Patents by Inventor Chang Chin TSAI
Chang Chin TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11888081Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.Type: GrantFiled: April 9, 2021Date of Patent: January 30, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Yi Wu, Chang Chin Tsai, Bo-Yu Huang, Ying-Chung Chen
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Patent number: 11551963Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.Type: GrantFiled: February 14, 2020Date of Patent: January 10, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei Ling Ma, Ying-Chung Chen, Hsin-Ying Ho, Cheng-Ling Huang, Chang Chin Tsai
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Publication number: 20220416111Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.Type: ApplicationFiled: August 30, 2022Publication date: December 29, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang Chin TSAI, Yu-Che HUANG, Hsun-Wei CHAN
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Publication number: 20220328713Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.Type: ApplicationFiled: April 9, 2021Publication date: October 13, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Yi WU, Chang Chin TSAI, Bo-Yu HUANG, Ying-Chung CHEN
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Patent number: 11430906Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.Type: GrantFiled: July 22, 2019Date of Patent: August 30, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chang Chin Tsai, Yu-Che Huang, Hsun-Wei Chan
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Patent number: 11410915Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a carrier, a first encapsulant, and an interposer. The first encapsulant is on the carrier and defines a cavity. The interposer is disposed between the first encapsulant and the cavity. The first encapsulant covers a portion of the interposer.Type: GrantFiled: November 3, 2020Date of Patent: August 9, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yu-Che Huang, Chang Chin Tsai
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Publication number: 20220139812Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a carrier, a first encapsulant, and an interposer. The first encapsulant is on the carrier and defines a cavity. The interposer is disposed between the first encapsulant and the cavity. The first encapsulant covers a portion of the interposer.Type: ApplicationFiled: November 3, 2020Publication date: May 5, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Che HUANG, Chang Chin TSAI
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Publication number: 20210257246Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.Type: ApplicationFiled: February 14, 2020Publication date: August 19, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei Ling MA, Ying-Chung CHEN, Hsin-Ying HO, Cheng-Ling HUANG, Chang Chin TSAI
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Patent number: 11081413Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.Type: GrantFiled: February 21, 2019Date of Patent: August 3, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsin Lin Wu, Yu-Hsuan Tsai, Chang Chin Tsai, Lu-Ming Lai, Ching-Han Huang
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Patent number: 10770624Abstract: A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.Type: GrantFiled: September 14, 2018Date of Patent: September 8, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chang Chin Tsai, Chun-Han Chen, Hsin-Ying Ho
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Publication number: 20200035851Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.Type: ApplicationFiled: July 22, 2019Publication date: January 30, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang Chin TSAI, Yu-Che HUANG, Hsun-Wei CHAN
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Patent number: 10453760Abstract: A lid array panel includes multiple lids, where each lid includes an outer side wall. The lid array panel further includes a bridge section surrounding and attached to the outer side walls of the lids, where the lids are connected to each other by the bridge section, the lid array panel further includes a reinforcement attached to the bridge section. A package structure includes a carrier, a chip disposed on an upper surface of the carrier, a lid, a bridge section, and a reinforcement. The lid includes a top wall and an outer side wall, the top wall and the outer side wall of the lid together define a cavity, and the outer side wall of the lid is attached to the upper surface of the carrier. The bridge section surrounds, and is attached to, the outer side wall of the lid. The reinforcement is attached to the bridge section.Type: GrantFiled: April 8, 2016Date of Patent: October 22, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chang Chin Tsai, Hsun-Wei Chan
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Publication number: 20190267298Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.Type: ApplicationFiled: February 21, 2019Publication date: August 29, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin Lin WU, Yu-Hsuan TSAI, Chang Chin TSAI, Lu-Ming LAI, Ching-Han HUANG
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Publication number: 20190115505Abstract: A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.Type: ApplicationFiled: September 14, 2018Publication date: April 18, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang Chin TSAI, Chun-Han CHEN, Hsin-Ying HO
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Publication number: 20170294361Abstract: A lid array panel includes multiple lids, where each lid includes an outer side wall. The lid array panel further includes a bridge section surrounding and attached to the outer side walls of the lids, where the lids are connected to each other by the bridge section, the lid array panel further includes a reinforcement attached to the bridge section. A package structure includes a carrier, a chip disposed on an upper surface of the carrier, a lid, a bridge section, and a reinforcement. The lid includes a top wall and an outer side wall, the top wall and the outer side wall of the lid together define a cavity, and the outer side wall of the lid is attached to the upper surface of the carrier. The bridge section surrounds, and is attached to, the outer side wall of the lid. The reinforcement is attached to the bridge section.Type: ApplicationFiled: April 8, 2016Publication date: October 12, 2017Inventors: Chang Chin TSAI, Hsun-Wei CHAN