Patents by Inventor Chang-Fa LIN

Chang-Fa LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for fabricating semiconductor device
    Patent number: 10649336
    Abstract: A system for fabricating a semiconductor device includes a first supplier, a second supplier, a mixer, and an applier. The first supplier is configured to supply a developer solution having a first chemical. The second supplier is configured to supply the second chemical to the mixer. The mixer is configured to mix the developer solution with a second chemical, in which the second chemical is configured to form a plurality of bubbles in the developer solution. The applier is configured to apply the developer solution mixed with the bubbles onto a photoresist layer formed on a substrate, in which the photoresist layer has an exposed region, and the first chemical is configured to dissolve the exposed region of the photoresist layer through a chemical reaction.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: May 12, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jun-Yih Yu, Chang-Fa Lin, Ching-Hung Cheng, Yi-Chuan Lo, Ming-Hsuan Chuang
  • METHOD AND SYSTEM FOR FABRICATING SEMICONDUCTOR DEVICE
    Publication number: 20170092497
    Abstract: A system for fabricating a semiconductor device includes a first supplier, a second supplier, a mixer, and an applier. The first supplier is configured to supply a developer solution having a first chemical. The second supplier is configured to supply the second chemical to the mixer. The mixer is configured to mix the developer solution with a second chemical, in which the second chemical is configured to form a plurality of bubbles in the developer solution. The applier is configured to apply the developer solution mixed with the bubbles onto a photoresist layer formed on a substrate, in which the photoresist layer has an exposed region, and the first chemical is configured to dissolve the exposed region of the photoresist layer through a chemical reaction.
    Type: Application
    Filed: September 30, 2015
    Publication date: March 30, 2017
    Inventors: Jun-Yih YU, Chang-Fa LIN, Ching-Hung CHENG, Yi-Chuan LO, Ming-Hsuan CHUANG