Patents by Inventor Chang Chun Yang
Chang Chun Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942169Abstract: A semiconductor memory device includes a first word line formed over a first active region. In some embodiments, a first metal line is disposed over and perpendicular to the first word line, where the first metal line is electrically connected to the first word line using a first conductive via, and where the first conductive via is disposed over the first active region. In some examples, the semiconductor memory device further includes a second metal line and a third metal line both parallel to the first metal line and disposed on opposing sides of the first metal line, where the second metal line is electrically connected to a source/drain region of the first active region using a second conductive via, and where the third metal line is electrically connected to the source/drain region of the first active region using a third conductive via.Type: GrantFiled: July 20, 2022Date of Patent: March 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsin-Wen Su, Kian-Long Lim, Wen-Chun Keng, Chang-Ta Yang, Shih-Hao Lin
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Patent number: 9828242Abstract: An accelerometer includes a measurement mass, a top cap silicon wafer and a bottom cap silicon wafer, both of which are coupled with the measurement mass. The measurement mass includes a support frame, a mass, and a plurality of resilient beams. The mass and the resilient beams are located within the support frame. The mass and the support frame are connected by several sets of the resilient beams, and each set comprises two resilient folding beams. The resilient folding beams are symmetrically provided with respect to the midline of the mass. A connection beam is provided in between each set of the resilient folding beams to connect the resilient folding beams together. Silicon wafers with electrodes are bonded on the top and bottom surfaces of the measurement mass, and form a capacitor with the measurement mass. The accelerometer has a large mode isolation ratio and is symmetrical in high order vibrational modes, which further decreases the noise of a MEMS chip.Type: GrantFiled: September 23, 2016Date of Patent: November 28, 2017Assignee: Chinese Academy of Sciences Institute of Geology and GeophysicsInventors: Du Li Yu, Lian Zhong Yu, Chang Chun Yang
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Patent number: 9557346Abstract: An accelerometer has E-shaped resilient beams to isolate stress and reduce deformation. A top cap silicon wafer and a bottom cap silicon wafer are both coupled with a measurement mass to form a capacitor. The measurement mass has a mass, range-of-motion stops, and resilient beams located within a support frame. The range-of-motion stops are coupled to the support frame by connection beams, and the mass is coupled with the range-of-motion stops by groups of E-shaped resilient beams. The ends of each resilient beam are connected to the range-of-motion stops, and the middle of each resilient beam is connected to the mass.Type: GrantFiled: September 18, 2015Date of Patent: January 31, 2017Assignee: Chinese Academy of Science Institute of Geology and GeophysicsInventors: Du Li Yu, Lian Zhong Yu, Chang Chun Yang
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Publication number: 20170008761Abstract: An accelerometer includes a measurement mass, a top cap silicon wafer and a bottom cap silicon wafer, both of which are coupled with the measurement mass. The measurement mass includes a support frame, a mass, and a plurality of resilient beams. The mass and the resilient beams are located within the support frame. The mass and the support frame are connected by several sets of the resilient beams, and each set comprises two resilient folding beams. The resilient folding beams are symmetrically provided with respect to the midline of the mass. A connection beam is provided in between each set of the resilient folding beams to connect the resilient folding beams together. Silicon wafers with electrodes are bonded on the top and bottom surfaces of the measurement mass, and form a capacitor with the measurement mass. The accelerometer has a large mode isolation ratio and is symmetrical in high order vibrational modes, which further decreases the noise of a MEMS chip.Type: ApplicationFiled: September 23, 2016Publication date: January 12, 2017Inventors: Du Li YU, Lian Zhong YU, Chang Chun YANG
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Patent number: 9476903Abstract: An accelerometer, comprises, a measurement mass, a top cap silicon wafer and a bottom cap silicon wafer, which both are coupled with the said measurement mass; the measurement mass comprises a support frame, a mass, and a plurality of resilient beams; the mass and the resilient beams are located within the support frame; the mass and the support frame are connected by several sets of the resilient beams, and each set comprises two resilient folding beams; the resilient folding beams are symmetrically provided with respect to the midline of the mass; a connection beam is provided in between each set of the resilient folding beams to connect the resilient folding beams together. Silicon wafers with electrodes are bonded on the top and bottom surfaces of the measurement mass; and forms a capacitor with the measurement mass. The accelerometer in the present invention has a large mode isolation ratio, and it is symmetrical in high order vibrational modes , which further decreases the noise of the MEMS chip.Type: GrantFiled: September 19, 2013Date of Patent: October 25, 2016Assignee: Chinese Academy of Sciences Institute of Geology and GeophysicsInventors: Du Li Yu, Lian Zhong Yu, Chang Chun Yang
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Publication number: 20160041199Abstract: An accelerometer has E-shaped resilient beams to isolate stress and reduce deformation. A top cap silicon wafer and a bottom cap silicon wafer are both coupled with a measurement mass to form a capacitor. The measurement mass has a mass, range-of-motion stops, and resilient beams located within a support frame. The range-of-motion stops are coupled to the support frame by connection beams, and the mass is coupled with the range-of-motion stops by groups of E-shaped resilient beams. The ends of each resilient beam are connected to the range-of-motion stops, and the middle of each resilient beam is connected to the mass.Type: ApplicationFiled: September 18, 2015Publication date: February 11, 2016Inventors: Du Li YU, Lian Zhong Yu, Chang Chun Yang
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Patent number: 9170271Abstract: An accelerometer has E-shaped resilient beams to isolate stress and reduce deformation. A top cap silicon wafer and a bottom cap silicon wafer are both coupled with a measurement mass to form a capacitor. The measurement mass has a mass, range-of-motion stops, and resilient beams located within a support frame. The range-of-motion stops are coupled to the support frame by connection beams, and the mass is coupled with the range-of-motion stops by groups of E-shaped resilient beams. The ends of each resilient beam are connected to the range-of-motion stops, and the middle of each resilient beam is connected to the mass.Type: GrantFiled: September 19, 2013Date of Patent: October 27, 2015Assignee: Chinese Academy of Sciences Institute of Geology and GeophysicsInventors: Du Li Yu, Lian Zhong Yu, Chang Chun Yang
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Publication number: 20140097508Abstract: An accelerometer has E-shaped resilient beams to isolate stress and reduce deformation. A top cap silicon wafer and a bottom cap silicon wafer are both coupled with a measurement mass to form a capacitor. The measurement mass has a mass, range-of-motion stops, and resilient beams located within a support frame. The range-of-motion stops are coupled to the support frame by connection beams, and the mass is coupled with the range-of-motion stops by groups of E-shaped resilient beams. The ends of each resilient beam are connected to the range-of-motion stops, and the middle of each resilient beam is connected to the mass.Type: ApplicationFiled: September 19, 2013Publication date: April 10, 2014Applicant: Chinese Academy of Sciences Institute of Geology and GeophysicsInventors: Du Li YU, Lian Zhong Yu, Chang Chun Yang
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Publication number: 20140069191Abstract: An accelerometer, comprises, a measurement mass, a top cap silicon wafer and a bottom cap silicon wafer, which both are coupled with the said measurement mass; the measurement mass comprises a support frame, a mass, and a plurality of resilient beams; the mass and the resilient beams are located within the support frame; the mass and the support frame are connected by several sets of the resilient beams, and each set comprises two resilient folding beams; the resilient folding beams are symmetrically provided with respect to the midline of the mass; a connection beam is provided in between each set of the resilient folding beams to connect the resilient folding beams together. Silicon wafers with electrodes are bonded on the top and bottom surfaces of the measurement mass; and forms a capacitor with the measurement mass. The accelerometer in the present invention has a large mode isolation ratio, and it is symmetrical in high order vibrational modes , which further decreases the noise of the MEMS chip.Type: ApplicationFiled: September 19, 2013Publication date: March 13, 2014Applicant: Chinese Academy of Sciences Institute of Geology and GeophysicsInventors: Du Li YU, Lian Zhong Yu, Chang Chun Yang