Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) an epoxy resin, which has at least two epoxy functional groups per molecule; (B) a reactive flame retardant with (a DOPO functional group) in structure; and (C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.

Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.

Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) an epoxy resin, which has at least two epoxy functional groups per molecule; (B) a reactive flame retardant with (a DOPO functional group) in structure; and (C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin with at least two epoxy groups in each molecule, and a first hardener of the following formula (I): wherein R11, R12, R13, R14, R15, R16, and n are as defined in the specification.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.

Abstract: A speaker basin structure made from a thermosetting composite material such as TMC, BMC and SMC. The speaker basin structure has a front tray with larger diameter and a rear tray with smaller diameter. A conic bracket is interconnected between the front and rear trays. The front tray serves to support an outer circumference of a vibrational basin cover. An audio electromagnetic unit is mounted on the rear tray.