removable yarns wherein the general-purpose yarns and the removable yarns are arranged to a weft-knitted loop construction according to a predetermined pattern The middle fabric layer is formed of wave-like fibers interlocked with the first fabric layer and the second fabric layer. The predetermined pattern appears on the first fabric layer after the removable yarns are removed.
    Type: Application
    Filed: September 18, 2020
    Publication date: March 25, 2021
    Inventors: Yi-Chen Lin, Chang-Chi Wang
  • Publication number: 20210062967
    Abstract: An electronic device includes a device main body, a stand, and a rotating structure including a base body, a first rotating member, and a second rotating member. The base body connected to the device main body has at least one elastic part abutting against the first rotating member. The first rotating member is rotatably connected to the base body along a first rotating axis and is suitable for resisting an elastic force of the elastic part to rotate relative to the base body. The second rotating member is connected to the stand, has at least one friction part, and is rotatably connected to the first rotating member along a second rotating axis. The friction part abuts against the first rotating member, and the second rotating member is suitable for resisting a friction force between the friction part and the first rotating member to rotate relative to the first rotating member.
    Type: Application
    Filed: December 4, 2019
    Publication date: March 4, 2021
    Applicant: CAL-COMP BIG DATA, INC.
    Inventors: Tung-Kai Tsai, Min-Chang Chi
  • Patent number: 10824850
    Abstract: A body information analysis apparatus capable of indicating shading-areas includes: an image capturing module (12) for capturing an external image; a processor (10) electrically connected to the imager capturing module (12), stored multiple face types and multiple indicating processes respectively corresponding to each of the face types, wherein the processor (10) determines a face type of a face when the face is recognized in the external image, and executes one of the multiple indicating processes corresponding to the determined face type, so as to indicate shading-areas on the face; a mirror screen (11) for reflecting the face of a user; and, a display module (111) electrically connected to the processor (10) and arranged inside the mirror screen (11), for displaying the indicated shading-areas and the displayed shading-areas are overlapped with the face.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: November 3, 2020
    Assignee: CAL-COMP BIG DATA, INC.
    Inventors: Shyh-Yong Shen, Min-Chang Chi, Hui-Teng Lin
  • Publication number: 20200305579
    Abstract: A personalized make-up information recommendation method adopted by a make-up assisting device is disclosed. The make-up assisting device records usage data and response message of a user while using the make-up assisting device, and analyzes user preference according to the usage data and the response message. When being triggered for executing a make-up information recommendation procedure, the make-up assisting device first retrieves a preference analyzing result of the user, and then accesses a storage unit (14) for obtaining make-up appearance information relative to the preference analyzing result of the user, and displays the make-up appearance information on a display unit (11) of the make-up assisting device (1). Therefore, the user may improve his/her make-up based on the displayed make-up appearance information.
    Type: Application
    Filed: July 29, 2019
    Publication date: October 1, 2020
    Inventors: Ren-Jie YANG, Min-Chang CHI, Shyh-Yong SHEN
  • Publication number: 20200307150
    Abstract: A garment is provided with at least a portion of cloth being made of a fabric structure. According to the present invention, the fabric structure comprises an outer fabric layer, an inner fabric layer and a central fabric layer. The outer fabric layer is knitted with nylon-contained fibers, and the inner fabric layer is knitted with PU-dominated sticky fibers. The central fabric layer is interposed between the outer fabric layer and the inner fabric layer and knitted with wave-like fibers. The wave-like fibers are intertwined with the nylon-contained fibers and the PU-dominated sticky fibers respectively. Therefore, the inner fabric layer is in close contact with the skin of the user to provide mild stickiness.
    Type: Application
    Filed: March 27, 2020
    Publication date: October 1, 2020
    Inventor: Chang-Chi Wang
  • Publication number: 20200300856
    Abstract: Disclosed herein are recombinant baculoviruses suitable for detecting the presence of arthropod-borne viruses in a biological sample of a test subject. The information derived from the detection may also be used to render a diagnosis on whether the test subject is infected with the arthropod-borne viruses or not, so that proper course of treatment may be assigned to the subject.
    Type: Application
    Filed: June 4, 2020
    Publication date: September 24, 2020
    Applicant: Chung Yuan Christian University
    Inventors: Tzong-Yuan WU, Szu-Cheng KUO, Pei-Yun SHU, Chang-Chi LIN, Der-Jiang CHIAO, Ying-Ju CHEN, Yi-Ting LIN, Shu-Fen CHANG, Chien-Ling SU
  • Patent number: 10783802
    Abstract: A lip gloss guide device including an image capturing unit, a processing unit and a display unit is provided to guide a user to draw a lip gloss. The image capturing unit captures a face image of the user, where the face image at least includes a lip of the user. The processing unit receives the face image, and acquires a plurality of lip feature points according to the face image. The processing unit performs calculation according to the lip feature points and a predetermined angle of an upper lip peak to obtain an upper lip gloss guide block. The display unit displays the face image and the upper lip gloss guide block, and guides a user to put on makeup to the upper lip gloss guide block. The disclosure further provides a lip gloss guide method adapted to the lip gloss guide device.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: September 22, 2020
    Assignee: CAL-COMP BIG DATA, INC.
    Inventors: Shyh-Yong Shen, Min-Chang Chi, Cheng-Hsuan Tsai
  • Patent number: 10762799
    Abstract: A make-up assisting method implemented by a make-up assisting device is disclosed, wherein the make-up assisting device (1) has a reflecting mirror (11), an image capturing unit (13) and a display unit (12) arranged behind the reflecting mirror (11). The make-up assisting method includes steps of: reflecting user's face image (110) through the reflecting mirror (11) and controlling the image capturing unit (13) to execute an image recording procedure toward the user when the make-up assisting device (1) enters a make-up assisting mode; obtaining video content information (162) corresponding to user's current make-up procedure; displaying the video content information (162) on a first assisting interface (121) of the display unit (12), wherein the first assisting interface (121) does not overlap with the face image; and, terminating the image recording procedure to generate a recorded video (163) when the make-up procedure is completed.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: September 1, 2020
    Assignee: CAL-COMP BIG DATA, INC.
    Inventors: Ren-Jie Yang, Min-Chang Chi, Shyh-Yong Shen
  • Patent number: D910062
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: February 9, 2021
    Assignee: CAL-COMP BIG DATA, INC.
    Inventors: Shyh-Yong Shen, Min-Chang Chi, Chen-Lei Tsao, Hsiao-Ting Su