Patents by Inventor CHANG-CHUN WAN

CHANG-CHUN WAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10367040
    Abstract: A display panel, which an also function as a touch input device, includes a substrate and at least one TFT on the substrate. Such a multi-function panel also includes a force sensor sensitive to pressure of touches on the panel. The force sensor includes a first conductive layer and a second conductive layer on the substrate.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: July 30, 2019
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chang-Ting Lin, Chung-Wen Lai, Kuan-Hsien Jiang, Chang-Chun Wan, Kuo-Sheng Lee
  • Publication number: 20190027571
    Abstract: A method of providing a conducting structure over a substrate, which comprises: disposing a lower sub-layer over a substrate, the lower sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and zinc content in the bottom sub-layer substantially defines a first indium to zinc content ratio; performing a first hydrogen treatment over an exposed surface of the lower sub-layer for introducing hydrogen content therein; disposing a middle sub-layer over the lower sub-layer, the middle sub-layer comprising a metal material; disposing an upper sub-layer over the middle sub-layer, the upper sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and the zinc content in the upper sub-layer substantially defines a second indium to zinc content ratio smaller than the first indium to zinc content ratio; and patterning the multi-layered conductive structure to generate a composite lateral etch profile.
    Type: Application
    Filed: December 10, 2016
    Publication date: January 24, 2019
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HSIN-HUA LIN, PO-LI SHIH, YI-CHUN KAO, CHANG-CHUN WAN, WEI-CHIH CHANG, I-WEI WU
  • Patent number: 9806179
    Abstract: A method of providing a conducting structure over a substrate, which comprises: disposing a lower sub-layer over a substrate, the lower sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and zinc content in the bottom sub-layer substantially defines a first indium to zinc content ratio; performing a first hydrogen treatment over an exposed surface of the lower sub-layer for introducing hydrogen content therein; disposing a middle sub-layer over the lower sub-layer, the middle sub-layer comprising a metal material; disposing an upper sub-layer over the middle sub-layer, the upper sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and the zinc content in the upper sub-layer substantially defines a second indium to zinc content ratio smaller than the first indium to zinc content ratio; and patterning the multi-layered conductive structure to generate a composite lateral etch profile.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: October 31, 2017
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hsin-Hua Lin, Po-Li Shih, Yi-Chun Kao, Chang-Chun Wan, Wei-Chih Chang, I-Wei Wu
  • Publication number: 20170250229
    Abstract: A display panel, which an also function as a touch input device, includes a substrate and at least one TFT on the substrate. Such a multi-function panel also includes a force sensor sensitive to pressure of touches on the panel. The force sensor includes a first conductive layer and a second conductive layer on the substrate.
    Type: Application
    Filed: February 20, 2017
    Publication date: August 31, 2017
    Inventors: CHANG-TING LIN, CHUNG-WEN LAI, KUAN-HSIEN JIANG, CHANG-CHUN WAN, KUO-SHENG LEE
  • Publication number: 20170207325
    Abstract: A method of providing a conducting structure over a substrate, which comprises: disposing a lower sub-layer over a substrate, the lower sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and zinc content in the bottom sub-layer substantially defines a first indium to zinc content ratio; performing a first hydrogen treatment over an exposed surface of the lower sub-layer for introducing hydrogen content therein; disposing a middle sub-layer over the lower sub-layer, the middle sub-layer comprising a metal material; disposing an upper sub-layer over the middle sub-layer, the upper sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and the zinc content in the upper sub-layer substantially defines a second indium to zinc content ratio smaller than the first indium to zinc content ratio; and patterning the multi-layered conductive structure to generate a composite lateral etch profile.
    Type: Application
    Filed: March 15, 2016
    Publication date: July 20, 2017
    Inventors: HSIN-HUA LIN, PO-LI SHIH, YI-CHUN KAO, CHANG-CHUN WAN, WEI-CHIH CHANG, I-WEI WU