Abstract: Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at least a concave portion filled with a filling material to prevent solder material from permeating along surfaces of the insulating protection layer and the electric contact pads, thereby eliminating the phenomenon of solder extrusion. Thus, bridging in the substrate structure can be eliminated even when the bump pitch between two adjacent electrical contact pads is small. As a result, short circuits can be prevented, and production yield can be increased.

Abstract: The present disclosure provides a battery pack including a housing, wherein the housing has a bottom portion and side walls extending upward around a periphery of the bottom portion; an upper portion opening is formed at top ends of the side walls extending upward; an upper cover is mounted on the upper portion opening of the housing; and the battery pack comprises: multiple flat battery cells; and a first end plate and a second end plate, wherein when the multiple battery cells are sequentially arranged and mounted into the housing from the upper portion opening, the first end plate and the second end plate are located at two end sides of the sequentially arranged multiple battery cells to laterally fix the sequentially arranged multiple battery cells. The two end plates may absorb deformation of the battery cell while expanding.

Abstract: A keyboard device includes a key module and a backlight module. The key module includes a supporting plate and plural key structures. The key structures are installed on the supporting plate. The backlight module includes a light guide plate, a light-sheltering layer, a reflecting layer, a light-emitting unit, a base plate and an opaque structure. The light guide plate includes a second opening. The second opening includes a lateral wall. The light-sheltering layer is located over the light guide plate. The light-sheltering layer includes a third opening. The reflecting layer is located under the light guide plate. The reflecting layer includes a fourth opening. The light-emitting unit emits a light beam into the light guide plate. The opaque structure is arranged between the light-sheltering layer and the reflecting layer. The opaque structure is located beside the lateral wall of the light guide plate.

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

Abstract: A method includes a step of obtaining plural pieces of training data each of which includes a different radiographic image of a bone and each of which has a label indicating one of an overt fracture, an occult fracture and no fracture, a step of using the plural pieces of training data to pre-train a deep convolutional network (DCN) model to obtain a preliminary DCN model, a step of determining a subset of the plural pieces of training data by at least excluding any piece of training data that has a label indicating occult fracture, and a step of using the subset to train the preliminary DCN model to obtain a first DCN model.

Abstract: An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer. Therefore, through the thermally conductive pillar, heat generated during operations of the first electronic element and the second electronic element can be quickly dissipated to an external environment and would not accumulate.

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.

Abstract: The instant disclosure discloses an antibody or antigen-binding fragment thereof binding to Porcine Reproductive and Respiratory Syndrome Virus (PRRSV), and uses of such antibody or antigen-binding fragment thereof to create immunoassay methods or devices for PRRSV detection.

Abstract: The instant disclosure discloses an antibody or antigen-binding fragment thereof binding to Porcine Reproductive and Respiratory Syndrome Virus (PRRSV), and uses of such antibody or antigen-binding fragment thereof to create immunoassay methods or devices for PRRSV detection.

Abstract: The present disclosure provides a method for preparing a biochip. The method includes steps of coating a chip with a first solution of biotin to form a biotin-coated chip, wherein the biotin in the first solution is in a first concentration ranging from 0.1 to 1 ?g/ml; providing the biotin-coated chip with a second solution of avidin to form an avidin/biotin-coated chip, wherein the avidin in the second solution is in a second concentration ranging from 0.1 to 100 ?g/ml; and providing the avidin/biotin-coated chip with a third solution of a biotinylated probe to form the biochip, wherein the biotinylated probed in the third solution is in a third concentration ranging from 1 to 3 ?g/ml.

Abstract: The instant disclosure discloses an antibody or antigen-binding fragment thereof binding to Porcine Reproductive and Respiratory Syndrome Virus (PRRSV), and uses of such antibody or antigen-binding fragment thereof to create immunoassay methods or devices for PRRSV detection.

Abstract: An electronic package is provided, in which a first electronic element and a second electronic element are disposed on a first side of a circuit structure and a second side of the circuit structure, respectively, where a first metal layer is formed between the first side of the circuit structure and the first electronic element, a second metal layer is formed on a surface of the second electronic element, and at least one thermally conductive pillar is disposed on the second side of the circuit structure and extends into the circuit structure to thermally conduct the first metal layer and the second metal layer. Therefore, through the thermally conductive pillar, heat generated during operations of the first electronic element and the second electronic element can be quickly dissipated to an external environment and would not accumulate.

Abstract: A method for categorizing and adjusting an orientation of a clinical image is implemented using a system that includes a categorization module and a plurality of orientation modules. The method includes: in response to receipt of the clinical image, performing, by the categorization module, a categorization operation so as to categorize the clinical image into one of a plurality of predetermined categories; transmitting the clinical image to a corresponding one of the plurality of orientation modules based on a result of the categorization operation; and performing, by the corresponding one of the plurality of orientation modules, an orientation adjusting operation for adjusting the orientation of the clinical image. For a clinical image that is a facial image and for a clinical image that is an intra-oral image, different orientation adjusting operations may be performed, so as to generate an adjusted image that is properly oriented.

Abstract: An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.

Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.

Abstract: An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier and an antenna element. The carrier includes a plurality of pads and has a surface exposing the pads. The antenna element is disposed above the pads. A lateral surface of one of the pads is farther from a central axis of the antenna element substantially perpendicular to the surface than from a lateral surface of the antenna element.