Abstract: The embodiments provide a process for preparing a polishing sheet, a polishing pad using the same, and a process for preparing a semiconductor device using the same. The process for preparing a polishing sheet comprises forming a pattern on the surface of a polymer sheet and winding the patterned polymer sheet to form a wound roll in a cylindrical shape. Thus, there are great advantages in that it is possible to control the size and distribution ratio of a fine and uniform pattern at a desired location in an economical and efficient way and to freely design the type, size, structure, physical properties, and the like of the polishing sheet according to the purpose, whereby the application field can be expanded, and a bulk structure can be manufactured.

Abstract: The present invention discloses a polishing pad comprising a laminate composed of a polishing layer, an adhesive layer, and a cushion layer, wherein the cushion layer has a water absorption rate of 100% or less, and a process for manufacturing the polishing pad.

Abstract: Through a combination of a multi-stage adhesive layer structure, a compressed region structure, and a barrier layer, the polishing pad according to the present disclosure can minimize the leakage of liquid components flowing through the interface between the window and the polishing pad and realize excellent long-term durability without leakage even when substantially applied to a polishing process for a long time. In the method for manufacturing a semiconductor device, the specific structure having the window of the polishing pad applied thereto as described above is combined with the optimal process conditions related to the polishing process so that the process efficiency can be further improved, and excellent quality can be secured in terms of polishing rate, polishing flatness, defect prevention, and the like.

Abstract: The present invention relates to a gas barrier film, a flexible substrate including the same, and a manufacturing method thereof. More specifically, a barrier film of the present invention relates to a first polymer layer, a gas barrier film including a graphene layer formed on the first polymer layer, a flexible substrate including the same, and a manufacturing method thereof.

Abstract: A polycarbonate resin composition for a flame retardant film includes 100 parts by weight of a polycarbonate resin, about 0.01 to about 10 parts by weight of a silicon compound, about 0.01 to about 1.5 parts by weight of an organic sulfonic acid metal salt having an average particle diameter of about 100 to about 400 ?m, and about 0.01 to about 1 part by weight of a polyfluoroethylene resin.

Abstract: A polycarbonate resin composition for a flame retardant film includes 100 parts by weight of a polycarbonate resin, about 0.01 to about 10 parts by weight of a silicon compound, about 0.01 to about 1.5 parts by weight of an organic sulfonic acid metal salt having an average particle diameter of about 100 to about 400 ?m, and about 0.01 to about 1 part by weight of a polyfluoroethylene resin.

Abstract: A light diffusion film includes a thermoplastic resin, a surface of the light diffusion film has a roughness (Ra) of about 0.5 to about 3 ?m and a height distribution index (HDI) of about 3 to about 8 ?m, and the light diffusion film has a retardation of not more than about 25 nm.

Abstract: A light diffusion film includes a thermoplastic resin, wherein a surface of the light diffusion film has an embossed pattern thereon, and the surface of the light diffusion film having the embossed pattern has a surface roughness (Ra) of about 0.5 ?m to about 3 ?m and a height distribution index (HDI) of about 3 ?m to about 8 ?m.

Abstract: A light diffusion film includes a thermoplastic resin, a surface of the light diffusion film has a roughness (Ra) of about 0.5 to about 3 ?m and a height distribution index (HDI) of about 3 to about 8 ?m, and the light diffusion film has a retardation of not more than about 25 nm.