Abstract: An exhaust gas dilution device according to an exemplary embodiment of the present invention includes a head part, ejector unit, a nozzle part, and a dilution part. The head part has a space part into which an exhaust gas flows and a through-hole formed through the center axis direction to be connected to the space part. The ejector unit is coupled to the head part and has a first discharge hole formed passing through the center axis direction to be connected to the through-hole and connected to a first inlet to which primary dilution air is supplied. The nozzle part is inserted into a first discharge hole through the through-hole and has a second discharge hole that penetrates in the center axis direction so that the exhaust gas flowed into the space part is sucked and ejected into the first discharge hole as the primary dilution air moves through the first discharge hole.

Abstract: An exhaust gas dilution device according to an exemplary embodiment of the present invention includes a head part, ejector unit, a nozzle part, and a dilution part. The head part has a space part into which an exhaust gas flows and a through-hole formed through the center axis direction to be connected to the space part. The ejector unit is coupled to the head part and has a first discharge hole formed passing through the center axis direction to be connected to the through-hole and connected to a first inlet to which primary dilution air is supplied. The nozzle part is inserted into a first discharge hole through the through-hole and has a second discharge hole that penetrates in the center axis direction so that the exhaust gas flowed into the space part is sucked and ejected into the first discharge hole as the primary dilution air moves through the first discharge hole.

Abstract: A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including a pressing portion to adsorb and press a substrate, a first partition on the pressing portion and extending from an edge of the pressing portion along a height direction, a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, and a second horizontal extending portion from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion expanding by pneumatic pressure.

Abstract: A polishing head of a chemical mechanical polishing apparatus includes a housing moving up and down, a base assembly connected to a bottom of the housing to support the housing, a membrane on a bottom of the base assembly and a retainer ring surrounding the membrane and connected to the bottom of the base assembly, the membrane including a pressing portion to adsorb and press a substrate, a first partition on the pressing portion and extending from an edge of the pressing portion along a height direction, a first horizontal extending portion extending from an upper end portion of the first partition toward a center of the membrane, and a second horizontal extending portion from the upper end portion of the first partition toward the center of the membrane, the second horizontal extending portion being above the first horizontal extending portion and including a curved portion expanding by pneumatic pressure.